Suntek Electronics Co., Ltd.
Products
Manufacturer of a wide range of products which include SMT DIP Rigid FR4 PCB Haglen-Free RoHs for Power Protection,One Stop Quick Turn PCB Prototypes 2OZ/4OZ For Power Protection Equipments,HDI Board with 8OZ Max Copper Thickness ...
MOQ: 1
Price: Customized products
| Payment Terms | TT,Paypal |
| Delivery Time | 5-7days after all components kitted |
| Packaging Details | By ESD bags and carton |
| Material | FR4(TG130-T180),Rogers,Aluminum |
| Thickness | 0.8mm-4mm |
| Layer | 1L-32L |
| Copper | 0.3OZ-10OZ |
| Solder Type | Lead or Lead-free |
| Hole plating | >25um |
| Soldermask color | Green,Blue,White,Black or customized |
| Brand Name | Suntek/BLSuntek |
| Model Number | F016-032 |
| Certification | ISO9001 ISO13485 IATF16949 UL |
| Place of Origin | China or Cambodia |
MOQ: 1
Price: Customized products
| Payment Terms | TT,Paypal |
| Delivery Time | 5-7days after all components kitted |
| Packaging Details | By ESD bags and carton |
| Material | FR4(TG130-T180),Rogers,Aluminum |
| Thickness | 0.8mm-4mm |
| Layer | 1L-32L |
| Copper | 0.3OZ-10OZ |
| Surface | HASL,ENIG,Gold-Plating,SOP |
| Hole plating | >25um |
| Soldermask color | Green,Blue,White,Black or customized |
| Brand Name | Suntek/BLSuntek |
| Model Number | F016-033 |
| Certification | ISO9001 ISO13485 IATF16949 UL |
| Place of Origin | China or Cambodia |
MOQ: 5pcs
Price: Based on Gerber
| Payment Terms | T/T,Paypal |
| Supply Ability | 100pcs/hour |
| Delivery Time | 1-2 weeks |
| Packaging Details | cartons and ESD bags |
| Base Material | Fr4,Rogers,Getek,Halogen free,Low Dk/Low Df |
| Build-up Material | RCC,FR4 |
| Max Layer | 38L |
| Min Hole mm(mil) | 0.2(8) |
| Min Land mm(mil) | 0.4(16) |
| Min IVH Hole/Land Size um(mil) | 150/300(6/12) |
| Laser Hole Filling | Yes |
| Max Copper Thickness | 8OZ |
| Surface Finish | ENIG/OSP/HASL/Au Plating/Immersion Tin |
| Brand Name | Suntek |
| Model Number | F5665 |
| Certification | ISO9001, ISO13485, TS16949 and UL E476377 |
| Place of Origin | China/Cambodia |
MOQ: 5pcs
Price: Based on Gerber
| Payment Terms | T/T,Paypal |
| Supply Ability | 100pcs/hour |
| Delivery Time | 1-2 weeks |
| Packaging Details | cartons and ESD bags |
| Base Material | Fr4,Rogers,Getek,Halogen free,Low Dk/Low Df |
| Build-up Material | RCC,FR4 |
| Max Layer | 38L |
| Min Hole mm(mil) | 0.2(8) |
| Min Land mm(mil) | 0.4(16) |
| Min IVH Hole/Land Size um(mil) | 150/300(6/12) |
| Laser Hole Filling | Yes |
| Max Copper Thickness | 8OZ |
| Surface Finish | ENIG/OSP/HASL/Au Plating/Immersion Tin |
| Tolerance of PTH | +/-0.05mm |
| Brand Name | Suntek |
| Model Number | F56 |
| Certification | ISO9001, ISO13485, TS16949 and UL E476377 |
| Place of Origin | China/Cambodia |
MOQ: 5pcs
Price: Based on Gerber
| Payment Terms | T/T,Paypal |
| Supply Ability | 100pcs/hour |
| Delivery Time | 1-2 weeks |
| Packaging Details | cartons and ESD bags |
| Base Material | Fr4,Rogers,Getek,Halogen free,Low Dk/Low Df |
| Build-up Material | RCC,FR4 |
| Max Layer | 38L |
| Min Hole mm(mil) | 0.2(8) |
| Min Land mm(mil) | 0.4(16) |
| Min IVH Hole/Land Size um(mil) | 150/300(6/12) |
| Laser Hole Filling | Yes |
| Max Copper Thickness | 8OZ |
| Surface Finish | ENIG/OSP/HASL/Au Plating/Immersion Tin |
| Tolerance of PTH | +/-0.05mm |
| Brand Name | Suntek |
| Model Number | F561 |
