Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| Part number | TLY-5Z |
| Laminate thickness | 0.127mm 0.254mm 0.508mm 0.762mm 1.524mm 1.575mm 1.016mm 3.175mm |
| Laminate size | 12X18 inch, 16X18 inch, 18X24 inch |
| Copper weight | 1OZ（0.035mm） |
| Brand Name | Bicheng |
| Model Number | BIC-332.V1.0 |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
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Product Specification
| Payment Terms | T/T | Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
| Part number | TLY-5Z | Laminate thickness | 0.127mm 0.254mm 0.508mm 0.762mm 1.524mm 1.575mm 1.016mm 3.175mm |
| Laminate size | 12X18 inch, 16X18 inch, 18X24 inch | Copper weight | 1OZ（0.035mm） |
| Brand Name | Bicheng | Model Number | BIC-332.V1.0 |
| Certification | UL, ISO9001, IATF16949 | Place of Origin | CHINA |
| High Light | RF PCB copper clad laminate ，TLY-5Z substrate laminate sheet ，copper clad laminate RF substrate | ||
TLY-5Z laminates are high-performance, glass-filled PTFE composites integrated with woven fiberglass reinforcement. Engineered specifically for low-density use cases, this glass-loaded structure is optimized for weight-sensitive applications such as aerospace systems with stringent lightweight requirements.
This specialized formulation yields a dimensionally stable composite—a performance attribute unattainable with non-reinforced PTFE materials. The low-density design also endows the composite with a minimized Z-axis coefficient of thermal expansion (CTE), a characteristic that conventional PTFE-rich composites cannot replicate. Compared to standard low-dielectric-constant PTFE composites, TLY-5Z delivers far superior thermal stability, effectively mitigating Z-axis expansion-induced stress on plated through holes (PTHs).
From a cost standpoint, TLY-5Z represents a highly competitive solution. Its glass-filled architecture offers a cost-effective alternative to standard PTFE-rich copper-clad laminates, making it viable for high-volume commercial microwave applications where PTFE-dominant substrates would be economically prohibitive. TLY-5Z is uniquely suited for printed wiring board (PWB) designs that pose extreme manufacturing challenges or exhibit thermal unreliability when fabricated with traditional PTFE-rich substrates. Conventional PTFE-dominant substrates are prone to PTH drilling defects, often requiring thick copper plating to ensure basic reliability; even then, the resulting PWBs are susceptible to thermal cycle-induced cracking. By contrast, TLY-5Z features 50% lower thermal expansion than PTFE-rich substrates, boasts enhanced drillability, and demonstrates robust thermal cycling resistance. Ground stitching along transmission lines can be implemented seamlessly while maintaining long-term thermal reliability. For complex multilayer stripline designs, TLY-5Z outperforms legacy PTFE-rich substrates by a significant margin. Additionally, this material is well-suited for Substrate Integrated Waveguide (SIW) applications incorporating numerous mode-suppression vias.
TLY-5Z is fully compatible with ultra-smooth copper foils, including the latest ULP (ultra-low profile) copper foil variants. It also exhibits a reduced temperature coefficient of dielectric constant (TcK) relative to conventional materials with a dielectric constant of 2.2.
Key Benefits
Typical Applications
| TLY-5Z Typical Values | |||||
| Property | Test Method | Unit | Value | Unit | Value |
| Dk @ 1.9 GHz | IPC-650 2.5.5.5.1 Mod. | 2.20+/- 0.04 | 2.20+/- 0.04 | ||
| Df @ 1.9 GHz | IPC-650 2.5.5.5.1 Mod. | 0.001 | 0.001 | ||
| Df @ 10 GHz | IPC-650 2.5.5.5.1 Mod. | 0.0015 | 0.0015 | ||
| Tc(D)K (-55 ~150°C) | IPC-650 2.5.5.6 Mod. | ppm/°C | -72 | ppm/°C | -72 |
| Dielectric Breakdown Voltage | IPC-650 2.5.6 | kV | 45 | kV | 45 |
| Dielectric Strength | IPC-650 2.5.6.2 | V/mil | 770 | V/mm | 30,315 |
| Moisture Absorption | IPC-650 2.6.2.1 | % | 0.03 | % | 0.03 |
| Peel Strength (1 oz. copper) | IPC-650 2.4.8 | lbs./inch | 7 | N/mm | 1.3 |
| Volume Resistivity | IPC-650 2.5.17.1 | Mohms/cm | 10^9 | Mohms/cm | 10^9 |
| Surface Resistivity | IPC-650 2.5.17.1 | Mohms | 10^8 | Mohms | 10^8 |
| Tensile Strength (MD) | IPC-650 2.4.18.3 | psi | 9137 | N/mm2 | 63 |
| Tensile Strength (CD) | IPC-650 2.4.18.3 | psi | 9572 | N/mm2 | 66 |
| Tensile Modulus (MD) | IPC-650 2.4.18.3 | psi | 182,748 | N/mm2 | 1260 |
| Tensile Modulus (CD) | IPC-650 2.4.18.3 | psi | 165,344 | N/mm2 | 1140 |
| Elongation (MD) | IPC-650 2.4.18.3 | % | 6 | % | 6 |
| Elongation (CD) | IPC-650 2.4.18.3 | % | 6.9 | % | 6.9 |
| Flex Strength (MD) | ASTM D790 | psi | 10,300 | N/mm2 | 71 |
| Flex Strength (CD) | ASTM D790 | psi | 11,600 | N/mm2 | 80 |
| Flex Modulus (MD) | ASTM D790 | psi | 377,100 | N/mm2 | 2600 |
| Flex Modulus (CD) | ASTM D790 | psi | 432,213 | N/mm2 | 2980 |
| Dimensional Stability (MD) | IPC-650 2.4.39 (Bake) | % (10 mil) | -0.05 | % (30 mil) | -0.05 |
| Dimensional Stability (CD) | IPC-650 2.4.39 (Bake) | % (10 mil) | -0.17 | % (30 mil) | -0.11 |
| Dimensional Stability (MD) | IPC-650 2.4.39 (Stress) | % (10 mil) | -0.07 | % (30 mil) | -0.07 |
| Dimensional Stability (CD) | IPC-650 2.4.39 (Stress) | % (10 mil) | -0.22 | % (30 mil) | -0.14 |
| Density (Specific Gravity) | IPC-650 2.3.5 | g/cm3 | 1.92 | g/cm3 | 1.92 |
| Specific Heat | IPC-650 2.4.50 | J/g°C | 0.95 | J/g°C | 0.95 |
| Thermal Conductivity | IPC-650 2.4.50 | W/M*K | 0.2 | W/M*K | 0.2 |
| CTE (x-y) (50 - 150°C) | IPC-650 2.4.41 | ppm/ºC | 30-40 | ppm/ºC | 30-40 |
| CTE (z) (50 - 150°C) | IPC-650 2.4.41 | ppm/ºC | 130 | ppm/ºC | 130 |
| Hardness | ASTM D2240 (Durometer) | - | 68 | - | 68 |
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Verified Supplier
Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 18 years of industry experience, the company serves global sectors including cellular base station antennas, satellite communications, ... Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd. is a well-established supplier and exporter of high-frequency PCBs based in Shenzhen, China. With 18 years of industry experience, the company serves global sectors including cellular base station antennas, satellite communications, ...
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