Payment Terms | T/T |
Layer | 20L |
Material | FR4 |
Board Thickness | 2.0mm |
Min. Component Size | 01005 |
Min. Line Width/Spacing | 0.1mm |
Pin Space | 0.2mm |
Assembly Method | SMT/DIP |
Application | Millimeter Wave Antenna Module |
View Detail Information
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Product Specification
Payment Terms | T/T | Layer | 20L |
Material | FR4 | Board Thickness | 2.0mm |
Min. Component Size | 01005 | Min. Line Width/Spacing | 0.1mm |
Pin Space | 0.2mm | Assembly Method | SMT/DIP |
Application | Millimeter Wave Antenna Module | ||
High Light | SMT Telecom PCB Assembly ,DIP Telecom PCB Assembly ,2.0mm circuit board electrical |
Telecom PCB Assembly Millimeter Wave Antenna Module High Frequency Signal Processing
♦ What's Telecom PCB Assembly?
Telecom PCB Assembly refers to the manufacturing and assembly of printed circuit boards (PCBs) specifically designed for telecommunications equipment, such as:
These PCBs require high-frequency performance, signal integrity, and reliability to handle fast data transmission, low latency, and harsh operational environments.
1. High-Frequency Materials
2. Multilayer & HDI (High-Density Interconnect) Designs
3. RF & Microwave Components
4. Thermal Management
5. Strict Compliance Standards
Environmental adaptation: Weather-resistant PCB for outdoor use (such as FR-4+UV coating, IP65 protection); Enhanced heat dissipation in high temperature environment.
Static protection: Wear an anti-static wristband and use an anti-static tray during operation (chip sensitivity <50V).
Regular inspection: TDR to measure signals, X-Ray to check BGA solder joints; clean the surface to prevent dust accumulation.
Avoid overload: prohibit over-current/voltage/rate to prevent module burning or packet loss.
Upgrade and maintenance: Official firmware upgrade, backup configuration parameters.
♦ Technical Parameters
PCB Assembly Capability | |||||
Item |
Normal |
Special | |||
SMT Assembly |
PCB(used for SMT) specification | Length and Width( L* W) | Minimum | L≥3mm, W≥3mm | L<2mm |
Maximum | L≤800mm, W≤460mm | L > 1200mm, W>500mm | |||
Thickness( T) | Thinnest | 0.2mm | T<0.1mm | ||
Thickest | 4 mm | T>4.5mm | |||
SMT components specification | Outline Dimension | Min size | 0201(0.6mm*0.3mm) | 01005(0.3mm*0.2mm) | |
Max size | 200 * 125 | 200 * 125 | |||
component thickness | T≤15mm | 6.5mm<T≤15mm | |||
QFP,SOP,SOJ (multi pins) | Min pin space | 0.4mm | 0.3mm≤Pitch<0.4mm | ||
CSP/ BGA | Min ball space | 0.5mm | 0.3mm≤Pitch<0.5mm | ||
DIP Assembly |
PCB specification |
Length and Width( L* W) | Minimum | L≥50mm, W≥30mm | L<50mm |
Maximum | L≤1200mm, W≤450mm | L≥1200mm, W≥500mm | |||
Thickness( T) | Thinnest | 0.8mm | T<0.8mm | ||
Thickest | 3.5mm | T>2mm |
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Company Details
Business Type:
Manufacturer
Employee Number:
>800
Ecer Certification:
Verified Supplier
DQS Electronic is located in Shenzhen, focusing on PCB Layout Design, PCB Fabrication, Electronic Components Sourcing, SMT, PCB Assembly and Testing. We are a one-stop EMS electronic manufacturing company committed to providing global customers with rapid prototyping and mass production. Our produ... DQS Electronic is located in Shenzhen, focusing on PCB Layout Design, PCB Fabrication, Electronic Components Sourcing, SMT, PCB Assembly and Testing. We are a one-stop EMS electronic manufacturing company committed to providing global customers with rapid prototyping and mass production. Our produ...
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