DQS Electronic Co., Limited
| Payment Terms | T/T |
| Layer | 4L |
| Material | FR-4 |
| Board Thickness | 2.0mm |
| Min. Component Size | 01005 |
| Min. Line Width/Spacing | 0.1mm |
| Pin Space | 0.2mm |
| Assembly Method | SMT |
| Application | Communications equipment |
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Product Specification
| Payment Terms | T/T | Layer | 4L |
| Material | FR-4 | Board Thickness | 2.0mm |
| Min. Component Size | 01005 | Min. Line Width/Spacing | 0.1mm |
| Pin Space | 0.2mm | Assembly Method | SMT |
| Application | Communications equipment | ||
| High Light | Prototype Telecom PCB Assembly ，Surface Mount Telecom PCB Assembly ，FR-4 surface mount prototype board | ||
High Frequency Low Loss Components Telecom PCB Assembly SMT Mounting Services
♦ What's Telecom PCB Assembly?
Telecom PCB Assembly refers to the manufacturing and assembly of printed circuit boards (PCBs) specifically designed for telecommunications equipment, such as:
These PCBs require high-frequency performance, signal integrity, and reliability to handle fast data transmission, low latency, and harsh operational environments.
1. High-Frequency Materials
2. Multilayer & HDI (High-Density Interconnect) Designs
3. RF & Microwave Components
4. Thermal Management
5. Strict Compliance Standards
Components: Select high-frequency low-loss materials (such as PTFE substrates), high-temperature resistant chips (-40℃~125℃), and RF components require 50Ω impedance matching.
Manufacturing accuracy: patch accuracy ±0.025mm (normal ±0.05mm), support 01005 tiny components; laser drilling + micro-hole electroplating to achieve high-density wiring.
Special processes:
Impedance control: line/medium optimization, differential line impedance deviation within ±10%.
Electromagnetic shielding: metal cover/conductive glue isolates radio frequency interference.
Thermal management: heat sink/aluminum substrate conducts heat quickly to prevent chip overheating.
♦ Technical Parameters
| PCB Assembly Capability | |||||
|
Item |
Normal |
Special | |||
|
SMT Assembly |
PCB(used for SMT) specification | Length and Width( L* W) | Minimum | L≥3mm, W≥3mm | L＜2mm |
| Maximum | L≤800mm, W≤460mm | L ＞ 1200mm, W＞500mm | |||
| Thickness( T) | Thinnest | 0.2mm | T＜0.1mm | ||
| Thickest | 4 mm | T＞4.5mm | |||
|
SMT components specification | Outline Dimension | Min size | 0201(0.6mm*0.3mm) | 01005(0.3mm*0.2mm) | |
| Max size | 200 * 125 | 200 * 125 | |||
| component thickness | T≤15mm | 6.5mm＜T≤15mm | |||
| QFP,SOP,SOJ (multi pins) | Min pin space | 0.4mm | 0.3mm≤Pitch＜0.4mm | ||
| CSP/ BGA | Min ball space | 0.5mm | 0.3mm≤Pitch＜0.5mm | ||
|
DIP Assembly |
PCB specification |
Length and Width( L* W) | Minimum | L≥50mm, W≥30mm | L＜50mm |
| Maximum | L≤1200mm, W≤450mm | L≥1200mm, W≥500mm | |||
| Thickness( T) | Thinnest | 0.8mm | T＜0.8mm | ||
| Thickest | 3.5mm | T＞2mm | |||
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2. Quality Guaranteed:
3. Premium Service:
Company Details
Business Type:
Manufacturer
Employee Number:
>800
Ecer Certification：
Verified Supplier
DQS Electronic is located in Shenzhen, focusing on PCB Layout Design, PCB Fabrication, Electronic Components Sourcing, SMT, PCB Assembly and Testing. We are a one-stop EMS electronic manufacturing company committed to providing global customers with rapid prototyping and mass production. Our produ... DQS Electronic is located in Shenzhen, focusing on PCB Layout Design, PCB Fabrication, Electronic Components Sourcing, SMT, PCB Assembly and Testing. We are a one-stop EMS electronic manufacturing company committed to providing global customers with rapid prototyping and mass production. Our produ...
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