Suntek Electronics Co., Ltd.
Products
Manufacturer of a wide range of products which include Rogers Lead Free HASL Power Protection FR4 PCB Assembly 0.5-10 OZ Copper,Thick Copper 5OZ pcb fabrication and assembly,2 Layer 1.0oz Aluminum Flex Pcb Fabrication Manufacturer...
MOQ: No Limited
Price: Customized products
| Payment Terms | T/T |
| Delivery Time | 5-7days after all components kitted |
| Packaging Details | By ESD bags and carton |
| Material | FR4(TG130-TG180),Rogers,Aluminum,CEM |
| Copper | 0.5OZ-10OZ |
| ROHS | Lead Or Lead Free |
| Solder Mask: | Green,Blue,Black,Red,White,Matt Color |
| Thickness | 0.4mm-5mm |
| Layer | Multilayer |
| Customized | Yes |
| Hole Min.: | 0.1mm |
| Brand Name | Suntek/BLSuntek |
| Model Number | F025-1021 |
| Certification | ISO9001 ISO13485 IATF16949 UL |
| Place of Origin | China or Cambodia |
MOQ: 1
Price: Customized products
| Payment Terms | TT,Paypal |
| Delivery Time | 5-7days after all components kitted |
| Packaging Details | By ESD bags and carton |
| Material | FR4(Tg130-Tg180) |
| Thickness | 0.4mm-5mm |
| Layer | 1L-32L |
| Size at max. | 1200*400mm |
| Hole min. | 0.1mm |
| LW/LS min. | 0.05mm |
| Copper | 0.5--10OZ |
| Surface | HASL,ENIG,OSP,Hard plating,Immersion Tin |
| Solder mask | Green,Blue,Black,Red,White,Matt color |
| Brand Name | Suntek |
| Model Number | F016-006 |
| Certification | ISO9001 ISO13485 IATF16949 UL |
| Place of Origin | China or Cambodia |
MOQ: 1pcs
Price: Customized products
| Payment Terms | TT,Paypal |
| Delivery Time | 5-7days after all components kitted |
| Packaging Details | By ESD bags and carton |
| silkscreen color | white |
| Layer | 2Layers |
| Material | PI |
| Thickness | 0.4mm-3mm |
| LW/LS min. | 0.05mm |
| Copper | 0.5--5OZ |
| Surface Finish | HASL,ENIG,OSP,Hard plating,Immersion Tin |
| PCB process | immersion Tin |
| X-RAY inspection | For BGA,OFN,QFP with bottom pads |
| Impedance control | Yes |
| Brand Name | Suntek Electronics Co., Ltd |
| Model Number | 2024-PCBA-022 |
| Certification | ISO9001 ISO13485 IATF16949 UL |
| Place of Origin | China or Cambodia |
MOQ: 1pcs
Price: Customized products
| Payment Terms | TT,Paypal |
| Delivery Time | 5-7days after all components kitted |
| Packaging Details | By ESD bags and carton |
| Material | PI |
| Thickness | 0.4mm-3mm |
| Layer | 4Layers |
| silkscreen color | white |
| LW/LS min. | 0.05mm |
| Copper | 0.5--5OZ |
| Surface Finish | HASL,ENIG,OSP,Hard plating,Immersion Tin |
| PCB process | immersion gold |
| X-RAY inspection | For BGA,OFN,QFP with bottom pads |
| Impedance control | Yes |
| Brand Name | Suntek Electronics Co., Ltd |
| Model Number | 2024-PCBA-022 |
| Certification | ISO9001 ISO13485 IATF16949 UL |
| Place of Origin | China or Cambodia |
MOQ: 1pcs
Price: Customized products
| Payment Terms | TT,Paypal |
| Delivery Time | 5-7days after all components kitted |
| Packaging Details | By ESD bags and carton |
| Material | PI |
| Thickness | 0.4mm-3mm |
| Layer | 4Layers |
| silkscreen color | white |
| LW/LS min. | 0.05mm |
| Copper | 0.5--5OZ |
| Surface Finish | HASL,ENIG,OSP,Hard plating,Immersion Tin |
| PCB process | immersion gold |
| X-RAY inspection | For BGA,OFN,QFP with bottom pads |
| Impedance control | Yes |
| Brand Name | Suntek Electronics Co., Ltd |
| Model Number | 2024-PCBA-022 |
| Certification | ISO9001 ISO13485 IATF16949 UL |
| Place of Origin | China or Cambodia |
MOQ: 1pcs
Price: Customized products
| Payment Terms | TT,Paypal |
| Supply Ability | 100pcs/hour |
| Delivery Time | 5-7days after all components kitted |
| Packaging Details | By ESD bags and carton |
| Material | PI |
| Thickness | 0.4mm-3mm |
| Layer | 4Layers |
| silkscreen color | white |
| LW/LS min. | 0.05mm |
| Copper | 0.5--5OZ |
| Surface Finish | HASL,ENIG,OSP,Hard plating,Immersion Tin |
| PCB process | immersion gold |
