Studio Technology Co., Ltd.
| Supply Ability | 100,000 pieces/month |
| Packaging Details | ESD Protective Packaging/Customization |
| Delivery Time | 5-25 working days(varies by product) |
| Payment Terms | T/T |
| Place of Origin | China |
View Detail Information
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Product Specification
| Supply Ability | 100,000 pieces/month | Packaging Details | ESD Protective Packaging/Customization |
| Delivery Time | 5-25 working days(varies by product) | Payment Terms | T/T |
| Place of Origin | China | ||
| High Light | pcb smt assembly small ，high density bga assembly ，small bga assembly | ||
Overview
High-density BGA assemblies—multiple BGAs on a single board, fine-pitch packages, and complex PCB layouts—demand exceptional process control. Studio Electronics offers High-Density BGA Assembly with specialized capability for complex, multi-BGA boards. As a premier provider of PCB assembly in China, our 12 automated SMT lines, advanced X-Ray inspection systems, and experienced process engineering team deliver reliable assemblies for the most complex BGA configurations. From component procurement through final shipping, our complete turnkey service ensures every BGA is placed accurately, soldered reliably, and verified with 100% X-Ray inspection.
| Capability | Specification | Quality Control |
|---|---|---|
| Multiple BGAs per Board | Up to 10+ BGAs per assembly | 100% X-Ray on every board; individual BGA analysis |
| Mixed BGA Types | Fine-pitch, large, micro, various package types | Optimized reflow per BGA type; customized inspection |
| BGA + Other Components | Combined with QFN, QFP, 01005 passives | Comprehensive SMT capability; AOI for visible components |
| Board Size | Small to large format PCBs | 12 SMT lines with flexible board handling |
| Package Types | PBGA, CBGA, CCGA, Micro BGA | Process optimization per package; X-Ray verification |
Stage 1: Component Sourcing & Engineering Review
Components sourced through authorized distributors. For low volume PCB assembly, small-quantity procurement supported. Engineering review identifies BGA type variations and recommends process parameters.
Stage 2: Solder Paste Application
Precision stencil design with optimized aperture geometry. 3D SPI ensures consistent paste deposition across all BGA pads.
Stage 3: SMT Assembly (Multiple BGAs)
12 automated SMT lines with ±25μm accuracy. Sequential or simultaneous BGA placement optimized for board layout. Vision systems ensure precise alignment.
Stage 4: Controlled Reflow
Reflow profiles optimized for multiple BGA types on the same board. Thermal balancing ensures consistent soldering across all BGAs. Nitrogen reflow available.
Stage 5: 100% X-Ray Inspection
Comprehensive X-Ray verification per BGA: 2D imaging for ball alignment and bridging; 3D void analysis with automated void calculation. Inspection records per board serial number.
Stage 6: Quality Verification
ICT and Flying Probe testing; FCT for functional verification; AOI for visible components. Reliability lab testing available.
Stage 7: Final Assembly & Shipping
Careful handling; anti-static packaging; global logistics.
Multi-BGA Expertise – Experience with complex, high-density BGA configurations
100% X-Ray Inspection – Every BGA on every board verified
Advanced Equipment – 12 SMT lines; 3D X-Ray void analysis
Complete Turnkey – Sourcing through assembly and shipping—one point of contact
Low Volume Support – Competitive pricing for low volume PCB assembly
Studio delivers High-Density BGA Assembly—PCB SMT specialist for complex, multi-BGA boards with full X-Ray verification.
Company Details
Business Type:
Manufacturer
Year Established:
2003
Total Annual:
30000000-40000000
Employee Number:
300~500
Ecer Certification：
Verified Supplier
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