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Manufacturer of a wide range of products which include 1-30Layer FR4 TG170 PC PCB Assembly for New Energy Equipment China and Cambodia,Multilayer PCB Assembly Manufacturer New Energy Circuit Board With Impedance,Turnkey ENIG PCBA ...
MOQ: 5pcs
Price: USD1/PCS
| Payment Terms | T/T,Paypal |
| Supply Ability | 100pcs/hour |
| Delivery Time | 1-2 weeks after all parts collected |
| Packaging Details | 60*40*30cm cartons and ESD bags |
| Layer | 1-22 layers |
| Materials | CEM1, CEM3, FR-4, High Tg FR-4, Aluminum board |
| CE | ISO9001, ISO13485, TS16949 and UL E476377 |
| PCB thickness | 1.6 ±0.1mm |
| Max. board Thickness | 6.0mm |
| Surface finished | Lead free,Immersion ENIG,Chem Tin,Flash Gold,OSP,Gold finger,Peelable,Immersion Silver |
| Brand Name | Suntek |
| Model Number | SBBF03 |
| Certification | ISO9001, ISO13485, TS16949 and UL E476377 |
| Place of Origin | China/Cambodia |
MOQ: 5pcs
Price: 1-100USD/PCS
| Payment Terms | T/T, T/T, Paypal |
| Supply Ability | 100pcs/hour |
| Delivery Time | 1 week after all components collected |
| Packaging Details | Vacuum,Anti-static,ESD,Cartons |
| Base Material | FR4,Rogers,Halogen free |
| bUID-UP mATERIAL | RCC,FR4 |
| Max Layer | 30L |
| Max.PCB Size(mm) | 1500*1200mm |
| Base copper weight | 1/4OZ-2OZ |
| Impedance Contronl | +/-10% |
| Surface Finish | ENIG/OSP/HASL/Au Plating/Immersion Tin |
| Tolerance of PTH | +/-0.05mm |
| Brand Name | Suntek |
| Model Number | SE45 |
| Certification | ISO9001, ISO13485, TS16949 and UL E476377 |
| Place of Origin | China/Cambodia |
MOQ: No Limited
Price: Customized products
| Payment Terms | T/T |
| Delivery Time | 5-7days after all components kitted |
| Packaging Details | By ESD bags and carton |
| Material: | FR4(Tg130-Tg180)/Rogers/Aluminum |
| Copper: | 0.5OZ-10OZ |
| SMT,THT: | Yes |
| Solder Mask: | Green,Blue,Black,Red,White,Matt Color |
| Thickness: | 1.0mm/1.6mm/2mm/4mm |
| RoHs: | Lead Or Lead Free |
| Layer: | 1L-32L |
| Warranty: | 1year |
| Hole Min.: | 0.1mm |
| Brand Name | Suntek/BLSuntek |
| Model Number | F025-1012 |
| Certification | ISO9001 ISO13485 IATF16949 UL |
| Place of Origin | China or Cambodia |
MOQ: No Limited
Price: Customized products
| Payment Terms | T/T |
| Delivery Time | 5-7days after all components kitted |
| Packaging Details | By ESD bags and carton |
| Material: | FR4(Tg130-Tg180)/Rogers/Aluminum |
| Copper: | 0.5OZ-10OZ |
| SMT,THT: | Yes |
| Solder Mask: | Green,Blue,Black,Red,White,Matt Color |
| Thickness: | 1.0mm/1.6mm/2mm/4mm |
| RoHs: | Lead Or Lead Free |
| Layer: | 1L-32L |
| Warranty: | 1year |
| Hole Min.: | 0.1mm |
| Brand Name | Suntek/BLSuntek |
| Model Number | F025-1018 |
| Certification | ISO9001 ISO13485 IATF16949 UL |
| Place of Origin | China or Cambodia |
MOQ: No Limited
Price: Customized products
| Payment Terms | T/T |
| Delivery Time | 5-7days after all components kitted |
| Packaging Details | By ESD bags and carton |
| Material: | FR4(Tg130-Tg180)/Rogers/Aluminum |
| Copper: | 0.5OZ-10OZ |
| SMT,THT: | Yes |
