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The F4BTMS Series represents an advanced upgrade to the F4BTM Series. Leveraging the foundational design of its predecessor, it incorporates pivotal technological advancements in both material formulation and manufacturing processes. The material is infused with a high concentration of ceramics and reinforced with ultra-thin, ultra-fine fiberglass cloth—optimizations that deliver substantial improvements in overall performance and an expanded dielectric constant range. As a result, it qualifies as an aerospace-grade, high-reliability material capable of directly substituting for comparable foreign alternatives.
A synergistic combination of minimal ultra-thin/ultra-fine fiberglass cloth reinforcement and high-load, uniformly dispersed specialty nano-ceramics blended with polytetrafluoroethylene (PTFE) resin effectively mitigates the fiberglass effect during electromagnetic wave transmission and reduces dielectric loss. Beyond these benefits, the material exhibits enhanced dimensional stability, reduced anisotropy across the X/Y/Z axes, elevated operating frequency capabilities, improved dielectric strength, and increased thermal conductivity. It also features an excellent low coefficient of thermal expansion (CTE) and consistent dielectric properties across temperature variations.
Standard-equipped with RTF low-profile copper foil, the F4BTMS220 minimizes conductor loss while ensuring exceptional peel strength. It is compatible with both copper and aluminum substrates, and printed circuit boards (PCBs) fabricated from this material can be processed using conventional PTFE laminate manufacturing techniques. Boasting superior mechanical and physical characteristics, the laminate is well-suited for producing multi-layer, high-density multi-layer, and backplane PCBs. It also offers excellent processability for intricate manufacturing requirements such as dense via drilling and fine line patterning.
Product Features
Tight dielectric constant tolerance and excellent inter-batch consistency
Ultra-low dielectric loss
Stable dielectric constant and low loss values at operating frequencies up to 40 GHz, meeting the demands of phase-sensitive applications
Superior temperature coefficients for both dielectric constant and dielectric loss, ensuring reliable frequency and phase stability across the temperature spectrum of -55 °C to 150 °C
Exceptional radiation resistance; maintains stable dielectric and physical properties even after exposure to specified radiation dosages
Low outgassing performance; complies with aerospace vacuum outgassing requirements when tested in accordance with standard protocols for material volatility under vacuum conditions
Low coefficient of thermal expansion (CTE) in the X/Y/Z directions, guaranteeing dimensional thermal stability and via copper integrity
Enhanced thermal conductivity, making it ideal for high-power application scenarios
Superior dimensional stability
Low water absorption rate
Typical Applications
Aerospace equipment, including spaceborne and on-board systems
Microwave and radio frequency (RF) components
Radar systems, particularly military radar
Feed networks
Phase-sensitive antennas and phased array antennas
Satellite communications systems, etc.
Product Features
Test Conditions
Unit
F4BTMS220
Dielectric Constant (Typical)
10GHz
/
2.2
Dielectric Constant Tolerance
/
/
±0.02
Dielectric Constant (Design)
10GHz
/
2.2
Loss Tangent (Typical)
10GHz
/
0.0009
20GHz
/
0.0010
40GHz
/
0.0013
Dielectric Constant Temperature Coefficient
-55 º~150ºC
PPM/℃
-130
Peel Strength
1 OZ RTF copper
N/mm
>2.4
Volume Resistivity
Standard Condition
MΩ.cm
≥1×10^8
Surface Resistivity
Standard Condition
MΩ
≥1×10^8
Electrical Strength (Z direction)
5KW,500V/s
KV/mm
>26
Breakdown Voltage (XY direction)
5KW,500V/s
KV
>35
Coefficientof Thermal Expansion (X, Y direction)
-55 º~288ºC
ppm/ºC
40, 50
Coefficientof Thermal Expansion (Z direction)
-55 º~288ºC
ppm/ºC
290
Thermal Stress
260℃, 10s,3 times
/
No delamination
Water Absorption
20±2℃, 24 hours
%
0.02
Density
Room Temperature
g/cm3
2.18
Long-Term Operating Temperature
High-Low Temperature Chamber
℃
-55～+260
Thermal Conductivity
Z direction
W/(M.K)
0.26
Flammability
/
UL-94
V-0
Material Composition
/
/
PTFE,Ultra-thin and ultra-fine (quartz) fiberglass.
Company Profile
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime... Company Profile
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime...
