DQS Electronic Co., Limited
Products
Manufacturer of a wide range of products which include 2.0mm Inverter Multilayer HDI PCB Board Assembly With Green Solder Mask,High Frequency HDI Rigid Flexible PCB Fast Turnaround Board 12 Layers,LTE-M Radio Frequency Surface Mou...
MOQ: 1
Price: Contact Us
| Payment Terms | T/T |
| Supply Ability | 200,000+ m² PCB per Month |
| Layer | 10 layers |
| Material | Fr4 |
| Thickness | 2.0 mm |
| Construction | 2+N+2 |
| Min. Line Width/Space | 0.1/0.1mm |
| Surface Treatment | Immersion Gold |
| Type | Customizable |
| Application | Medical Device |
| Standard | UL&IPC Standard &ISO |
MOQ: 1
Price: Contact Us
| Payment Terms | T/T |
| Supply Ability | 200,000+ m² PCB per Month |
| Layer | 10 layers |
| Material | Fr4 |
| Thickness | 2.0 mm |
| Construction | 2+N+2 |
| Min. Line Width/Space | 0.1/0.1mm |
| Surface Treatment | Immersion Gold |
| Type | Customizable |
| Application | Medical Device |
| Standard | UL&IPC Standard &ISO |
MOQ: 1
Price: Contact us
| Payment Terms | T/T |
| Layer | 12L |
| Base Material | FR-4 |
| Board Thickness | 2.0mm |
| Min. Component Size | 0402 |
| Min. Line Width/Spacing | 0.1mm |
| Pin Space | 0.2mm |
| PCB Assembly Method | SMT+DIP |
| Application | LTE-M Communication Module |
MOQ: 1
Price: Contact us
| Payment Terms | T/T |
| Layer | 16L |
| Base Material | FR-4 |
| Board Thickness | 1.0mm |
| Min. Component Size | 0201 |
| Min. hole size | 0.1mm |
| Pin Space | 0.2mm |
| PCB Assembly Method | SMT/DIP |
| Application | IoT Devices |
MOQ: 1
Price: Contact us
| Payment Terms | T/T |
| Layer | 8L |
| Material | Aluminum |
| Copper Thickness | 1-3OZ |
| Min. Component Size | 01005 |
| Min. Line Width/Spacing | 4/4 mil |
| Assembly Method | SMT/DIP |
| Item | ODM/OEM |
| Application | Base Atation RF Processing |
MOQ: 1
Price: Contact us
| Payment Terms | T/T |
| Layer | 4L |
| Material | FR-4 |
| Board Thickness | 2.0mm |
| Min. Component Size | 01005 |
| Min. Line Width/Spacing | 0.1mm |
| Pin Space | 0.2mm |
| Assembly Method | SMT |
| Application | Communications equipment |
MOQ: 1
Price: Contact us
| Payment Terms | T/T |
| Layer | 20L |
| Material | FR4 |
| Board Thickness | 2.0mm |
| Min. Component Size | 01005 |
| Min. Line Width/Spacing | 0.1mm |
| Pin Space | 0.2mm |
| Assembly Method | SMT/DIP |
| Application | Millimeter Wave Antenna Module |
MOQ: 1
Price: Contact us
| Payment Terms | T/T |
| Layer | 4L |
| Min. Component Size | 0201 |
| Board Thickness | 1.6 mm |
| Surface Finish | ENIG |
| Pin Space | 0.2mm |
| Application | Communication |
MOQ: 1
Price: Contact us
| Payment Terms | T/T |
| Layer | 4L |
| Material | FR-4 |
| Min. Component Size | 0201 |
| Copper Thickness | 1OZ |
| Board Thickness | 1.6 mm |
| Surface Finish | ENIG |
| Pin Space | 0.2mm |
| Application | Communication |
MOQ: 1
Price: Contact us
| Payment Terms | T/T |
| Layer | 6L |
| Material | FR-4 |
| Board Thickness | 1.5 mm |
| Min. Component Size | 0201 |
| Min. Line Width/Spacing | 0.1mm |
| Pin Space | 0.2mm |
| PCB Assembly Method | SMT/DIP |
| Application | 5G Infrastructure |
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