| Solder Mask: | Green,Blue,Black,Red,White,Matt Color |
| Thickness: | 1.0mm/1.6mm/2mm/4mm |
| RoHs: | Lead Or Lead Free |
| Layer: | 1L-32L |
| Warranty: | 1year |
| Hole Min.: | 0.1mm |
| Brand Name | Suntek/BLSuntek |
| Model Number | F1025-1218 |
| Certification | ISO9001 ISO13485 IATF16949 UL |
| Place of Origin | China or Cambodia |
MOQ: 1
Price: Customized products
| Payment Terms | TT,Paypal |
| Delivery Time | 5-7days after all components kitted |
| Packaging Details | By ESD bags and carton |
| Material | FR4(Tg130-Tg180),Alu.,Matel,Rogers |
| Thickness | 1.6mm/2mm/4mm |
| Layer | 1L-32L |
| Hole min. | 0.1mm |
| Copper | 0.5--10OZ |
| Solder mask | Green,Blue,Black,Red,White,Matt color |
| Footprint | 0201.0402,LGA,QFN |
| Brand Name | Suntek |
| Model Number | F016-029 |
| Certification | ISO9001 ISO13485 IATF16949 UL |
| Place of Origin | China/Cambodia |
MOQ: 1
Price: Customized products
| Payment Terms | TT,Paypal |
| Delivery Time | 5-7days after all components kitted |
| Packaging Details | By ESD bags and carton |
| Material | FR4(Tg130-Tg180),Alu.,Matel,Rogers |
| Thickness | 1.6mm/2mm/4mm |
| Layer | 1L-32L |
| DFM | Acceptable |
| DFT | Acceptable |
| Guarantee | 1-year |
| RoHS | Lead or Lead-free |
| Brand Name | Suntek/BECC |
| Model Number | F016-030 |
| Certification | ISO9001 ISO13485 IATF16949 UL |
| Place of Origin | China/Cambodia |
MOQ: 5pcs
Price: USD1/PCS
| Payment Terms | T/T,Paypal |
| Supply Ability | 100pcs/hour |
| Delivery Time | 3-6 weeks |
| Packaging Details | cartons and ESD bags |
| Surface Finish | HASL, ENIG, OSP, Immersion Silver |
| Type | Printed Circuit Board Assembly |
| Testing | AOI,ICT,100% Visual Inspection,FT |
| Minimum Trace/Space | 4mil/4mil |
| Lead Time | 3-5 Days after all parts collected |
| Layers | 2-20 Layers |
| Maximum Copper Weight | 6oz |
| Minimum Hole Size | 0.2mm |
| Brand Name | Suntek |
| Model Number | FPA856 |
| Certification | ISO9001, ISO13485, TS16949 and UL E476377 |
| Place of Origin | China |
MOQ: 1
Price: Customized products
| Payment Terms | TT,Paypal |
| Delivery Time | 5-7days after all components kitted |
| Packaging Details | By ESD bags and carton |
| Material | FR4(Tg130-Tg180),Alu.,Matel,Rogers |
| Thickness | 1.6mm/2mm/4mm |
| Layer | 1L-32L |
| DFM | Acceptable |
| DFT | Acceptable |
| Guarantee | 1-year |
| RoHS | Lead or Lead-free |
| Brand Name | Suntek/BECC |
| Model Number | F016-031 |
| Certification | ISO9001 ISO13485 IATF16949 UL |
| Place of Origin | China/Cambodia |
MOQ: 1
Price: Customized products
| Payment Terms | TT,Paypal |
| Delivery Time | 5-7days after all components kitted |
| Packaging Details | By ESD bags and carton |
| Material | FR4(Tg130-Tg180),Alu.,Matel,Rogers |
| Thickness | 1.6mm/2mm/4mm |
| Layer | 1L-32L |
| DFM | Acceptable |
| DFT | Acceptable |
| Guarantee | 1-year |
| RoHS | Lead or Lead-free |
| Brand Name | Suntek/BECC |
| Model Number | F016-032 |
| Certification | ISO9001 ISO13485 IATF16949 UL |
| Place of Origin | China/Cambodia |
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