| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| Part number | F4BME220 |
| Laminate thickness | 0.1mm 0.127mm 0.2mm 0.25mm 0.5mm 0.508mm 0.762mm 0.8mm 1.0mm 1.5mm 1.524mm 1.575mm 2.0mm 2.5mm 3.0mm 4.0mm 5.0mm 6.0mm 8.0mm 10mm 12mmm |
| Laminate size | 460x610mm, 500X600mm, 850X1200mm, 914X1220mm, 1000X1200mm, 300X250mm, 350X380mm, 500X500mm, 840X840mm, 1000X1500mm |
| Copper weight | 0.5OZ(0.018MM), 1OZ(0.035mm) |
| Brand Name | Bicheng |
| Model Number | BIC-332.V1.0 |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
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Product Specification
| Payment Terms | T/T | Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
| Part number | F4BME220 | Laminate thickness | 0.1mm 0.127mm 0.2mm 0.25mm 0.5mm 0.508mm 0.762mm 0.8mm 1.0mm 1.5mm 1.524mm 1.575mm 2.0mm 2.5mm 3.0mm 4.0mm 5.0mm 6.0mm 8.0mm 10mm 12mmm |
| Laminate size | 460x610mm, 500X600mm, 850X1200mm, 914X1220mm, 1000X1200mm, 300X250mm, 350X380mm, 500X500mm, 840X840mm, 1000X1500mm | Copper weight | 0.5OZ(0.018MM), 1OZ(0.035mm) |
| Brand Name | Bicheng | Model Number | BIC-332.V1.0 |
| Certification | UL, ISO9001, IATF16949 | Place of Origin | CHINA |
| High Light | F4BME220 copper clad laminate sheet ,PCB raw material copper laminate ,copper clad laminate with warranty | ||
F4BME220 is manufactured through precise processes using fiberglass cloth, polytetrafluoroethylene (PTFE) resin, and PTFE film. It exhibits superior electrical properties compared to standard F4B, including a broader dielectric constant range, lower dielectric loss, higher insulation resistance, and enhanced stability, making it a viable alternative to comparable international products.
The dielectric layers of F4BM220 and F4BME220 are identical, but they employ different copper foils: F4BM220 uses ED copper foil and is intended for applications where PIM is not specified; F4BME220 utilizes reverse-treated RTF copper foil, delivering excellent PIM performance, more accurate circuit control, and reduced conductor loss.
Both F4BM220 and F4BME220 allow precise adjustment of the dielectric constant by modifying the ratio of PTFE to fiberglass cloth. This optimization achieves low signal loss while improving dimensional stability. A higher dielectric constant corresponds to a greater fiberglass content, resulting in better dimensional stability, a lower coefficient of thermal expansion, improved temperature drift characteristics, and a moderate increase in dielectric loss.
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Product Features:
Typical Applications:
| Product Technical Parameters | Product Model & Data Sheet | |||
| Product Features | Test Conditions | Unit | F4BME220 | |
| Dielectric Constant (Typical) | 10GHz | / | 2.2 | |
| Dielectric Constant Tolerance | / | / | ±0.04 | |
| Loss Tangent (Typical) | 10GHz | / | 0.001 | |
| 20GHz | / | 0.0014 | ||
| Dielectric Constant Temperature Coefficient | -55ºC~150ºC | PPM/℃ | -142 | |
| Peel Strength | 1 OZ F4BM | N/mm | >1.8 | |
| 1 OZ F4BME | N/mm | >1.6 | ||
| Volume Resistivity | Standard Condition | MΩ.cm | ≥6×10^6 | |
| Surface Resistivity | Standard Condition | MΩ | ≥1×10^6 | |
| Electrical Strength (Z direction) | 5KW,500V/s | KV/mm | >23 | |
| Breakdown Voltage (XY direction) | 5KW,500V/s | KV | >30 | |
| Coefficientof Thermal Expansion | XY direction | -55 º~288ºC | ppm/ºC | 25, 34 |
| Z direction | -55 º~288ºC | ppm/ºC | 240 | |
| Thermal Stress | 260℃, 10s,3 times | No delamination | ||
| Water Absorption | 20±2℃, 24 hours | % | ≤0.08 | |
| Density | Room Temperature | g/cm3 | 2.18 | |
| Long-Term Operating Temperature | High-Low Temperature Chamber | ℃ | -55~+260 | |
| Thermal Conductivity | Z direction | W/(M.K) | 0.24 | |
| PIM | Only applicable to F4BME | dBc | ≤-159 | |
| Flammability | / | UL-94 | V-0 | |
| Material Composition | / | / | ||
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Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification:
Verified Supplier
Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime... Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime...
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