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Bicheng Electronics Technology Co., Ltd

  • China,Shenzhen ,Guangdong
  • Verified Supplier
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China F4BME220 PCB Raw Material Copper Clad Laminate Sheet
China F4BME220 PCB Raw Material Copper Clad Laminate Sheet

  1. China F4BME220 PCB Raw Material Copper Clad Laminate Sheet

F4BME220 PCB Raw Material Copper Clad Laminate Sheet

  1. MOQ: 1PCS
  2. Price: USD9.99-99.99
  3. Get Latest Price
Payment Terms T/T
Supply Ability 5000PCS per month
Delivery Time 8-9 working days
Packaging Details Vacuum bags+Cartons
Part number F4BME220
Laminate thickness 0.1mm 0.127mm 0.2mm 0.25mm 0.5mm 0.508mm 0.762mm 0.8mm 1.0mm 1.5mm 1.524mm 1.575mm 2.0mm 2.5mm 3.0mm 4.0mm 5.0mm 6.0mm 8.0mm 10mm 12mmm
Laminate size 460x610mm, 500X600mm, 850X1200mm, 914X1220mm, 1000X1200mm, 300X250mm, 350X380mm, 500X500mm, 840X840mm, 1000X1500mm
Copper weight 0.5OZ(0.018MM), 1OZ(0.035mm)
Brand Name Bicheng
Model Number BIC-332.V1.0
Certification UL, ISO9001, IATF16949
Place of Origin CHINA

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  1. Product Details
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Product Specification

Payment Terms T/T Supply Ability 5000PCS per month
Delivery Time 8-9 working days Packaging Details Vacuum bags+Cartons
Part number F4BME220 Laminate thickness 0.1mm 0.127mm 0.2mm 0.25mm 0.5mm 0.508mm 0.762mm 0.8mm 1.0mm 1.5mm 1.524mm 1.575mm 2.0mm 2.5mm 3.0mm 4.0mm 5.0mm 6.0mm 8.0mm 10mm 12mmm
Laminate size 460x610mm, 500X600mm, 850X1200mm, 914X1220mm, 1000X1200mm, 300X250mm, 350X380mm, 500X500mm, 840X840mm, 1000X1500mm Copper weight 0.5OZ(0.018MM), 1OZ(0.035mm)
Brand Name Bicheng Model Number BIC-332.V1.0
Certification UL, ISO9001, IATF16949 Place of Origin CHINA
High Light F4BME220 copper clad laminate sheetPCB raw material copper laminatecopper clad laminate with warranty

F4BME220 is manufactured through precise processes using fiberglass cloth, polytetrafluoroethylene (PTFE) resin, and PTFE film. It exhibits superior electrical properties compared to standard F4B, including a broader dielectric constant range, lower dielectric loss, higher insulation resistance, and enhanced stability, making it a viable alternative to comparable international products.

The dielectric layers of F4BM220 and F4BME220 are identical, but they employ different copper foils: F4BM220 uses ED copper foil and is intended for applications where PIM is not specified; F4BME220 utilizes reverse-treated RTF copper foil, delivering excellent PIM performance, more accurate circuit control, and reduced conductor loss.

Both F4BM220 and F4BME220 allow precise adjustment of the dielectric constant by modifying the ratio of PTFE to fiberglass cloth. This optimization achieves low signal loss while improving dimensional stability. A higher dielectric constant corresponds to a greater fiberglass content, resulting in better dimensional stability, a lower coefficient of thermal expansion, improved temperature drift characteristics, and a moderate increase in dielectric loss.

Product Features:

  • Dielectric constant (Dk) options from 2.2
  • Low loss characteristics
  • F4BME with RTF copper foil provides excellent PIM performance
  • Variety of dimensions to reduce material waste and cost
  • Radiation-resistant with low outgassing
  • Commercially available in volume at a competitive price

Typical Applications:

  • Microwave, RF, and radar systems
  • Phase shifters and passive components
  • Power dividers, couplers, and combiners
  • Feed networks and phased array antennas
  • Satellite communications and base station antennas

 

Product Technical Parameters Product Model & Data Sheet
Product Features Test Conditions Unit F4BME220
Dielectric Constant (Typical) 10GHz / 2.2
Dielectric Constant Tolerance / / ±0.04
Loss Tangent (Typical) 10GHz / 0.001
20GHz / 0.0014
Dielectric Constant Temperature Coefficient -55ºC~150ºC PPM/℃ -142
Peel Strength 1 OZ F4BM N/mm >1.8
1 OZ F4BME N/mm >1.6
Volume Resistivity Standard Condition MΩ.cm ≥6×10^6
Surface Resistivity Standard Condition ≥1×10^6
Electrical Strength (Z direction) 5KW,500V/s KV/mm >23
Breakdown Voltage (XY direction) 5KW,500V/s KV >30
Coefficientof Thermal Expansion XY direction -55 º~288ºC ppm/ºC 25, 34
Z direction -55 º~288ºC ppm/ºC 240
Thermal Stress 260℃, 10s,3 times No delamination
Water Absorption 20±2℃, 24 hours % ≤0.08
Density Room Temperature g/cm3 2.18
Long-Term Operating Temperature High-Low Temperature Chamber -55~+260
Thermal Conductivity Z direction W/(M.K) 0.24
PIM Only applicable to F4BME dBc ≤-159
Flammability / UL-94 V-0
Material Composition / /  

 

Company Details

Bronze Gleitlager

,

Bronze Sleeve Bushings

 and 

Graphite Plugged Bushings

 from Quality China Factory
  • Business Type:

    Manufacturer,Distributor/Wholesaler,Exporter,Seller

  • Year Established:

    2003

  • Total Annual:

    10 million-18 million

  • Employee Number:

    350~450

  • Ecer Certification:

    Verified Supplier

Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime... Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime...

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  • Bicheng Electronics Technology Co., Ltd
  • 6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103
  • https://www.rfpcb-board.com/

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