Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| Part number | F4BM220 |
| Laminate thickness | 0.1mm 0.127mm 0.2mm 0.25mm 0.5mm 0.508mm 0.762mm 0.8mm 1.0mm 1.5mm 1.524mm 1.575mm 2.0mm 2.5mm 3.0mm 4.0mm 5.0mm 6.0mm 8.0mm 10mm 12mmm |
| Laminate size | 460X610mm; 500X600mm; 850X1200mm; 914X1220mm; 1000X1200mm; 300X250mm; 350X380mm; 500X500mm; 840X840mm; 1000X1500mm |
| Copper weight | 0.5OZ（0.018mm）1OZ（0.035mm），1.5OZ（0.05mm），2OZ（0.07mm） |
| Brand Name | Bicheng |
| Model Number | BIC-332.V1.0 |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
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Product Specification
| Payment Terms | T/T | Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
| Part number | F4BM220 | Laminate thickness | 0.1mm 0.127mm 0.2mm 0.25mm 0.5mm 0.508mm 0.762mm 0.8mm 1.0mm 1.5mm 1.524mm 1.575mm 2.0mm 2.5mm 3.0mm 4.0mm 5.0mm 6.0mm 8.0mm 10mm 12mmm |
| Laminate size | 460X610mm; 500X600mm; 850X1200mm; 914X1220mm; 1000X1200mm; 300X250mm; 350X380mm; 500X500mm; 840X840mm; 1000X1500mm | Copper weight | 0.5OZ（0.018mm）1OZ（0.035mm），1.5OZ（0.05mm），2OZ（0.07mm） |
| Brand Name | Bicheng | Model Number | BIC-332.V1.0 |
| Certification | UL, ISO9001, IATF16949 | Place of Origin | CHINA |
| High Light | high frequency copper laminate sheet ，F4BM220 copper clad laminate ，copper clad laminate sheet | ||
F4BM220 is a high-performance composite laminate engineered through precise formulation and controlled processing, combining woven fiberglass cloth with polytetrafluoroethylene (PTFE) resin and film. Compared to standard F4B materials, F4BM220 demonstrates enhanced electrical characteristics, including a wider available dielectric constant range, lower dissipation factor, higher insulation resistance, and greater performance stability, making it a suitable substitute for equivalent imported products.
F4BM and F4BME utilize the same dielectric core but are furnished with different copper foils:
- F4BM is clad with standard electrodeposited (ED) copper and is intended for applications where Passive Intermodulation (PIM) is not critical.
- F4BME is supplied with reverse-treated foil (RTF) copper, delivering superior PIM performance, finer circuit definition, and reduced conductor loss for high-frequency designs.
Both grades allow precise dielectric constant tuning by adjusting the PTFE-to-fiberglass ratio. This balance achieves low loss while improving dimensional stability. Higher dielectric constant versions contain more fiberglass, resulting in better dimensional control, reduced Z-axis CTE, improved temperature stability, and a corresponding increase in dielectric loss.
Features:
- Dielectric Constant (Dk): 2.2
- Low loss characteristics
- Excellent PIM performance (F4BME with RTF foil)
- Multiple panel sizes available to optimize yield and cost
- Radiation resistant with low outgassing
- Commercial-grade, high-volume, cost-effective production
Typical Applications:
- Microwave, RF, and radar circuits
- Phase shifters and passive components
- Power dividers, couplers, and combiners
- Feed networks and phased array antennas
- Satellite communication and base station antennas
| Product Features | Test Conditions | Unit | F4BM220 | |
| Dielectric Constant (Typical) | 10GHz | / | 2.2 | |
| Dielectric Constant Tolerance | / | / | ±0.04 | |
| Loss Tangent (Typical) | 10GHz | / | 0.001 | |
| 20GHz | / | 0.0014 | ||
| Dielectric Constant Temperature Coefficient | -55ºC～150ºC | PPM/℃ | -142 | |
| Peel Strength | 1 OZ F4BM | N/mm | >1.8 | |
| 1 OZ F4BME | N/mm | >1.6 | ||
| Volume Resistivity | Standard Condition | MΩ.cm | ≥6×10^6 | |
| Surface Resistivity | Standard Condition | MΩ | ≥1×10^6 | |
| Electrical Strength (Z direction) | 5KW,500V/s | KV/mm | >23 | |
| Breakdown Voltage (XY direction) | 5KW,500V/s | KV | >30 | |
| Coefficientof Thermal Expansion | XY direction | -55 º~288ºC | ppm/ºC | 25, 34 |
| Z direction | -55 º~288ºC | ppm/ºC | 240 | |
| Thermal Stress | 260℃, 10s,3 times | No delamination | ||
| Water Absorption | 20±2℃, 24 hours | % | ≤0.08 | |
| Density | Room Temperature | g/cm3 | 2.18 | |
| Long-Term Operating Temperature | High-Low Temperature Chamber | ℃ | -55～+260 | |
| Thermal Conductivity | Z direction | W/(M.K) | 0.24 | |
| PIM | Only applicable to F4BME | dBc | ≤-159 | |
| Flammability | / | UL-94 | V-0 | |
| Material Composition | / | / | PTFE, Fiberglass Cloth F4BM paired with ED copper foil, F4BME paired with reverse-treated (RTF) copper foil. |
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Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Verified Supplier
Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime... Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime...
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