Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| Part number | F4BM217 |
| Laminate thickness | 0.1mm-12mm |
| Laminate size | 460X610mm 500X600mm 850X120mm 914X1220mm 1000X1200mm |
| Copper weight | 0.5OZ（0.018mm）1OZ（0.035mm）1.5OZ（0.05mm）2OZ（0.08mm） |
| Brand Name | Bicheng |
| Model Number | BIC-332.V1.0 |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
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Product Specification
| Payment Terms | T/T | Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
| Part number | F4BM217 | Laminate thickness | 0.1mm-12mm |
| Laminate size | 460X610mm 500X600mm 850X120mm 914X1220mm 1000X1200mm | Copper weight | 0.5OZ（0.018mm）1OZ（0.035mm）1.5OZ（0.05mm）2OZ（0.08mm） |
| Brand Name | Bicheng | Model Number | BIC-332.V1.0 |
| Certification | UL, ISO9001, IATF16949 | Place of Origin | CHINA |
| High Light | F4BM217 Copper Clad Pcb Material ，460X610mm Copper Clad Pcb Material ，500X600mm copper clad laminates | ||
Wangling's F4BM217 is a high-performance composite laminate engineered for advanced RF and microwave applications. It is manufactured through a precise formulation and lamination process, combining woven fiberglass cloth with PTFE resin and film to achieve superior and consistent electrical properties.
This next-generation material offers significant performance enhancements over its predecessor, F4B220, featuring lower dielectric loss, higher insulation resistance, and improved overall stability. F4BM217 serves as a reliable, high-quality domestic alternative to comparable imported laminates.
Key Material Variants:
The core dielectric formulation is available in two copper foil configurations to suit specific application needs:
F4BM217: Utilizes standard Electrodeposited (ED) copper foil. This variant is a cost-effective solution for general high-frequency applications where Passive Intermodulation (PIM) is not a critical requirement.
F4BME217: Pairs the same dielectric with Reverse-Treated Foil (RTF) copper. This combination delivers excellent PIM performance, enables more precise line definition, and reduces conductor loss for demanding, high-precision circuits.
Tailored Performance through Material Science:
The electrical and mechanical properties of F4BM217 are precisely tuned by adjusting the ratio of PTFE to fiberglass cloth within the composite. This allows for controlled dielectric constants while maintaining low loss characteristics and enhanced dimensional stability.
A higher dielectric constant is achieved by increasing the fiberglass content, which improves dimensional stability, lowers the thermal expansion coefficient, and reduces temperature drift.
This adjustment involves a balanced trade-off, as a higher fiberglass ratio may result in a marginal increase in dielectric loss.
This design flexibility enables engineers to select the optimal material grade for a perfect balance of electrical performance, mechanical robustness, and processing requirements.
Typical Application Cases
-Microwave, RF, and Radar
-Phase Shifters, Passive Components
-Power Dividers, Couplers, Combiners
-Feed Networks, Phased Array Antennas
-Satellite Communication, Base Station Antennas
| Product Technical Parameters | Product Model & Data Sheet | |||
| Product Features | Test Conditions | Unit | F4BM217 | |
| Dielectric Constant (Typical) | 10GHz | / | 2.17 | |
| Dielectric Constant Tolerance | / | / | ±0.04 | |
| Loss Tangent (Typical) | 10GHz | / | 0.001 | |
| 20GHz | / | 0.0014 | ||
| Dielectric Constant Temperature Coefficient | -55ºC～150ºC | PPM/℃ | -150 | |
| Peel Strength | 1 OZ F4BM | N/mm | >1.8 | |
| 1 OZ F4BME | N/mm | >1.6 | ||
| Volume Resistivity | Standard Condition | MΩ.cm | ≥6×10^6 | |
| Surface Resistivity | Standard Condition | MΩ | ≥1×10^6 | |
| Electrical Strength (Z direction) | 5KW,500V/s | KV/mm | >23 | |
| Breakdown Voltage (XY direction) | 5KW,500V/s | KV | >30 | |
| Coefficient of Thermal Expansion | XY direction | -55 º~288ºC | ppm/ºC | 25, 34 |
| Z direction | -55 º~288ºC | ppm/ºC | 240 | |
| Thermal Stress | 260℃, 10s,3 times | No delamination | ||
| Water Absorption | 20±2℃, 24 hours | % | ≤0.08 | |
| Density | Room Temperature | g/cm3 | 2.17 | |
| Long-Term Operating Temperature | High-Low Temperature Chamber | ℃ | -55～+260 | |
| Thermal Conductivity | Z direction | W/(M.K) | 0.24 | |
| PIM | Only applicable to F4BME | dBc | ≤-159 | |
| Flammability | / | UL-94 | V-0 | |
| Material Composition | PTFE, Fiberglass Cloth F4BM paired with ED copper foil, F4BME paired with reverse-treated (RTF) copper foil. |
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Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Verified Supplier
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 23 years of industry experience, the company serves global sectors such as cellular base station antennas, satellite communication... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 23 years of industry experience, the company serves global sectors such as cellular base station antennas, satellite communication...
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