AI CHIPLINK LIMITED
Products
Manufacturer of a wide range of products which include LM324DR,AZV358MMTR-G1,XC7Z010-1CLG400I,etc
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| Category | Integrated Circuits (ICs) Linear Amplifiers Instrumentation, OP Amps, Buffer Amps |
| Current - Output / Channel | 30 mA |
| Amplifier Type | General Purpose |
| Product Status | Active |
| Mounting Type | Surface Mount |
| Package | Tape & Reel (TR) Cut Tape (CT) Digi-Reel® |
| Series | - |
| Voltage - Supply Span (Min) | 3 V |
| Supplier Device Package | 14-SOIC |
| Output Type | - |
| Voltage - Supply Span (Max) | 30 V |
| Mfr | Texas Instruments |
| Operating Temperature | 0°C ~ 70°C (TA) |
| Current - Supply | 1.4mA (x4 Channels) |
| Package / Case | 14-SOIC (0.154", 3.90mm Width) |
| Slew Rate | 0.5V/µs |
| Current - Input Bias | 20 nA |
| Voltage - Input Offset | 3 mV |
| Number of Circuits | 4 |
| Gain Bandwidth Product | 1.2 MHz |
| Base Product Number | LM324 |
| Description | IC OPAMP GP 4 CIRCUIT 14SOIC |
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| Category | Integrated Circuits (ICs) Linear Amplifiers Instrumentation, OP Amps, Buffer Amps |
| Current - Output / Channel | 60 mA |
| Amplifier Type | General Purpose |
| Product Status | Active |
| Mounting Type | Surface Mount |
| Package | Tape & Reel (TR) Cut Tape (CT) Digi-Reel® |
| Series | - |
| Voltage - Supply Span (Min) | 2.7 V |
| Supplier Device Package | 8-MSOP |
| Output Type | Rail-to-Rail |
| Voltage - Supply Span (Max) | 5.5 V |
| Mfr | Diodes Incorporated |
| Operating Temperature | -40°C ~ 85°C |
| Current - Supply | 210µA (x2 Channels) |
| Package / Case | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
| Slew Rate | 1V/µs |
| Current - Input Bias | 15 nA |
| Voltage - Input Offset | 1.7 mV |
| Number of Circuits | 2 |
| Gain Bandwidth Product | 1 MHz |
| Base Product Number | AZV358 |
| Description | IC OPAMP GP 2 CIRCUIT 8MSOP |
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| Category | Integrated Circuits (ICs) Embedded System On Chip (SoC) |
| Base Product Number | XC7Z010 |
| Product Status | Active |
| Peripherals | DMA |
| Primary Attributes | Artix™-7 FPGA, 28K Logic Cells |
| Series | Zynq®-7000 |
| Package | Tray |
| Mfr | AMD |
| Supplier Device Package | 400-CSPBGA (17x17) |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Architecture | MCU, FPGA |
| Package / Case | 400-LFBGA, CSPBGA |
| Number of I/O | 130 |
| RAM Size | 256KB |
| Speed | 667MHz |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Flash Size | - |
| Description | IC SOC CORTEX-A9 667MHZ 400BGA |
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Price:
| Category | Integrated Circuits (ICs) Embedded System On Chip (SoC) |
| Base Product Number | XC7Z010 |
| Product Status | Active |
| Peripherals | DMA |
| Primary Attributes | Artix™-7 FPGA, 28K Logic Cells |
| Series | Zynq®-7000 |
| Package | Tray |
| Mfr | AMD |
| Supplier Device Package | 225-CSPBGA (13x13) |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Architecture | MCU, FPGA |
| Package / Case | 225-LFBGA, CSPBGA |
| Number of I/O | 86 |
| RAM Size | 256KB |
| Speed | 667MHz |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Flash Size | - |
| Description | IC SOC CORTEX-A9 667MHZ 225BGA |
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| Category | Integrated Circuits (ICs) Embedded System On Chip (SoC) |
| Base Product Number | XC7Z020 |
| Product Status | Active |
| Peripherals | DMA |
| Primary Attributes | Artix™-7 FPGA, 85K Logic Cells |
| Series | Zynq®-7000 |
