| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| Base material | Stainless steel shim |
| Stencil size | 520 x 420 mm =1 PCS |
| Foil Thickness | 0.12mm |
| Appearance | Engraving and electro polishing |
| Brand Name | Bicheng |
| Model Number | BIC-960.V1.0 |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
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Product Specification
| Payment Terms | T/T | Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
| Base material | Stainless steel shim | Stencil size | 520 x 420 mm =1 PCS |
| Foil Thickness | 0.12mm | Appearance | Engraving and electro polishing |
| Brand Name | Bicheng | Model Number | BIC-960.V1.0 |
| Certification | UL, ISO9001, IATF16949 | Place of Origin | CHINA |
| High Light | High Precision PCB SMT Stencil ,Engraving PCB SMT Stencil ,High Precision Laser Cut Solder Stencil | ||
| Dimension: | 520 x 420 mm =1 PCS | |||||
| Structure | Stencil foils with aluminum frame | |||||
| Base material | Stainless steel shim | |||||
| Foil Thickness | 0.12mm | |||||
| Aperture configured | Laser cut | |||||
| Appearance | Engraving and electro polishing | |||||
| Fiducial mark | Through hole | |||||
| Service area: | Worldwide | |||||
| Quantity of open pads: | 1021 | |||||
| Advantages: | a) High precision dimension; b) Good shape on the window; c) Hole wall is smoother. | |||||
| Application: | CSP, BGA, 0.5mm QFP etc. package | |||||
| Component Type | Pitch | Soldering Width | Soldering Length | Opening Width | Opening Length | Shim Thickness |
| PLCC | 1.27mm | 0.65mm | 2.00mm | 0.60mm | 1.95mm | 0.15-0.25mm |
| QFP | 0.635mm | 0.35mm | 1.50mm | 0.32mm | 1.45mm | 0.15-0.18mm |
| QFP | 0.50mm | 0.254-0.33mm | 1.25mm | 0.22-0.25mm | 1.20mm | 0.12-0.15mm |
| QFP | 0.40mm | 0.25mm | 1.25mm | 0.20mm | 1.20mm | 0.10-0.12mm |
| QFP | 0.30mm | 0.20mm | 1.00mm | 0.15mm | 0.95mm | 0.07-0.12mm |
| 0402 | 0.50mm | 0.65mm | 0.45mm | 0.60mm | 0.12-0.15mm | |
| 0201 | 0.25mm | 0.40mm | 0.23mm | 0.35mm | 0.07-0.12mm | |
| BGA | 1.27mm | 0.80mm | 0.75mm | 0.75mm | 0.15-0.20mm | |
| BGA | 1.00mm | 0.38mm | 0.35mm | 0.35mm | 0.10-0.12mm | |
| BGA | 0.50mm | 0.30mm | 0.28mm | 0.28mm | 0.07-0.12mm | |
| Flip Chip | 0.25mm | 0.12mm | 0.12mm | 0.12mm | 0.12mm | 0.08-0.10mm |
| Flip Chip | 0.20mm | 0.10mm | 0.10mm | 0.10mm | 0.10mm | 0.05-0.10mm |
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Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification:
Verified Supplier
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 18 years of industry experience, the company serves global sectors including cellular base station antennas, satellite communications, ... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 18 years of industry experience, the company serves global sectors including cellular base station antennas, satellite communications, ...
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