| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| Part number | DiClad 880 |
| Laminate thickness | 0.508mm 0.762mm 1.524mm |
| Laminate size | 12"X18"(305X457mm); 18"X12"(457X305mm); 18"X24"(457X610mm); 24"X18"(610X457mm); |
| Copper weight | 0.5OZ(0.018mm)1OZ(0.035mm) |
| Brand Name | Bicheng |
| Model Number | BIC-332.V1.0 |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
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Product Specification
| Payment Terms | T/T | Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
| Part number | DiClad 880 | Laminate thickness | 0.508mm 0.762mm 1.524mm |
| Laminate size | 12"X18"(305X457mm); 18"X12"(457X305mm); 18"X24"(457X610mm); 24"X18"(610X457mm); | Copper weight | 0.5OZ(0.018mm)1OZ(0.035mm) |
| Brand Name | Bicheng | Model Number | BIC-332.V1.0 |
| Certification | UL, ISO9001, IATF16949 | Place of Origin | CHINA |
| High Light | High Speed DiClad 880 laminate ,Copper clad laminate with warranty ,DiClad 880 high frequency laminate | ||
DiClad 880 laminates are woven fiberglass/PTFE composite substrates designed for printed circuit boards. By precisely controlling the fiberglass-to-PTFE ratio, these laminates provide a spectrum of options—from the lowest available dielectric constant and dissipation factor to more heavily reinforced versions with enhanced dimensional stability.
The woven fiberglass reinforcement in DiClad materials delivers superior dimensional stability compared to non-woven fiberglass PTFE laminates with similar dielectric constants. Rogers' controlled process for coating and aligning the fiberglass cloth plies enables a wider selection of dielectric constants and ensures exceptional dielectric constant uniformity.
DiClad 880 laminates are ideal for applications requiring precise electrical performance, such as filters, couplers, and low-noise amplifiers, where dielectric uniformity is essential. They are also well-suited for power dividers and combiners, where low signal loss is critical.
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Features & Benefits:
- Extremely low loss tangent
- Excellent dimensional stability
- High product performance uniformity
- Stable electrical properties across frequency
- Consistent mechanical performance
- Excellent chemical resistance
Typical Applications:
- Military radar feed networks
- Commercial phased array networks
- Low-loss base station antennas
- Missile guidance systems
- Digital radio antennas
- Filters, couplers, and low-noise amplifiers (LNAs)
| Properties | DiClad 880 | Units | Test Conditions | Test Method |
| Electrical Properties | - | - | - | - |
| Dielectric Constant (10 GHz) | 2.17, 2.20 | - | 23˚C @ 50% RH 10 GHz | IPC TM-650 [2.5.5.5](2.5.5.5) |
| Dielectric Constant (1 MHz) | 2.17, 2.20 | - | 23˚C @ 50% RH 1 MHz | IPC TM-650 [2.5.5.3](2.5.5.3) |
| Dissipation Factor (10 GHz) | 0.0009 | - | 23˚C @ 50% RH 10 GHz | IPC TM-650 [2.5.5.5](2.5.5.5) |
| Dissipation Factor (1 MHz) | 0.0008 | - | 23˚C @ 50% RH 1 MHz | IPC TM-650 [2.5.5.3](2.5.5.3) |
| Thermal Coefficient of Dielectric Constant | -160 | ppm/˚C | -10 to 140˚C 10 GHz | IPC TM-650 [2.5.5.5](2.5.5.5) |
| Volume Resistivity | 1.4 x 10⁹ | MΩ-cm | C96/35/90 | IPC TM-650 [2.5.17.1](2.5.17.1) |
| Surface Resistivity | 2.9 x 10⁶ | MΩ | C96/35/90 | IPC TM-650 [2.5.17.1](2.5.17.1) |
| Dielectric Breakdown | >45 | kV | D48/50 | ASTM D-149 |
| Arc Resistance | >180 | - | - | ASTM D-495 |
| Thermal Properties | - | - | - | - |
| Coefficient of Thermal Expansion - x | 25 | ppm/˚C | -50˚C to 150˚C | IPC TM-650 2.4.41 |
| Coefficient of Thermal Expansion - y | 34 | ppm/˚C | -50˚C to 150˚C | IPC TM-650 2.4.41 |
| Coefficient of Thermal Expansion - z | 252 | ppm/˚C | -50˚C to 150˚C | IPC TM-650 2.4.24 |
| Thermal Conductivity | 0.25 | W/(m.K) | - | ASTM E1461 |
| Mechanical Properties | - | - | - | - |
| Copper Peel Strength | 14 | Lbs/in | 10s @288˚C 35 μm foil | IPC TM-650 2.4.8 |
| Young’s Modulus | 267, 202 | kpsi | 23˚C @ 50% RH | ASTM D-638 |
| Tensile Strength (MD, CMD) | 8.1, 7.5 | kpsi | 23˚C @ 50% RH | ASTM D-882 |
| Compressive Modulus | 237 | kpsi | 23˚C @ 50% RH | ASTM D-695 |
| Flex Modulus | 357 | kpsi | 23˚C @ 50% RH | ASTM D-3039 |
| Physical Properties | - | - | - | - |
| Flammability | V-0 | - | C48/23/50 & C168/70 | UL 94 |
| Moisture Absorption | 0.02 | % | E1/105+D24/23 | IPC TM-650 [2.6.2.2](2.6.2.2) |
| Density | 2.23 | g/cm³ | C24/23/50 Method A | ASTM D792 |
| NASA Outgassing | - | - | - | - |
| Total Mass Lost | 0.01 | % | 125°C, ≤ 10⁻⁶ torr | NASA SP-R-0022A |
| Collected Volatiles | 0.01 | % | 125°C, ≤ 10⁻⁶ torr | NASA SP-R-0022A |
| Water Vapor Recovered | 0.0 | % | 125°C, ≤ 10⁻⁶ torr | NASA SP-R-0022A |
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Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification:
Verified Supplier
Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime... Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime...
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