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Hefei Purple Horn E-Commerce Co., Ltd.

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China ASDSemi ASDM40DN20E R 40V Dual N Channel Power MOSFET with Low R DS ON and
China ASDSemi ASDM40DN20E R 40V Dual N Channel Power MOSFET with Low R DS ON and

  1. China ASDSemi ASDM40DN20E R 40V Dual N Channel Power MOSFET with Low R DS ON and

ASDSemi ASDM40DN20E R 40V Dual N Channel Power MOSFET with Low R DS ON and

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Drain to Source Voltage 40V
Current - Continuous Drain(Id) 20A
RDS(on) 19mΩ@10V
Operating Temperature - -55℃~+150℃
Gate Threshold Voltage (Vgs(th)) 2.5V@250uA
Reverse Transfer Capacitance (Crss@Vds) 16pF@20V
Output Capacitance(Coss) 112pF
Pd - Power Dissipation 21W
Input Capacitance(Ciss) 800pF
Gate Charge(Qg) 23.6nC@10V
Description 40V 20A 21W PDFN3.3x3.3-8
Mfr. Part # ASDM40DN20E-R
Package PDFN3.3x3.3-8
Model Number ASDM40DN20E-R

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  1. Product Details
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Product Specification

Drain to Source Voltage 40V Current - Continuous Drain(Id) 20A
RDS(on) 19mΩ@10V Operating Temperature - -55℃~+150℃
Gate Threshold Voltage (Vgs(th)) 2.5V@250uA Reverse Transfer Capacitance (Crss@Vds) 16pF@20V
Output Capacitance(Coss) 112pF Pd - Power Dissipation 21W
Input Capacitance(Ciss) 800pF Gate Charge(Qg) 23.6nC@10V
Description 40V 20A 21W PDFN3.3x3.3-8 Mfr. Part # ASDM40DN20E-R
Package PDFN3.3x3.3-8 Model Number ASDM40DN20E-R

Product Overview

The Ascend Semiconductor ASDM40DN20E is a 40V Dual N-Channel Power MOSFET designed with Trench Power LV MOSFET technology. It features an excellent package for heat dissipation and a high-density cell design for low RDS(ON). This MOSFET is suitable for high current load applications, load switching, hard switched and high frequency circuits, and uninterruptible power supplies.

Product Attributes

  • Brand: Ascend Semiconductor Co.,Ltd
  • Type: Dual N-Channel Power MOSFET
  • Technology: Trench Power LV MOSFET
  • Package: PDFN 3.3x3.3-8

Technical Specifications

Parameter Symbol Conditions Min Typ Max Unit
Absolute Maximum Ratings
Drain-source Voltage VDS 40 V
Gate-source Voltage VGS ±20 V
Drain Current ID TC=25 20 A
Drain Current ID TC=100 16 A
Pulsed Drain Current IDM 80 A
Single Pulse Avalanche Energy EAS 70 mJ
Total Power Dissipation PD TC=25 21 W
Junction-to-Case Thermal Resistance RJC 3.0 / W
Junction and Storage Temperature Range TJ ,TSTG -55 +150
Junction-to-Ambient Thermal Resistance RJA 35 / W
Static Characteristics
Drain-Source Breakdown Voltage BVDSS VGS= 0V, ID=250A 40 V
Zero Gate Voltage Drain Current IDSS VDS=40V,VGS=0V 1 A
Gate-Body Leakage Current IGSS VGS= ±20V, VDS=0V ±100 nA
Gate Threshold Voltage VGS(th) VDS= VGS, ID=250A 1.0 1.5 2.5 V
Static Drain-Source On-Resistance RDS(ON) VGS= 10V, ID=20A 15 19 m
Static Drain-Source On-Resistance RDS(ON) VGS= 4.5V, ID=10A 18 25 m
Diode Forward Voltage VSD IS=20A,VGS=0V 0.7 1.2 V
Dynamic Characteristics
Input Capacitance Ciss VDS=20V,VGS=0V,f=1MHz 800 pF
Output Capacitance Coss 112 pF
Reverse Transfer Capacitance Crss 94 pF
Switching Characteristics
Total Gate Charge Qg VGS=10V,VDS=20V,ID=20A 23.6 nC
Gate-Source Charge Qgs 4.4 nC
Gate-Drain Charge Qgd 6.3 nC
Reverse Recovery Charge Qrr IF=20A, di/dt=100A/us 0.4 nC
Reverse Recovery Time trr 7 ns
Turn-on Delay Time tD(on) VGS=10V,VDD=20V, ID=2A,RGEN=3 10 ns
Turn-on Rise Time tr 56 ns
Turn-off Delay Time tD(off) 27 ns
Turn-off fall Time tf 72 ns

Note: Pulse Test: Pulse Width≤300µs, Duty cycle ≤2%.

Note: RJA is the sum of the junction-to-case and case-to-ambient thermal resistance, where the case thermal reference is defined as the solder mounting surface of the drain pins. RJC is guaranteed by design, while RJA is determined by the board design. The maximum rating presented here is based on mounting on a 1 in² pad of 2oz copper.

Ordering Information:

Device No. Marking Package Packing Quantity
ASDM40DN20E-R 40DN20 PDFN3.3*3.3-8 Tape&Reel 5000/Reel

Package Outline Data (PDFN3.3*3.3-8):

Symbol Dimensions (unit: mm) Min Typ Max
A 0.70 0.75 0.80
b 0.25 0.30 0.35
c 0.10 0.15 0.25
D 3.25 3.35 3.45
D1 3.00 3.10 3.20
D2 1.78 1.88 1.98
D3 -- 0.13 --
E 3.20 3.30 3.40
E1 3.00 3.15 3.20
E2 2.39 2.49 2.59
e 0.65 BSC
H 0.30 0.39 0.50
L 0.30 0.40 0.50
L1 -- 0.13 --
K 0.30 -- --
θ -- 10° 12°
M * 0.15 * *

Note: 1. Refer to JEDEC MO-240 variation CA. 2. Dimensions "D1" and "E1" do NOT include mold flash protrusions or gate burrs. 3. Dimensions "D1" and "E1" include interterminal flash or protrusion. Interterminal flash or protrusion shall not exceed 0.25mm per side.


2410121523_ASDsemi-ASDM40DN20E-R_C2972863.pdf

Company Details

Bronze Gleitlager

,

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 and 

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 from Quality China Factory
  • Business Type:

    Manufacturer,Distributor/Wholesaler,Agent,Importer

  • Year Established:

    2009

  • Employee Number:

    300~500

  • Ecer Certification:

    Verified Supplier

Company Profile Hefei Purple Horn E-Commerce Co., Ltd. is a professional company focus on integrated circuit ic business. Hefei Purple Horn E-Commerce Co., Ltd. will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining and... Company Profile Hefei Purple Horn E-Commerce Co., Ltd. is a professional company focus on integrated circuit ic business. Hefei Purple Horn E-Commerce Co., Ltd. will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining and...

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Get in touch with us

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  • Hefei Purple Horn E-Commerce Co., Ltd.
  • Room 1306B, Building A, Xindi Center, Qimen Road, Hefei City, Anhui Province
  • https://www.semiconductoric.com/

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