| Package | Tray |
| Mfr | AMD |
| Supplier Device Package | 484-CSPBGA (19x19) |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Architecture | MCU, FPGA |
| Package / Case | 484-LFBGA, CSPBGA |
| Number of I/O | 130 |
| RAM Size | 256KB |
| Speed | 667MHz |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Flash Size | - |
| Description | IC SOC CORTEX-A9 667MHZ 484BGA |
MOQ:
Price:
| Category | Integrated Circuits (ICs) Embedded System On Chip (SoC) |
| Base Product Number | XC7Z020 |
| Product Status | Active |
| Peripherals | DMA |
| Primary Attributes | Artix™-7 FPGA, 85K Logic Cells |
| Series | Zynq®-7000 |
| Package | Tray |
| Mfr | AMD |
| Supplier Device Package | 400-CSPBGA (17x17) |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Architecture | MCU, FPGA |
| Package / Case | 400-LFBGA, CSPBGA |
| Number of I/O | 130 |
| RAM Size | 256KB |
| Speed | 667MHz |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Flash Size | - |
| Description | IC SOC CORTEX-A9 667MHZ 400BGA |
MOQ:
Price:
| Category | Integrated Circuits (ICs) Embedded System On Chip (SoC) |
| Base Product Number | XC7Z020 |
| Product Status | Active |
| Peripherals | DMA |
| Primary Attributes | Artix™-7 FPGA, 85K Logic Cells |
| Series | Zynq®-7000 |
| Package | Tray |
| Mfr | AMD |
| Supplier Device Package | 484-CSPBGA (19x19) |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Architecture | MCU, FPGA |
| Package / Case | 484-LFBGA, CSPBGA |
| Number of I/O | 130 |
| RAM Size | 256KB |
| Speed | 667MHz |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Flash Size | - |
| Description | IC SOC CORTEX-A9 667MHZ 484BGA |
MOQ:
Price:
| Category | Integrated Circuits (ICs) Embedded System On Chip (SoC) |
| Base Product Number | XC7Z015 |
| Product Status | Active |
| Peripherals | DMA |
| Primary Attributes | Artix™-7 FPGA, 74K Logic Cells |
| Series | Zynq®-7000 |
| Package | Tray |
| Mfr | AMD |
| Supplier Device Package | 485-CSPBGA (19x19) |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Architecture | MCU, FPGA |
| Package / Case | 485-LFBGA, CSPBGA |
| Number of I/O | 130 |
| RAM Size | 256KB |
| Speed | 667MHz |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Flash Size | - |
| Description | IC SOC CORTEX-A9 667MHZ 485CSBGA |
MOQ:
Price:
| Category | Integrated Circuits (ICs) Embedded System On Chip (SoC) |
| Base Product Number | XC7Z020 |
| Product Status | Active |
| Peripherals | DMA |
| Primary Attributes | Artix™-7 FPGA, 85K Logic Cells |
| Series | Zynq®-7000 |
| Package | Tray |
| Mfr | AMD |
| Supplier Device Package | 400-CSPBGA (17x17) |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Architecture | MCU, FPGA |
| Package / Case | 400-LFBGA, CSPBGA |
| Number of I/O | 130 |
| RAM Size | 256KB |
| Speed | 766MHz |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Flash Size | - |
| Description | IC SOC CORTEX-A9 766MHZ 400BGA |
MOQ:
Price:
| Category | Integrated Circuits (ICs) Embedded System On Chip (SoC) |
| Base Product Number | XC7Z015 |
| Product Status | Active |
| Peripherals | DMA |
| Primary Attributes | Artix™-7 FPGA, 74K Logic Cells |
| Series | Zynq®-7000 |
| Package | Tray |
| Mfr | AMD |
| Supplier Device Package | 485-CSPBGA (19x19) |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Architecture | MCU, FPGA |
| Package / Case | 485-LFBGA, CSPBGA |
| Number of I/O | 130 |
| RAM Size | 256KB |
| Speed | 766MHz |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Flash Size | - |
| Description | IC SOC CORTEX-A9 766MHZ 485CSBGA |
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