Studio Technology Co., Ltd.
| Supply Ability | 100,000 pieces per month |
| Packaging Details | ESD Protective Packaging/Customization |
| Delivery Time | 5-25 working days(varies by product) |
| Payment Terms | T/T |
| Place of Origin | China |
View Detail Information
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Product Specification
| Supply Ability | 100,000 pieces per month | Packaging Details | ESD Protective Packaging/Customization |
| Delivery Time | 5-25 working days(varies by product) | Payment Terms | T/T |
| Place of Origin | China | ||
| High Light | custom bga assembly ，custom bga pcb assembly | ||
Overview
Every BGA assembly project is unique—different BGA packages, board constructions, and quantity requirements. Studio Electronics offers Custom BGA Assembly—any BGA type, any specification, any quantity. As a specialized provider of PCB assembly in China, we handle BGA assemblies of all complexities, with custom process optimization and 100% X-Ray verification for every order. Our 12 automated SMT lines and advanced inspection deliver reliable custom BGA assemblies for any application.
Custom BGA Assembly – Design Flexibility
| Customization Dimension | Studio Capability |
|---|---|
| BGA Type | Fine-pitch; large; micro; PBGA; CBGA; CCGA |
| Package Size | 5mm to 50mm+ BGA packages |
| Ball Pitch | 0.3mm to 1.0mm |
| Board Complexity | Single BGA to multiple BGA configurations |
| Quantity | 1-10,000+ boards; no MOQ |
| Surface Finishes | ENIG; HASL; OSP; Immersion Silver; Gold Plating |
Our Custom BGA Assembly Process
Stage 1: Design Review & Engineering Support
Our engineering team reviews your BGA design and provides DFM feedback. Reflow profile optimization and stencil design.
Stage 2: Component Sourcing
Components sourced through authorized distributors per your BOM. For low volume PCB assembly, small-quantity procurement supported.
Stage 3: SMT Assembly
12 SMT lines with custom placement program. BGA placement with ±25μm accuracy. Vision alignment ensures accurate registration.
Stage 4: Controlled Reflow
Custom reflow profiles validated per BGA type. Nitrogen reflow available. Real-time temperature monitoring.
Stage 5: X-Ray Inspection (100% Coverage)
2D and 3D X-Ray on every BGA board. Void analysis; automated void calculation. Inspection results per board serial number.
Stage 6: Testing & Final Assembly
ICT; Flying Probe; FCT. Reliability lab testing available. Careful handling; anti-static packaging; global logistics.
Why Choose Studio for Custom BGA Assembly?
Design Flexibility – Any BGA type; any complexity; any quantity
BGA Expertise – Process optimization per BGA package
100% X-Ray Verification – Every BGA board inspected
Complete Service – Sourcing through assembly and shipping—one point of contact
Low Volume Support – Competitive pricing for low volume PCB assembly
Studio delivers Custom BGA Assembly—any quantity welcome, 100% X-Ray verification on every BGA board.
Company Details
Business Type:
Manufacturer
Year Established:
2003
Total Annual:
30000000-40000000
Employee Number:
300~500
Ecer Certification：
Verified Supplier
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