Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| Part number | IsoClad 933 |
| Laminate thickness | 0.381mm 0.787mm 1.575mm |
| Laminate size | 305X460mm(12X18''); 24X18''(610X457mm) |
| Copper weight | 0.5OZ(0.018MM), 1OZ（0.035mm); |
| Brand Name | Bicheng |
| Model Number | BIC-332.V1.0 |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
View Detail Information
Explore similar products
RT / Duroid 5880LZ High Frequency Laminates Copper Clad Sheet For Pcb
High Frequency CuClad 217 Copper Clad Laminate
F4BTMS220 RF Copper Clad Laminate
High Speed RT/duroid 5880 Copper Clad Laminate
Product Specification
| Payment Terms | T/T | Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
| Part number | IsoClad 933 | Laminate thickness | 0.381mm 0.787mm 1.575mm |
| Laminate size | 305X460mm(12X18''); 24X18''(610X457mm) | Copper weight | 0.5OZ(0.018MM), 1OZ（0.035mm); |
| Brand Name | Bicheng | Model Number | BIC-332.V1.0 |
| Certification | UL, ISO9001, IATF16949 | Place of Origin | CHINA |
| High Light | IsoClad 933 PCB substrate ，copper clad laminate sheet ，PCB substrate with warranty | ||
IsoClad® 933 laminates are nonwoven fiberglass-reinforced PTFE composite materials tailored for deployment as printed circuit board (PCB) substrates. The nonwoven reinforcement architecture imparts enhanced flexural capability, making these laminates ideally suited for applications requiring post-fabrication circuit bending—conformal or “wrap-around” antennas represent a prime use case for this attribute.
Unlike standard nonwoven fiberglass/PTFE alternatives, IsoClad series laminates incorporate longer randomly oriented fibers and leverage a proprietary manufacturing process to deliver superior dimensional stability and enhanced dielectric constant (Dk) uniformity, even when compared to competitive products with equivalent dielectric constant values.
With a dielectric constant (Er) of 2.33, IsoClad 933 laminates utilize a higher fiberglass-to-PTFE ratio to form a highly reinforced composite structure. This optimized formulation achieves improved dimensional stability alongside elevated mechanical strength, without compromising core electrical performance.
Features
Benefits
Typical Applications
| Property | Test Method | Condition | IsoClad 933 |
| Dielectric Constant @ 10 GHz | IPC TM-650 2.5.5.5 | C23/50 | 2.33 |
| Dissipation Factor @ 10 GHz | IPC TM-650 2.5.5.5 | C23/50 | 0.0016 |
| Thermal Coefficient of Er (ppm/°C) | IPC TM-650 2.5.5.5 (Adapted) | -10°C to +140°C | -132 |
| Peel Strength (lbs.per inch) | IPC TM-650 2.4.8 | After Thermal | 10 |
| Volume Resistivity (MΩ-cm) | IPC TM-650 2.5.17.1 | C96/35/90 | 3.5 x 10⁸ |
| Surface Resistivity (MΩ) | IPC TM-650 2.5.17.1 | C96/35/90 | 1.0 x 10⁸ |
| Arc Resistance (seconds) | ASTM D-495 | D48/50 | >180 |
| Tensile Modulus (kpsi) | ASTM D-638 | A, 23°C | 173, 147 |
| Tensile Strength (kpsi) | ASTM D-882 | A, 23°C | 6.8, 5.3 |
| Compressive Modulus (kpsi) | ASTM D-695 | A, 23°C | 197 |
| Flexural Modulus (kpsi) | ASTM D-790 | A, 23°C | 239 |
| Dielectric Breakdown (kV) | ASTM D-149 | D48/50 | >45 |
| Density (g/cm³) | ASTM D-792 (Method A) | A, 23°C | 2.27 |
| Water Absorption (%) | MIL-S-13949H 3.7.7; IPC TM-650 2.6.2.2 | E1/105 + D24/23 | 0.05 |
| Coefficient of Thermal Expansion (ppm/°C) | IPC TM-650 2.4.24; Mettler 3000 Thermomechanical Analyzer | 0°C to 100°C | X Axis: 31 |
| Y Axis: 47 | Y Axis: 35 | ||
| Z Axis: 236 | Z Axis: 203 | ||
| Thermal Conductivity (W/mK) | ASTM E-1225 | 100°C | 0.263 |
| Outgassing Requirements | 125°C, ≤10⁻⁶ torr | - | |
| Total Mass Loss (%) | Maximum 1.00% | 125°C, ≤10⁻⁶ torr | 0.03 |
| Collected Volatile Condensable Material (%) | Maximum 0.10% | 125°C, ≤10⁻⁶ torr | 0.00 |
| Water Vapor Regain (%) | - | 125°C, ≤10⁻⁶ torr | 0.02 |
| Visible Condensate | ± | 125°C, ≤10⁻⁶ torr | NO |
| Flammability | UL 94 Vertical Burn; IPC TM-650 2.3.10 | C48/23/50, E24/125 | Meets requirements of UL94-V0 |
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Verified Supplier
Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime... Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime...
Get in touch with us
Leave a Message, we will call you back quickly!