DQS Electronic Co., Limited
Products
Manufacturer of a wide range of products which include 2.0mm Inverter Multilayer HDI PCB Board Assembly With Green Solder Mask,High Frequency HDI Rigid Flexible PCB Fast Turnaround Board 12 Layers,BMS Electronic PCBA Board with Ba...
MOQ: 1
Price: Contact Us
| Payment Terms | T/T |
| Supply Ability | 200,000+ m² PCB per Month |
| Layer | 10 layers |
| Material | Fr4 |
| Thickness | 2.0 mm |
| Construction | 2+N+2 |
| Min. Line Width/Space | 0.1/0.1mm |
| Surface Treatment | Immersion Gold |
| Type | Customizable |
| Application | Medical Device |
| Standard | UL&IPC Standard &ISO |
MOQ: 1
Price: Contact Us
| Payment Terms | T/T |
| Supply Ability | 200,000+ m² PCB per Month |
| Layer | 10 layers |
| Material | Fr4 |
| Thickness | 2.0 mm |
| Construction | 2+N+2 |
| Min. Line Width/Space | 0.1/0.1mm |
| Surface Treatment | Immersion Gold |
| Type | Customizable |
| Application | Medical Device |
| Standard | UL&IPC Standard &ISO |
MOQ: 1
Price: Inquiry Us
| Payment Terms | T/T |
| Layer | 8 Layer |
| Base Material | FR4 |
| Min. Component Size | 0201 |
| PCB Thickness | 1.5mm |
| Pin Space | 0.1mm |
| Surface Finish | Immersion Gold |
| Testing Method | Flying Probe, ICT, Functional Test,AOI |
| Application | BMS |
MOQ: 1
Price: Inquiry Us
| Payment Terms | T/T |
| Supply Ability | 200,000+ m² PCB per Month |
| Layer | 2 L |
| Min. Component Size | 0402 |
| Board Thickness | 1.0 mm |
| Surface Finish | ENIG |
| Pin Space | 0.1mm |
| Application | Consumer Electronics |
| Testing Method | Flying Probe, ICT, Functional Test |
MOQ: 1
Price: Contact us
| Payment Terms | T/T |
| Packaging Details | |
| Layer | 6 L |
| Min. Component Size | 0201 |
| Board Thickness | 2.0 mm |
| Surface Finish | ENIG |
| Pin Space | 0.1mm |
| Application | Power Electronics |
| Certification | ISO,UL,Reach,RoHS |
| Place of Origin | China |
MOQ: 1
Price: Inquiry Us
| Payment Terms | T/T |
| Layer | 4L |
| Min. Component Size | 01005 |
| Board Thickness | 1.0mm |
| Surface Finish | ENIG |
| Pin Space | 0.1mm |
| Surface Finishing | HASL/ENIG/OSP |
| Testing Method | Flying Probe, ICT, Functional Test |
| Application | Smartphones |
MOQ: 1
Price: Inquiry Us
| Payment Terms | T/T |
| Layer | 6L |
| Min. Component Size | 01005 |
| Board Thickness | 1.0mm |
| Pin Space | 0.1mm |
| Testing Method | Flying Probe, ICT, Functional Test |
| Application | Laptop Motherboard |
MOQ: 1
Price: Inquiry Us
| Payment Terms | T/T |
| Layer | 2L |
| Min. Hole Size | 0.2mm |
| Material | FR-4 |
| Min. Component Size | 01005 |
| Board Thickness | 1.0mm |
| Pin Space | 0.1mm |
| Testing Method | Flying Probe, ICT, Functional Test |
| Application | Laptop Motherboard |
MOQ: 1
Price: Inquiry Us
| Payment Terms | T/T |
| Layer | 4L |
| Material | FR-4 |
| Min. Component Size | 0201 |
| Board Thickness | 1.0mm |
| Pin Space | 0.1mm |
| Surface Finish | HASL/ENIG/OSP/Immersion Silver |
| Testing Method | Flying Probe, ICT, Functional Test |
| Application | Smart Cameras |
MOQ: 1
Price: Inquiry Us
| Payment Terms | T/T |
| Layer | 6L |
| Material | FR4+PI |
| Min. Component Size | 0201 |
| PCB Thickness | 1.0mm |
| Pin Space | 0.1mm |
| Testing Method | Flying Probe, ICT, Functional Test,AOI |
| Application | Smart Wearable Device |
| Certifications | ISO9001, UL, RoHS |
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