| X-RAY inspection | For BGA,OFN,QFP with bottom pads |
| Impedance control | Yes |
| Brand Name | Suntek Electronics Co., Ltd |
| Model Number | 2024-PCBA-011 |
| Certification | ISO9001 ISO13485 IATF16949 UL |
| Place of Origin | China or Cambodia |
MOQ: 5pcs
Price: USD1-100/pcs
| Payment Terms | T/T,Paypal |
| Supply Ability | 100pcs/hour |
| Delivery Time | 1-2 weeks after all parts collected |
| Packaging Details | 60*40*30cm cartons and ESD bags |
| Material | FR-4,FR1, CEM-1, CEM-3,Aluminum, Ceramic, Metal-backed Laminate, etc.Also make Crockery, Taconic, Rogers PCBs etc. |
| Finish Board Thickness | 0.2 mm-6.00mm(8mil-126mil) |
| Surface Finish | Gold finger(>=0.13um), Immersion Gold(0.025-0075um), Plating Gold(0.025-3.0um), HASL(5-20um), OSP(0.2-0.5um) |
| Board thickness tolerance | 4 layers:+/-0.13mm(5mil) |
| Test Voltage | 10-300V |
| Hole Diameter(H) | Non PTHL:+/-0.05mm(2mil) |
| Surface treatment | HASL llead free,OSP, gold plated,immersion Gold,immersion tin,immersion silver,HASL+gold fingers |
| min package | 0201(0.6mm*0.3mm) |
| Brand Name | Suntek |
| Model Number | SBBF0326-6 |
| Certification | ISO9001, ISO13485, TS16949 and UL E476377 |
| Place of Origin | China/Cambodia |
MOQ: 5pcs
Price: Based on Parts list
| Payment Terms | T/T,Paypal |
| Supply Ability | 100pcs/hour |
| Delivery Time | 1 week after all components collected |
| Packaging Details | cartons and ESD bags |
| Material | Kapton,Polyimide(PI), Polyester(PET), FR4 |
| Color | Red,Green,Black,Purple,White |
| Big Size | 1200*400mm |
| Layer | 1 to 6 Layers |
| Base Copper Thickness | 1/3 oz to 8oz |
| Regular Base Material Thickness | 12.5um to 50um(FPC) 0.1mm to 3.2mm(Rigid) |
| Regular Adhesive Thickness | 12um to 25um |
| Blind or Buried Vias | Yes |
| Impedance Control | Yes |
| Min.Line Width/Spacing | 0.04mm/0.04mm |
| Surface Finishing | HASL OSP ENIG |
| Outline Fabrication | Die cut, laser cut, CNC routing, V-scoring |
| Hole to edge(Hard tool/Die Cut) | ±0.1/±0.2mm |
| Brand Name | Suntek |
| Model Number | SFBF1 |
| Certification | ISO9001, ISO13485, TS16949 and UL E476377 |
| Place of Origin | China/Cambodia |
MOQ: 5pcs
Price: USD+1-100+PCS
| Payment Terms | T/T,Paypal |
| Supply Ability | 100pcs/hour |
| Delivery Time | 1-2 weeks after all parts collected |
| Packaging Details | 60*40*30cm cartons and ESD bags |
| Material | FR-4,FR1, CEM-1, CEM-3,Aluminum, Ceramic, Metal-backed Laminate, etc.Also make Crockery, Taconic, Rogers PCBs etc. |
| Finish Board Thickness | 0.2 mm-6.00mm(8mil-126mil) |
| Surface Finish | Gold finger(>=0.13um), Immersion Gold(0.025-0075um), Plating Gold(0.025-3.0um), HASL(5-20um), OSP(0.2-0.5um) |
| Board thickness tolerance | 4 layers:+/-0.13mm(5mil) |
| Test Voltage | 10-300V |
| Hole Diameter(H) | Non PTHL:+/-0.05mm(2mil) |
| Surface treatment | HASL llead free,OSP, gold plated,immersion Gold,immersion tin,immersion silver,HASL+gold fingers |
| min package | 0201(0.6mm*0.3mm) |
| Brand Name | Suntek |
| Model Number | SBBF0326-6 |
| Certification | ISO9001, ISO13485, TS16949 and UL E476377 |
| Place of Origin | China/Cambodia |
MOQ: 1pcs
Price: Customized products
| Payment Terms | TT,Paypal |
| Delivery Time | 5-7days after all components kitted |
| Packaging Details | By ESD bags and carton |
| Material | PI |
| Thickness | 0.4mm-3mm |
| Layer | 4Layers |
| silkscreen color | white |
| LW/LS min. | 0.05mm |
| Copper | 0.5--5OZ |
| Surface Finish | HASL,ENIG,OSP,Hard plating,Immersion Tin |
| PCB process | immersion gold |
| X-RAY inspection | For BGA,OFN,QFP with bottom pads |
| Impedance control | Yes |
| Brand Name | Suntek Electronics Co., Ltd |
| Model Number | 2024-PCBA-022 |
| Certification | ISO9001 ISO13485 IATF16949 UL |
| Place of Origin | China or Cambodia |
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