Studio Technology Co., Ltd.
| Supply Ability | 100,000 pieces/month |
| Packaging Details | ESD Protective Packaging/Customization |
| Delivery Time | 5-25 working days(varies by product) |
| Payment Terms | T/T |
| Place of Origin | China |
View Detail Information
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Product Specification
| Supply Ability | 100,000 pieces/month | Packaging Details | ESD Protective Packaging/Customization |
| Delivery Time | 5-25 working days(varies by product) | Payment Terms | T/T |
| Place of Origin | China | ||
| High Light | Turnkey BGA Assembly ，One Stop SMT Solutions | ||
Overview
Managing separate vendors for component sourcing, SMT assembly, BGA process optimization, and X-Ray inspection creates complexity and quality gaps. Studio Electronics simplifies BGA production with Turnkey BGA Assembly—one-stop SMT solutions covering every stage. As a premier provider of PCB assembly in China, we manage your entire BGA project: component procurement, SMT assembly, specialized BGA process control, 100% X-Ray inspection, and final shipping. Our 12 automated SMT lines and advanced inspection systems deliver reliable BGA assemblies with complete accountability.
One-Stop BGA Service – Everything Under One Roof
| Service Component | Studio Capability | Quality Assurance |
|---|---|---|
| Component Sourcing | Authorized distributors; full BOM procurement | Incoming inspection; LCR testing; traceability |
| SMT Assembly | 12 automated SMT lines; ±25μm accuracy | SPI; AOI; real-time process monitoring |
| BGA Placement | Fine-pitch to large BGAs; vision alignment | ±25μm accuracy; optimized placement parameters |
| Controlled Reflow | Custom profiles per BGA type; nitrogen option | Thermal profile validation per BGA package |
| X-Ray Inspection | 2D and 3D X-Ray—100% coverage | Void analysis; automated void calculation |
| Testing | ICT; Flying Probe; FCT—100% coverage | Documented results per board serial number |
| Final Assembly | Box-build; wiring; enclosure assembly | Functional verification; visual inspection |
| Shipping | Anti-static packaging; customs clearance | Packaging verification; tracking; on-time delivery |
Our Turnkey BGA Assembly Process
Stage 1: Component Sourcing – Components procured through authorized distributors. For low volume PCB assembly, small-quantity procurement supported.
Stage 2: Engineering Review – BGA design review; reflow profile optimization; stencil design.
Stage 3: SMT Assembly – 12 SMT lines with ±25μm accuracy. BGA placement with vision alignment.
Stage 4: Controlled Reflow – Custom profiles per BGA type. Nitrogen reflow available. Real-time monitoring.
Stage 5: X-Ray Inspection – 100% coverage; 2D and 3D X-Ray; void analysis; automated void calculation.
Stage 6: Testing & Final Assembly – ICT; Flying Probe; FCT. Careful handling; anti-static packaging; global logistics.
Why One-Stop Turnkey BGA Assembly Matters
Simplified Management – One supplier; one point of contact; one invoice
Consistent Quality – Unified standards across all stages
Reduced Lead Times – Eliminate vendor handoff delays
Full Traceability – Complete documentation from component to finished assembly
Low Volume Support – Competitive pricing for low volume PCB assembly
Studio delivers Turnkey BGA Assembly—one-stop SMT solutions with 100% X-Ray verification on every BGA board.
Company Details
Business Type:
Manufacturer
Year Established:
2003
Total Annual:
30000000-40000000
Employee Number:
300~500
Ecer Certification：
Verified Supplier
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