Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| Part number | F4BM233 |
| Laminate thickness | 0.1mm 0.127mm 0.2mm 0.25mm 0.5mm 0.508mm 0.762mm 0.8mm 1.0mm 1.5mm 1.524mm 1.575mm 2.0mm 2.5mm 3.0mm 4.0mm 5.0mm 6.0mm 8.0mm 10mm 12mmm |
| Laminate size | 460x610mm, 500X600mm, 850X1200mm, 914X1220mm, 1000X1200mm, 300X250mm, 350X380mm, 500X500mm, 840X840mm, 1000X1500mm |
| Copper weight | 0.5OZ(0.018MM), 1OZ（0.035mm);1.5OZ（0.05mm），2OZ（0.07mm） |
| Brand Name | Bicheng |
| Model Number | BIC-332.V1.0 |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
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Product Specification
| Payment Terms | T/T | Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
| Part number | F4BM233 | Laminate thickness | 0.1mm 0.127mm 0.2mm 0.25mm 0.5mm 0.508mm 0.762mm 0.8mm 1.0mm 1.5mm 1.524mm 1.575mm 2.0mm 2.5mm 3.0mm 4.0mm 5.0mm 6.0mm 8.0mm 10mm 12mmm |
| Laminate size | 460x610mm, 500X600mm, 850X1200mm, 914X1220mm, 1000X1200mm, 300X250mm, 350X380mm, 500X500mm, 840X840mm, 1000X1500mm | Copper weight | 0.5OZ(0.018MM), 1OZ（0.035mm);1.5OZ（0.05mm），2OZ（0.07mm） |
| Brand Name | Bicheng | Model Number | BIC-332.V1.0 |
| Certification | UL, ISO9001, IATF16949 | Place of Origin | CHINA |
| High Light | F4BM233 copper clad laminate sheet ，PCB substrate copper laminate ，copper clad laminate with warranty | ||
F4BM233 is a composite material engineered from fiberglass cloth, PTFE resin, and PTFE film through a precisely controlled scientific formulation and lamination process. It delivers enhanced electrical performance compared to standard F4B laminates, including a wider dielectric constant range, lower loss, higher insulation resistance, and greater operational stability, enabling it to serve as a direct substitute for comparable imported materials.
F4BM233 and F4BME233 share the same dielectric composition but are furnished with different copper foil options. F4BM233 is supplied with ED copper and is suitable for applications without passive intermodulation (PIM) requirements. F4BME233 features reverse-treated RTF foil, providing excellent PIM performance, improved etching accuracy for finer circuits, and reduced conductor loss.
The dielectric constant of F4BM233 is precisely tuned by adjusting the ratio of PTFE to fiberglass reinforcement. This achieves an optimal balance between low loss and enhanced dimensional stability. Higher dielectric constant grades incorporate a greater proportion of fiberglass, resulting in improved dimensional stability, lower coefficient of thermal expansion (CTE), better thermal drift performance, and a corresponding, controlled increase in dielectric loss.
Key Features
Typical Applications
| Product Technical Parameters | Product Model & Data Sheet | |||
| Product Features | Test Conditions | Unit | F4BM233 | |
| Dielectric Constant (Typical) | 10GHz | / | 2.33 | |
| Dielectric Constant Tolerance | / | / |
±0.04 |
|
| Loss Tangent (Typical) | 10GHz | / | 0.0011 | |
| 20GHz | / | 0.0015 | ||
| Dielectric Constant Temperature Coefficient | -55ºC～150ºC | PPM/℃ | -130 | |
| Peel Strength | 1 OZ F4BM | N/mm | >1.8 | |
| 1 OZ F4BME | N/mm | >1.6 | ||
| Volume Resistivity | Standard Condition | MΩ.cm | ≥6×10^6 | |
| Surface Resistivity | Standard Condition | MΩ | ≥1×10^6 | |
| Electrical Strength (Z direction) | 5KW,500V/s | KV/mm | >23 | |
| Breakdown Voltage (XY direction) | 5KW,500V/s | KV | >32 | |
| Coefficientof Thermal Expansion | XY direction | -55 º~288ºC | ppm/ºC | 22, 30 |
| Z direction | -55 º~288ºC | ppm/ºC | 205 | |
| Thermal Stress | 260℃, 10s,3 times | No delamination | ||
| Water Absorption | 20±2℃, 24 hours | % | ≤0.08 | |
| Density | Room Temperature | g/cm3 | 2.20 | |
| Long-Term Operating Temperature | High-Low Temperature Chamber | ℃ | -55～+260 | |
| Thermal Conductivity | Z direction | W/(M.K) | 0.28 | |
| PIM | Only applicable to F4BME | dBc | ≤-159 | |
| Flammability | / | UL-94 | V-0 | |
| Material Composition | / | / | PTFE, Fiberglass Cloth F4BM paired with ED copper foil, F4BME paired with reverse-treated (RTF) copper foil. |
|
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Verified Supplier
Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 18 years of industry experience, the company serves global sectors including cellular base station antennas, satelli... Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 18 years of industry experience, the company serves global sectors including cellular base station antennas, satelli...
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