2-Layer Wangling TP440 PCB 1.6mm Immersion Gold Low-Loss Material

Product Specification

This 2-layer rigid Wangling TP440 high-frequency PCB is a premium thermoplastic circuit solution built for low-loss microwave signal transmission and high-stability precision antenna systems. Adopting industry-exclusive fiberglass-free ceramic PPO composite dielectric material, this board delivers ultra-stable dielectric performance, minimal signal attenuation and outstanding environmental adaptability, outperforming conventional glass-reinforced high-frequency substrates in low-temperature resistance and structural machinability. Featuring a 1.6mm finished thickness and 1oz outer copper cladding, the PCB applies immersion gold surface finishing to ensure reliable solderability, superior oxidation resistance and consistent electrical output during long-term high-frequency operation. It supports 5/8 mil fine-line trace and space fabrication alongside 0.3mm precision micro-hole drilling, with a non-blind via structure. The board adopts black silkscreen on the top layer and full bare copper exposure on both sides without solder mask coverage.

PCB Specification

PCB Stack-up Structure

This 2-layer rigid PCB adopts a 1.5mm fiberglass-free Wangling TP440 dielectric core made of ceramic and PPO resin composite material. It eliminates glass fiber signal interference for ultra-stable dielectric performance and steady electromagnetic transmission. Double-sided 35μm copper foil ensures efficient and consistent signal conduction, while integrated lamination strengthens structural stability and machining precision for reliable antenna and microwave system operation.

PCB Statistic

This TP440 high-frequency PCB adopts streamlined component arrangement and rational via distribution. With compact pad layout and simplified circuit networking, it matches the structural characteristics of miniaturized antenna and precision microwave equipment, ensuring stable low-loss signal transmission while maintaining high assembly practicability for compact RF modules.

Wangling TP Series Substrate Overview

Wangling TP series represents a unique high-frequency thermoplastic substrate lineup in the industry, adopting a specialized composite formula of polyphenylene oxide resin and nano-ceramic fillers without any fiberglass reinforcement. Different from traditional fiberglass-reinforced high-frequency laminates, its dielectric constant can be precisely calibrated by adjusting the mixing ratio of ceramic particles and PPO resin, achieving customizable dielectric parameters for diverse high-frequency scenarios. The series features graded structural classification: pure dielectric substrates are defined as TP, single-sided copper-clad variants as TP-1, and double-sided copper-clad versions as TP-2. With exclusive molding and lamination techniques, TP series substrates deliver exceptional electrical consistency, extreme environmental resistance and superior structural machinability, serving as a high-reliability alternative for precision microwave and antenna hardware.

Core Performance Advantages of TP440 Material

TP440 substrate integrates customizable dielectric performance, extreme temperature adaptability and reliable mechanical machinability, maintaining stable low-loss signal output in complex and harsh working environments. Its comprehensive advantages make it highly exclusive for miniaturized high-frequency antenna and precision military-grade electronic equipment:

Customizable & Stable Dielectric Properties: Offers wide dielectric constant adjustability from 3.0 to 25 with multiple mainstream fixed grades available. It delivers ultra-low dielectric loss and stable electrical performance with minimal parameter variation below 10GHz.

Extreme Wide Temperature Resistance: Ensures reliable long-term operation at -100°C to +150°C with exceptional low-temperature resistance. Performance instability and structural damage may occur above 180°C.

Flexible Thickness Customization: Supports a minimum thickness of 0.5mm, with diverse standard and custom thickness options to fit various assembly requirements.

Radiation Resistance & Low Outgassing: Comes with excellent radiation resistance and ultra-low outgassing capability, ideal for aerospace and extreme space environments.

Superior Machinability & Adhesion: Provides stronger copper foil bonding than vacuum-coated ceramic substrates. It supports full-process mechanical and chemical processing that rigid ceramic substrates cannot achieve.

Professional Miniaturized Antenna Adaptability: Optimized for compact high-frequency hardware, perfectly suited for Beidou navigation, missile-borne systems, fuze devices and miniaturized antenna modules.

Typical Application Scenarios

Benefiting from customizable high-stability Dk, ultra-low high-frequency loss, extreme low-temperature resistance and excellent mechanical machinability, Wangling TP440 high-frequency PCBs are widely deployed in precision navigation and specialized military-grade high-frequency equipment:

• High-precision GPS navigation antenna systems
• Missile-borne microwave sensing and signal transmission units
• Fuze electronic control and high-frequency induction devices
• Miniaturized compact antenna modules for aerospace and precision RF systems

Quality Assurance & Global Service

Wangling TP440 high-frequency thermoplastic PCBs follow strict IPC-Class-2 industrial quality standards throughout production. Built from standard Gerber RS-274-X production files, each circuit board delivers precise dimensional tolerance and steady electrical consistency for reliable mass production. Every unit receives complete electrical testing prior to shipment to guarantee flawless functionality and uniform batch quality. With worldwide logistics coverage and dedicated technical support, we deliver dependable custom high-frequency PCB solutions for global navigation, aerospace and military-grade high-frequency electronic applications.