| Supply Ability | 100,000 pieces per month |
| Packaging Details | ESD Protective Packaging/Customization |
| Delivery Time | 5-25 working days(varies by product) |
| Payment Terms | T/T |
| Place of Origin | China |
View Detail Information
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Product Specification
| Supply Ability | 100,000 pieces per month | Packaging Details | ESD Protective Packaging/Customization |
| Delivery Time | 5-25 working days(varies by product) | Payment Terms | T/T |
| Place of Origin | China | ||
| High Light | Express BGA Assembly ,Fast PCB Assembly Service | ||
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When your project demands fast BGA assembly without compromising quality, Studio Electronics delivers Express BGA Assembly with fast PCB assembly service. As a responsive provider of PCB assembly in China, we combine specialized BGA process expertise, 12 automated SMT lines, and advanced X-Ray inspection to deliver reliable BGA assemblies fast. Our complete turnkey service covers component procurement through final shipping, with 100% X-Ray verification on every board—even for express orders.
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| Service Element | Express Capability | Quality Assurance |
|---|---|---|
| Component Sourcing | Rapid procurement; Smart Material Rack allocation | Incoming inspection; traceability |
| BGA Placement | 12 SMT lines with priority scheduling | ±25μm accuracy; vision alignment |
| Reflow | Pre-validated profiles; rapid profile development | Controlled reflow; nitrogen option |
| X-Ray Inspection | 2D and 3D X-Ray; priority inspection | 100% coverage; void analysis |
| Testing | Flying Probe; FCT—rapid testing | Electrical verification; functional testing |
| Shipping | Expedited shipping; global logistics | Anti-static packaging; tracking |
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Stage 1: Component Sourcing
Components sourced through authorized distributors. For low volume PCB assembly, small-quantity procurement supported. Smart Material Rack enables rapid component allocation.
Stage 2: SMT Assembly
12 SMT lines with priority scheduling. Quick-changeover capability. BGA placement with ±25μm accuracy.
Stage 3: Controlled Reflow
Pre-validated reflow profiles. Rapid profile development for new BGA packages. Nitrogen reflow available.
Stage 4: X-Ray Inspection (100% Coverage)
Priority X-Ray inspection scheduling. 2D X-Ray for ball alignment and bridging; 3D X-Ray for void analysis. Rapid void calculation.
Stage 5: Testing & Final Assembly
Flying Probe testing; FCT for functional verification. Careful handling; anti-static packaging; expedited shipping with tracking.
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Speed – Fast turnaround for time-sensitive projects
Quality – 100% X-Ray verification on every board
Expertise – Specialized BGA process knowledge
Complete Service – Sourcing through assembly and shipping—one point of contact
Low Volume Support – Express service for low volume PCB assembly and prototypes
Studio delivers Express BGA Assembly—fast PCB assembly service with 100% X-Ray verification on every BGA board.
Company Details
Business Type:
Manufacturer
Year Established:
2003
Total Annual:
30000000-40000000
Employee Number:
300~500
Ecer Certification:
Verified Supplier
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