2-Layer TF960 PCB 0.7mm Immersion Silver High-Dk RF Printed Circuit Board

Product Specification

This 2-layer rigid TF960 PCB serves as a high-stability high-frequency solution tailored for high-precision radio frequency and wireless signal processing devices. Constructed with premium TF960 thermoset ceramic-filled modified PTFE dielectric material, this PCB delivers steady dielectric performance, ultra-low signal loss and superior thermal stability, offering better structural dependability and processing compatibility than conventional high-frequency substrates. It features a 0.7mm final board thickness and 1 oz outer copper layer, paired with immersion silver surface finishing to ensure stable solderability and consistent electrical conductivity during long-duration high-frequency operation. Built with 5/8 mil fine-line routing capability and 0.25mm micro-hole precision, the board adopts a non-blind via design with customized single-sided coating, including white top silkscreen and blue top solder mask, while the bottom copper layer remains exposed.

PCB Specification

PCB Stack-up Structure

Featuring a symmetrical dual-layer rigid layout with a high-stability TF960 dielectric core, this stackup structure achieves balanced mechanical flatness and uniform electrical parameters. It is fully compatible with standard FR4 drilling, plating and lamination procedures, ensuring reliable manufacturing consistency and steady signal transmission for high-frequency circuit designs.

PCB Statistic

This TF960 high-frequency PCB adopts optimized component placement and rational via distribution, catering to compact assembly requirements and sustaining stable electrical performance for precision RF functional modules.

TF960 High-Frequency Substrate Introduction

TF960 is a premium thermoset high-frequency laminate composed of modified PTFE resin, micron-sized ceramic fillers and glass fiber reinforcement. Compared with traditional high-frequency dielectrics, this upgraded material provides lower dielectric dissipation, tighter dielectric constant tolerance and enhanced structural stability. It supports standard FR4 manufacturing workflows and 260℃ lead-free reflow soldering, featuring outstanding thermal endurance and minimal moisture absorption. Developed for high-reliability RF circuit systems, TF960 effectively reduces insertion loss and maintains complete signal integrity under prolonged high-frequency operating conditions.

TF960 Core Characteristics

TF960 combines precisely calibrated dielectric characteristics and robust mechanical properties, delivering stable and repeatable high-frequency performance for commercial and industrial RF scenarios:

Typical Applications

Benefiting from accurate dielectric consistency, ultra-low high-frequency dissipation and excellent thermal and environmental resistance, TF960 PCBs are widely utilized in high-end communication equipment, industrial precision testing and high-reliability radar systems:

• RF and microwave transceiving modules
• 5G/6G massive MIMO antenna arrays
• Automotive ADAS and aerospace radar systems
• Satellite communication payload devices
• High-power RF amplifier units
• High-precision test and measurement instruments, including vector network analyzers

Quality & Service Guarantee

All TF960 high-frequency circuit boards are fabricated in strict accordance with IPC-Class-2 industrial quality criteria. Adopting standard Gerber RS-274-X design files, each board achieves precise dimensional precision and stable electrical repeatability for batch manufacturing. Every finished product undergoes comprehensive electrical inspection before shipment to eliminate functional defects and ensure consistent batch performance. Supported by global logistics networks and professional technical assistance, these high-reliability high-frequency PCB solutions deliver dependable support for high-end communication, aerospace, automotive and precision measurement projects across the globe.