Studio Technology Co., Ltd.
| Supply Ability | 100,000 pieces per month |
| Packaging Details | ESD Protective Packaging/Customization |
| Delivery Time | 5-25 working days(varies by product) |
| Payment Terms | T/T |
| Place of Origin | China |
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Product Specification
| Supply Ability | 100,000 pieces per month | Packaging Details | ESD Protective Packaging/Customization |
| Delivery Time | 5-25 working days(varies by product) | Payment Terms | T/T |
| Place of Origin | China | ||
| High Light | End-to-End BGA Assembly ，PCB to Finished Board | ||
End-to-end BGA assembly—from bare PCB to finished, tested, and shipped board—simplified through one integrated service. Studio Electronics offers End-to-End BGA Assembly supporting your project from PCB fabrication through component procurement, SMT assembly, BGA process optimization, X-Ray inspection, and final shipping. As a premier provider of PCB assembly in China, we combine 12 automated SMT lines, specialized BGA expertise, and advanced 3D X-Ray inspection to deliver reliable BGA assemblies with complete documentation.
| Service Stage | Studio Capability | Quality Check |
|---|---|---|
| PCB Fabrication | In-house or customer-provided | Material certification; controlled processes |
| Component Sourcing | Authorized distributors; full BOM procurement | Incoming inspection; LCR testing; traceability |
| SMT Assembly | 12 SMT lines; ±25μm accuracy | SPI; AOI; real-time monitoring |
| BGA Placement | All BGA types; vision alignment | ±25μm accuracy; optimized placement |
| Controlled Reflow | Custom profiles per BGA; nitrogen option | Profile validation; thermal monitoring |
| X-Ray Inspection | 2D and 3D X-Ray—100% coverage | Void analysis; automated calculation |
| Testing | ICT; Flying Probe; FCT—100% coverage | Documented results per board serial number |
| Shipping | Anti-static packaging; global logistics | Packaging verification; tracking; delivery |
Stage 1: PCB Fabrication – In-house PCB fabrication (2-20+ layers; rigid/flex; multiple finishes).
Stage 2: Component Sourcing – Components procured through authorized distributors. For low volume PCB assembly, small-quantity procurement supported.
Stage 3: Engineering Review – BGA design review; reflow profile optimization; stencil design.
Stage 4: SMT & BGA Assembly – 12 SMT lines with ±25μm accuracy. BGA placement with vision alignment. Controlled reflow. Nitrogen reflow available.
Stage 5: X-Ray Inspection – 100% coverage; 2D and 3D X-Ray; void analysis; automated void calculation.
Stage 6: Testing & Final Assembly – ICT; Flying Probe; FCT. Careful handling; anti-static packaging; global logistics.
Complete Accountability – One supplier for your entire project
Specialized Expertise – BGA process optimization and X-Ray verification
Quality Assurance – 100% X-Ray inspection; full traceability
Time Efficiency – No handoff delays between vendors
Cost Effectiveness – Eliminate multiple vendor markups
Studio delivers End-to-End BGA Assembly—PCB to finished board with 100% X-Ray verification on every BGA.
Company Details
Business Type:
Manufacturer
Year Established:
2003
Total Annual:
30000000-40000000
Employee Number:
300~500
Ecer Certification：
Verified Supplier
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