Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| Part number | DiClad 870 |
| Laminate thickness | 0.127mm 0.254mm 0.508mm 0.787mm 2.362mm 3.175mm |
| Laminate size | 8” X 12” (203 X 305mm)；18” X 24” (475 X 610mm) |
| Copper weight | 0.5OZ(0.018MM), 1OZ（0.035mm） |
| Brand Name | Bicheng |
| Model Number | BIC-332.V1.0 |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
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Product Specification
| Payment Terms | T/T | Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
| Part number | DiClad 870 | Laminate thickness | 0.127mm 0.254mm 0.508mm 0.787mm 2.362mm 3.175mm |
| Laminate size | 8” X 12” (203 X 305mm)；18” X 24” (475 X 610mm) | Copper weight | 0.5OZ(0.018MM), 1OZ（0.035mm） |
| Brand Name | Bicheng | Model Number | BIC-332.V1.0 |
| Certification | UL, ISO9001, IATF16949 | Place of Origin | CHINA |
| High Light | High Frequency DiClad 870 laminate ，Copper clad laminate sheet ，DiClad 870 copper laminate | ||
DiClad 870 laminates are woven fiberglass-reinforced PTFE composite materials formulated specifically for deployment as printed circuit board (PCB) substrates. Through precise regulation of the fiberglass-to-PTFE ratio, DiClad 870 laminates deliver a diversified product portfolio—spanning variants with ultra-low dielectric constant (Dk) and dissipation factor (Df), to highly reinforced grades optimized for enhanced dimensional stability.
The woven fiberglass reinforcement inherent to DiClad series materials confers superior dimensional stability compared to nonwoven fiberglass-reinforced PTFE laminates of equivalent dielectric constant. Rogers’ stringent consistency and process control over PTFE-coated fiberglass cloth not only enables a broader spectrum of available Dk values, but also yields laminates with improved dielectric constant uniformity relative to comparable nonwoven fiberglass-reinforced alternatives. The coated fiberglass plies within DiClad 870 materials are unidirectionally aligned; cross-plied configurations of most grades are offered under the CuClad product line.
DiClad 870 laminates are ideally suited for applications where dielectric constant uniformity is a critical performance criterion, including RF filters, couplers, and low-noise amplifiers (LNAs). They are also well-positioned for power dividers and combiners, where minimal signal loss is paramount.
Features & Benefits
Typical Applications
| Properties | DiClad 870 | Units | Test Conditions | Test Method |
| Electrical Properties | - | - | - | - |
| Dielectric Constant (10 GHz) | 2.33 | - | 23˚C @ 50% RH 10 GHz | IPC TM-650 [2.5.5.5](2.5.5.5) |
| Dielectric Constant (1 MHz) | 2.33 | - | 23˚C @ 50% RH 1 MHz | IPC TM-650 [2.5.5.3](2.5.5.3) |
| Dissipation Factor (10 GHz) | 0.0013 | - | 23˚C @ 50% RH 10 GHz | IPC TM-650 [2.5.5.5](2.5.5.5) |
| Dissipation Factor (1 MHz) | 0.0009 | - | 23˚C @ 50% RH 1 MHz | IPC TM-650 [2.5.5.3](2.5.5.3) |
| Thermal Coefficient of Dielectric Constant | -161 | ppm/˚C | -10 to 140˚C 10 GHz | IPC TM-650 [2.5.5.5](2.5.5.5) |
| Volume Resistivity | 1.5 x 10⁹ | MΩ-cm | C96/35/90 | IPC TM-650 [2.5.17.1](2.5.17.1) |
| Surface Resistivity | 3.4 x 10⁷ | MΩ | C96/35/90 | IPC TM-650 [2.5.17.1](2.5.17.1) |
| Dielectric Breakdown | >45 | kV | D48/50 | ASTM D-149 |
| Arc Resistance | >180 | - | - | ASTM D-495 |
| Thermal Properties | - | - | - | - |
| Coefficient of Thermal Expansion - x | 17 | ppm/˚C | -50˚C to 150˚C | IPC TM-650 2.4.41 |
| Coefficient of Thermal Expansion - y | 29 | ppm/˚C | -50˚C to 150˚C | IPC TM-650 2.4.41 |
| Coefficient of Thermal Expansion - z | 217 | ppm/˚C | -50˚C to 150˚C | IPC TM-650 2.4.24 |
| Thermal Conductivity | 0.26 | W/(m.K) | - | ASTM E1461 |
| Mechanical Properties | - | - |
- |
- |
| Copper Peel Strength | 14 | Lbs/in | 10s @288˚C 35 μm foil | IPC TM-650 2.4.8 |
| Young’s Modulus | 485, 346 | kpsi | 23˚C @ 50% RH | ASTM D-638 |
| Tensile Strength (MD, CMD) | 14.9, 11.2 | kpsi | 23˚C @ 50% RH | ASTM D-882 |
| Compressive Modulus | 327 | kpsi | 23˚C @ 50% RH | ASTM D-695 |
| Flex Modulus | 437 | kpsi | 23˚C @ 50% RH | ASTM D-3039 |
| Physical Properties | - | - | - | - |
| Flammability | V-0 | - | C48/23/50 & C168/70 | UL 94 |
| Moisture Absorption | 0.02 | % | E1/105+D24/23 | IPC TM-650 [2.6.2.2](2.6.2.2) |
| Density | 2.26 | g/cm³ | C24/23/50 Method A | ASTM D792 |
| NASA Outgassing | - | - | - | - |
| Total Mass Lost | 0.02 | % | 125°C, ≤ 10⁻⁶ torr | NASA SP-R-0022A |
| Collected Volatiles | 0.00 | % | 125°C, ≤ 10⁻⁶ torr | NASA SP-R-0022A |
| Water Vapor Recovered | 0.01 | % | 125°C, ≤ 10⁻⁶ torr | NASA SP-R-0022A |
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Verified Supplier
Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 18 years of industry experience, the company serves global sectors including cellular base station antennas, satelli... Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 18 years of industry experience, the company serves global sectors including cellular base station antennas, satelli...
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