Studio Technology Co., Ltd.
| Packaging Details | ESD Protective Packaging/Customization |
| Delivery Time | 5-25 working days(varies by product) |
| Supply Ability | 100,000 pieces per month |
| Payment Terms | T/T |
| Place of Origin | China |
View Detail Information
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Product Specification
| Packaging Details | ESD Protective Packaging/Customization | Delivery Time | 5-25 working days(varies by product) |
| Supply Ability | 100,000 pieces per month | Payment Terms | T/T |
| Place of Origin | China | ||
| High Light | small bga assembly ，small bga pcb assembly | ||
Overview
Many EMS providers impose minimum order quantities on BGA assembly—making prototyping and pilot runs costly. Studio Electronics offers Small-Batch BGA Assembly with no MOQ required, supporting low-volume orders with the same quality standards as full production. As a flexible provider of PCB assembly in China, our 12 automated SMT lines, quick-changeover capability, and advanced X-Ray inspection deliver reliable BGA assemblies for any quantity. Our complete turnkey service covers component procurement through final shipping.
Small-Batch BGA Assembly – No MOQ
| Sourcing Option | Studio Capability | Quality Assurance |
|---|---|---|
| Prototype Quantities | 1-10 boards | Full X-Ray inspection; void analysis |
| Pilot Run Quantities | 10-50 boards | 100% X-Ray; ICT; FCT |
| Small Batch Quantities | 50-250 boards | Full quality verification; documented results |
| Any Quantity | No MOQ; any quantity | Same quality standards as volume production |
Our Small-Batch BGA Assembly Process
Stage 1: Component Sourcing
Components sourced through authorized distributors. For low volume PCB assembly, small-quantity procurement supported with competitive pricing.
Stage 2: SMT Assembly
12 SMT lines with quick-changeover. BGA placement with ±25μm accuracy. Vision alignment ensures accurate registration.
Stage 3: Controlled Reflow
Custom reflow profiles optimized per BGA type. Nitrogen reflow available. Real-time temperature monitoring.
Stage 4: X-Ray Inspection (100% Coverage)
2D and 3D X-Ray on every BGA board. Void analysis; automated void calculation. Inspection results per board serial number.
Stage 5: Testing & Final Assembly
Flying Probe testing; FCT for functional verification. Careful handling; anti-static packaging; global logistics.
Why No MOQ BGA Assembly Matters
Low-Risk Prototyping – Test BGA designs without large inventory commitment
Design Iteration – Make changes between small batches; optimize designs
Cost Control – Order exactly what you need; no forced inventory
Flexible Scaling – Start small; scale when ready
Same Quality Standards – 100% X-Ray regardless of quantity
Studio delivers Small-Batch BGA Assembly—no MOQ required, 100% X-Ray verification on every BGA board.
Company Details
Business Type:
Manufacturer
Year Established:
2003
Total Annual:
30000000-40000000
Employee Number:
300~500
Ecer Certification：
Verified Supplier
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