DQS Electronic Co., Limited
Products
Manufacturer of a wide range of products which include 2.0mm Inverter Multilayer HDI PCB Board Assembly With Green Solder Mask,High Frequency HDI Rigid Flexible PCB Fast Turnaround Board 12 Layers,China PCBA Service Telecom PCB As...
MOQ: 1
Price: Contact Us
| Payment Terms | T/T |
| Supply Ability | 200,000+ m² PCB per Month |
| Layer | 10 layers |
| Material | Fr4 |
| Thickness | 2.0 mm |
| Construction | 2+N+2 |
| Min. Line Width/Space | 0.1/0.1mm |
| Surface Treatment | Immersion Gold |
| Type | Customizable |
| Application | Medical Device |
| Standard | UL&IPC Standard &ISO |
MOQ: 1
Price: Contact Us
| Payment Terms | T/T |
| Supply Ability | 200,000+ m² PCB per Month |
| Layer | 10 layers |
| Material | Fr4 |
| Thickness | 2.0 mm |
| Construction | 2+N+2 |
| Min. Line Width/Space | 0.1/0.1mm |
| Surface Treatment | Immersion Gold |
| Type | Customizable |
| Application | Medical Device |
| Standard | UL&IPC Standard &ISO |
MOQ: 1
Price: Contact us
| Payment Terms | T/T |
| Layer | 6 Layer |
| Min. Component Size | 0201 |
| Board Thickness | 1.4 mm |
| Surface Finish | ENIG |
| Pin Space | 0.2mm |
| Application | Telecom |
MOQ: 1
Price: Contact us
| Payment Terms | T/T |
| Layer | 12L |
| Base Material | FR-4 |
| Board Thickness | 2.0mm |
| Min. Component Size | 0402 |
| Min. Line Width/Spacing | 0.1mm |
| Pin Space | 0.2mm |
| PCB Assembly Method | SMT+DIP |
| Application | LTE-M Communication Module |
MOQ: 1
Price: Contact us
| Payment Terms | T/T |
| Layer | 16L |
| Base Material | FR-4 |
| Board Thickness | 1.0mm |
| Min. Component Size | 0201 |
| Min. hole size | 0.1mm |
| Pin Space | 0.2mm |
| PCB Assembly Method | SMT/DIP |
| Application | IoT Devices |
MOQ: 1
Price: Contact us
| Payment Terms | T/T |
| Layer | 8L |
| Material | Aluminum |
| Copper Thickness | 1-3OZ |
| Min. Component Size | 01005 |
| Min. Line Width/Spacing | 4/4 mil |
| Assembly Method | SMT/DIP |
| Item | ODM/OEM |
| Application | Base Atation RF Processing |
MOQ: 1
Price: Contact us
| Payment Terms | T/T |
| Layer | 4L |
| Material | FR-4 |
| Board Thickness | 2.0mm |
| Min. Component Size | 01005 |
| Min. Line Width/Spacing | 0.1mm |
| Pin Space | 0.2mm |
| Assembly Method | SMT |
| Application | Communications equipment |
MOQ: 1
Price: Contact us
| Payment Terms | T/T |
| Layer | 20L |
| Material | FR4 |
| Board Thickness | 2.0mm |
| Min. Component Size | 01005 |
| Min. Line Width/Spacing | 0.1mm |
| Pin Space | 0.2mm |
| Assembly Method | SMT/DIP |
| Application | Millimeter Wave Antenna Module |
MOQ: 1
Price: Contact us
| Payment Terms | T/T |
| Layer | 4L |
| Min. Component Size | 0201 |
| Board Thickness | 1.6 mm |
| Surface Finish | ENIG |
| Pin Space | 0.2mm |
| Application | Communication |
MOQ: 1
Price: Contact us
| Payment Terms | T/T |
| Layer | 4L |
| Material | FR-4 |
| Min. Component Size | 0201 |
| Copper Thickness | 1OZ |
| Board Thickness | 1.6 mm |
| Surface Finish | ENIG |
| Pin Space | 0.2mm |
| Application | Communication |
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