Products
Manufacturer of a wide range of products which include Energy Power Customized OEM PCBA with 0.2mm-6.00mm Board Thickness in China and,1-30Layer FR4 TG170 PC PCB Assembly for New Energy Equipment China and Cambodia,Professional IC...
MOQ: 1pcs
Price: USD1-100
Payment Terms | T/T,Paypal |
Supply Ability | 100pcs/hour |
Delivery Time | 1-2 weeks after all parts collected |
Packaging Details | 60*40*30cm cartons and ESD bags |
Material | FR-4,FR1, CEM-1, CEM-3,Aluminum, Ceramic, Metal-backed Laminate, etc.Also make Crockery, Taconic, Rogers PCBs etc. |
Finish Board Thickness | 0.2 mm-6.00mm(8mil-126mil) |
Surface Finish | Gold finger(>=0.13um), Immersion Gold(0.025-0075um), Plating Gold(0.025-3.0um), HASL(5-20um), OSP(0.2-0.5um) |
Board thickness tolerance | 4 layers:+/-0.13mm(5mil) |
Test Voltage | 10-300V |
Hole Diameter(H) | Non PTHL:+/-0.05mm(2mil) |
Brand Name | Suntek |
Model Number | SBBF033 |
Certification | ISO9001, ISO13485, TS16949 and UL E476377 |
Place of Origin | China/Cambodia |
MOQ: 5pcs
Price: USD1/PCS
Payment Terms | T/T,Paypal |
Supply Ability | 100pcs/hour |
Delivery Time | 1-2 weeks after all parts collected |
Packaging Details | 60*40*30cm cartons and ESD bags |
Layer | 1-22 layers |
Materials | CEM1, CEM3, FR-4, High Tg FR-4, Aluminum board |
CE | ISO9001, ISO13485, TS16949 and UL E476377 |
PCB thickness | 1.6 ±0.1mm |
Max. board Thickness | 6.0mm |
Surface finished | Lead free,Immersion ENIG,Chem Tin,Flash Gold,OSP,Gold finger,Peelable,Immersion Silver |
Brand Name | Suntek |
Model Number | SBBF03 |
Certification | ISO9001, ISO13485, TS16949 and UL E476377 |
Place of Origin | China/Cambodia |
MOQ: 5pcs
Price: USD1/PCS
Payment Terms | T/T,Paypal |
Supply Ability | 100pcs/hour |
Delivery Time | 3-6 weeks |
Packaging Details | cartons and ESD bags |
Surface Finish | HASL, ENIG, OSP, Immersion Silver |
Type | Printed Circuit Board Assembly |
Testing | AOI,ICT,100% Visual Inspection,FT |
Minimum Trace/Space | 4mil/4mil |
Lead Time | 3-5 Days after all parts collected |
Layers | 2-20 Layers |
Maximum Copper Weight | 6oz |
Minimum Hole Size | 0.2mm |
Brand Name | Suntek |
Model Number | FPA856 |
Certification | ISO9001, ISO13485, TS16949 and UL E476377 |
Place of Origin | China |
MOQ: 1
Price: Customized products
Payment Terms | TT,Paypal |
Delivery Time | 5-7days after all components kitted |
Packaging Details | By ESD bags and carton |
Material | FR4(Tg130-Tg180) |
Thickness | 0.4mm-5mm |
Layer | 1L-32L |
Size at max. | 1200*400mm |
LW/LS min. | 0.05mm |
Copper | 0.5--10OZ |
Surface | HASL,ENIG,OSP,Hard plating,Immersion Tin |
Ability | SMT/THT/0201/BGA/AI |
Brand Name | Suntek |
Model Number | F016-008 |
Certification | ISO9001 ISO13485 IATF16949 UL |
Place of Origin | China or Cambodia |
MOQ: 1
Price: Customized products
Payment Terms | TT,Paypal |
Delivery Time | 5-7days after all components kitted |
Packaging Details | By ESD bags and carton |
Material | FR4(Tg130-Tg180) |
Thickness | 0.4mm-5mm |
Layer | 1L-32L |
Size at max. | 1200*400mm |
LW/LS min. | 0.05mm |