| Certification | ISO9001, ISO13485, TS16949 and UL E476377 |
| Place of Origin | China/Cambodia |
MOQ: 5pcs
Price: Based on Gerber
| Payment Terms | T/T,Paypal |
| Supply Ability | 100pcs/hour |
| Delivery Time | 1-2 weeks |
| Packaging Details | cartons and ESD bags |
| Base Material | Fr4,Rogers,Getek,Halogen free,Low Dk/Low Df |
| Build-up Material | RCC,FR4 |
| Max Layer | 38L |
| Min Hole mm(mil) | 0.2(8) |
| Min Land mm(mil) | 0.4(16) |
| Min IVH Hole/Land Size um(mil) | 150/300(6/12) |
| Laser Hole Filling | Yes |
| Max Copper Thickness | 8OZ |
| Surface Finish | ENIG/OSP/HASL/Au Plating/Immersion Tin |
| Impedance Contronl | +/-10% |
| Brand Name | Suntek |
| Model Number | F568 |
| Certification | ISO9001, ISO13485, TS16949 and UL E476377 |
| Place of Origin | China/Cambodia |
MOQ: No Limited
Price: Customized products
| Payment Terms | T/T |
| Delivery Time | 5-7days after all components kitted |
| Packaging Details | By ESD bags and carton |
| Solder Type | Lead Or Lead-free |
| Min Hole | 0.1mm |
| Copper: | 0.3OZ-10OZ |
| Thickness | 0.8mm-4mm |
| Application Field | Office,Test,Medical Devices |
| PCBA Test | AOT/ICT/FCT |
| Surface | HASL,ENIG,OSP,Hard Plating,Immersion Tin |
| Layer | Double Side,Multilayer |
| Brand Name | Suntek/BLSuntek |
| Model Number | FPA8515 |
| Certification | ISO9001 ISO13485 IATF16949 UL |
| Place of Origin | China or Cambodia |
MOQ: No Limited
Price: Customized products
| Payment Terms | T/T |
| Delivery Time | 5-7days after all components kitted |
| Packaging Details | By ESD bags and carton |
| Material | FR4 |
| Copper | 1 OZ |
| LW/LS Min. | 0.05mm |
| SMT | Yes |
| Thickness | 0.4mm-3mm |
| Surface Finish | Lead Free HASL |
| Impedance Control | Yes |
| Layer | 2 Layers |
| Warranty | 1 Year |
| Customized | Yes |
| Brand Name | Suntek/BLSuntek |
| Model Number | 2025-PCBA-066 |
| Certification | ISO9001 ISO13485 IATF16949 UL |
| Place of Origin | China or Cambodia |
MOQ: 5pcs
Price: Based on Gerber
| Payment Terms | T/T,Paypal |
| Supply Ability | 100pcs/hour |
| Delivery Time | 1-2 weeks after all parts collected |
| Packaging Details | 60*40*30cm cartons and ESD bags |
| Base Material | Fr4,Rogers,Getek,Halogen free,Low Dk/Low Df |
| Build-up Material | RCC,FR4 |
| Max Layer | 38L |
| Min Hole mm(mil) | 0.2(8) |
| Min Land mm(mil) | 0.4(16) |
| Min IVH Hole/Land Size um(mil) | 150/300(6/12) |
| Laser Hole Filling | Yes |
| Max Copper Thickness | 8OZ |
| Surface Finish | ENIG/OSP/HASL/Au Plating/Immersion Tin |
| Brand Name | Suntek |
| Model Number | F5665 |
| Certification | ISO9001, ISO13485, TS16949 and UL E476377 |
| Place of Origin | China/Cambodia |
MOQ: 5pcs
Price: Based on Gerber
| Payment Terms | T/T,Paypal |
| Supply Ability | 100pcs/hour |
| Delivery Time | 1-2 weeks after all parts collected |
| Packaging Details | 60*40*30cm cartons and ESD bags |
| Base Material | Fr4,Rogers,Getek,Halogen free,Low Dk/Low Df |
| Build-up Material | RCC,FR4 |
| Max Layer | 38L |
| Min Hole mm(mil) | 0.2(8) |
| Min Land mm(mil) | 0.4(16) |
| Min IVH Hole/Land Size um(mil) | 150/300(6/12) |
| Laser Hole Filling | Yes |
| Max Copper Thickness | 8OZ |
| Surface Finish | ENIG/OSP/HASL/Au Plating/Immersion Tin |
| Brand Name | Suntek |
| Model Number | F5665 |
| Certification | ISO9001, ISO13485, TS16949 and UL E476377 |
| Place of Origin | China/Cambodia |
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