| Operating Temperature | - |
| Card Connection Mode | 拔插式 |
| Height Above Board | 1.55mm |
| Supplementary Features | - |
| Card Detection | 有 |
| Connector Type | 卡座 |
| Card Type | MicroSD卡(TF卡) |
| Description | Push-Pull 1.55mm Connector and Ejector MicroSD Card (TF Card) PC Card Sockets RoHS |
| Mfr. Part # | 10102166A812A |
| Model Number | 10102166A812A |
View Detail Information
Explore similar products
Surface Mount CompactFlash Header with High Temperature Thermoplastic Insulation
High precision connector model JBL JBL-102312862 designed ensuring stable
SOFNG SIM 019B P6 Mini SIM Card Socket SMT Mounting Push Push Normally Closed
Low Profile CompactFlash Type I CF Card Header SMT with Long Guides and Inverse
Product Specification
| Operating Temperature | - | Card Connection Mode | 拔插式 |
| Height Above Board | 1.55mm | Supplementary Features | - |
| Card Detection | 有 | Connector Type | 卡座 |
| Card Type | MicroSD卡(TF卡) | Description | Push-Pull 1.55mm Connector and Ejector MicroSD Card (TF Card) PC Card Sockets RoHS |
| Mfr. Part # | 10102166A812A | Model Number | 10102166A812A |
The Micro SD Express 3-in-1 Solution offers backward compatibility with UHS-I (SD3.0) and UHS-II (SD4.0) standards, meeting Micro SD 7.1 specifications. It supports PCIe Gen3 x 1 lane and Gen4 x 1 lane, achieving transfer rates of 985Mb/s and 1970Mb/s, and utilizes the NVMe application protocol. This solution provides a user-friendly and flexible design with enhanced transfer rates and high reliability, featuring 5,000 mating cycles. The detect pin function ensures better protection and read functionality when a memory card is inserted. It is RoHS compliant, lead-free, and made with halogen-free resin material, meeting environmental, health, and safety requirements. Applications include Notebook PCs, Drones, Game Consoles, Digital Cameras, Pads, Infotainment systems, Smartphones, and Automotive Recorders.
| Specification | Details |
|---|---|
| Interface | PCIe Gen3 x 1 lane / Gen4 x 1 lane |
| Transfer Rate | 985Mb/s; 1970Mb/s |
| Application Protocol | NVMe |
| Backward Compatibility | UHS-I (SD3.0), UHS-II (SD4.0) |
| Durability | 5,000 mating cycles |
| Mating Force | 40N max. |
| Unmating Force | 0.5~40N |
| Normal Force | 30gf/Pin min. |
| Insulation Resistance | 100M min. (initial) |
| Contact Resistance | 100m max. (initial) |
| Current Rating | 0.5A |
| Operating Temperature Range | -40C to +85C |
| Packaging | Tape/Reel |
| Part Number (Micro SD express 3-in-1 solution, Push pull) | 10102166A812A |
| Part Number (Micro SD express push pull) | 101019961912A |
| Part Number (Micro SD express push push) | 101020156912A |
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Agent,Importer
Year Established:
2009
Total Annual:
10000000-50000000
Employee Number:
300~500
Ecer Certification:
Verified Supplier
Your Trusted Source for Integrated Circuit Shenzhen ECER Network Technology Co., Ltd. is a professional company focus on integrated circuit ic business. ECER connects buyers worldwide with verified manufacturers across 40+ industries. Every component sourced with precision, quality, and reliability... Your Trusted Source for Integrated Circuit Shenzhen ECER Network Technology Co., Ltd. is a professional company focus on integrated circuit ic business. ECER connects buyers worldwide with verified manufacturers across 40+ industries. Every component sourced with precision, quality, and reliability...
Get in touch with us
Leave a Message, we will call you back quickly!