Copper | 0.5--10OZ |
Surface | HASL,ENIG,OSP,Hard plating,Immersion Tin |
Ability | SMT/THT/0201/BGA/AI |
Brand Name | Suntek |
Model Number | F016-008 |
Certification | ISO9001 ISO13485 IATF16949 UL |
Place of Origin | China or Cambodia |
MOQ: 1
Price: Customized products
Payment Terms | TT,Paypal |
Delivery Time | 5-7days after all components kitted |
Packaging Details | By ESD bags and carton |
Material | FR4(Tg130-Tg180) |
Thickness | 0.4mm-5mm |
Layer | 1L-32L |
Size at max. | 1200*400mm |
LW/LS min. | 0.05mm |
Copper | 0.5--10OZ |
Surface | HASL,ENIG,OSP,Hard plating,Immersion Tin |
Ability | SMT/THT/0201/BGA/AI |
Brand Name | Suntek |
Model Number | F016-009 |
Certification | ISO9001 ISO13485 IATF16949 UL |
Place of Origin | China or Cambodia |
MOQ: 1
Price: Customized products
Payment Terms | TT,Paypal |
Delivery Time | 5-7days after all components kitted |
Packaging Details | By ESD bags and carton |
Material | FR4(Tg130-Tg180) |
Thickness | 0.4mm-5mm |
Layer | 1L-32L |
Size at max. | 1200*400mm |
LW/LS min. | 0.05mm |
Copper | 0.5--10OZ |
Surface | HASL,ENIG,OSP,Hard plating,Immersion Tin |
Ability | SMT/THT/0201/BGA/AI |
Brand Name | Suntek |
Model Number | F016-009 |
Certification | ISO9001 ISO13485 IATF16949 UL |
Place of Origin | China or Cambodia |
MOQ: 1
Price: Customized products
Payment Terms | TT,Paypal |
Delivery Time | 5-7days after all components kitted |
Packaging Details | By ESD bags and carton |
Material | FR4(Tg130-Tg180) |
Thickness | 0.4mm-5mm |
Layer | 1L-32L |
Size at max. | 1200*400mm |
LW/LS min. | 0.05mm |
Copper | 0.5--10OZ |
Surface | HASL,ENIG,OSP,Hard plating,Immersion Tin |
Ability | SMT/THT/0201/BGA/AI |
Brand Name | Suntek |
Model Number | F016-009 |
Certification | ISO9001 ISO13485 IATF16949 UL |
Place of Origin | China or Cambodia |
MOQ: 5pcs
Price: Based on Gerber
Payment Terms | T/T,Paypal |
Supply Ability | 100pcs/hour |
Delivery Time | 1-2 weeks after all parts collected |
Packaging Details | 60*40*30cm cartons and ESD bags |
Base Material | Fr4,Rogers,Getek,Halogen free,Low Dk/Low Df |
Build-up Material | RCC,FR4 |
Max Layer | 8L |
Min Hole mm(mil) | 0.2(8) |
Min Land mm(mil) | 0.4(16) |
Min IVH Hole/Land Size um(mil) | 150/300(6/12) |
Laser Hole Filling | Yes |
Max Copper Thickness | 8OZ |
Surface Finish | ENIG/OSP/HASL/Au Plating/Immersion Tin |
Brand Name | Suntek |
Model Number | F56652-1 |
Certification | ISO9001, ISO13485, TS16949 and UL E476377 |
Place of Origin | China/Cambodia |
MOQ: No Limited
Price: Customized products
Payment Terms | T/T |
Delivery Time | 5-7days after all components kitted |
Packaging Details | By ESD bags and carton |
Material | FR4 |
Copper | 0.5OZ-10OZ |
Product complience | ROHS |
Surface | HASL,ENIG,OSP,Hard Plating,Immersion Tin |
Thickness | 1.6mm/2mm/4mm |
RoHs | Lead Or Lead Free |
Layer | 1L-32L |
Customized | Yes |
Brand Name | Suntek/BLSuntek |
Model Number | F020-015 |
Certification | ISO9001 ISO13485 IATF16949 UL |
Place of Origin | China or Cambodia |
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