Shenzhen ECER Network Technology Co., Ltd.
| Card Connection Mode | 自弹式 |
| Height Above Board | 2mm |
| Supplementary Features | 带定位柱 |
| Card Detection | 有 |
| Connector Type | 卡座 |
| Card Type | MicroSD卡(TF卡) |
| Description | Push-Push 2mm Connector and Ejector MicroSD Card (TF Card) SMD PC Card Sockets RoHS |
| Mfr. Part # | TFW15-N1S1-2000-A |
| Package | SMD |
| Model Number | TFW15-N1S1-2000-A |
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Product Specification
| Card Connection Mode | 自弹式 | Height Above Board | 2mm |
| Supplementary Features | 带定位柱 | Card Detection | 有 |
| Connector Type | 卡座 | Card Type | MicroSD卡(TF卡) |
| Description | Push-Push 2mm Connector and Ejector MicroSD Card (TF Card) SMD PC Card Sockets RoHS | Mfr. Part # | TFW15-N1S1-2000-A |
| Package | SMD | Model Number | TFW15-N1S1-2000-A |
This document specifies the performance and testing methods for the T-FLASH connector, designed and manufactured by Dongguan Gaoyueda Electronics Co., Ltd. This connector is suitable for applications requiring reliable data transfer via T-Flash cards.
| Item | Requirements | Test Methods |
|---|---|---|
| Product Confirmation | Product shall be conforming to the requirements of applicable product drawing. | Visually, dimensions and functionally inspected per applicable product drawing. |
| Contact Resistance (Low Level) | 80 m Max. initial | Subject mated contacts assembled in housing to closed circuit of 10 mA max. at open circuit voltage of 20 mV max. |
| Insulation Resistance | 1000 M Min. | Measure by applying test potential between the adjacent contacts, and between the contacts and ground in the mated connector. MIL-STD-202, Method 302, Condition B (500 V DC10%). |
| Dielectric Strength | Connector must withstand test potential of 500 V AC for 1 minute. Current leakage must be 1.0 mA max. | Measure by applying test potential between the adjacent contacts, and between the contacts and ground in the mated connector. MIL-STD-202, Method 301. |
| Durability (Repeated Mating/Unmating) | 10 cycles (pre-conditioned) | Samples are pre-conditioned with 10 cycles of durability. Each group shall be containing 5 test samples. |
| Solderability | Can meet MIL-STD-202F standard. Finish shall be free of contaminants. | N/A |
| Resistance to Solder Heat (Wave Soldering) | Preheat: Temp increase not to exceed 4/sec. Final preheat temp within 125 of solder temp. Soldering: Max 250 for 5 seconds. Cool Down: Ambient air to 20-25. | N/A |
| Resistance to Solder Heat (Infrared Reflow) | Preheat: Temp increase not to exceed 4/sec. Soldering: Max 90 sec above 183, max 260 for 10 seconds. Cool Down: Not to exceed 6/sec. | Note: Device temperature measurements are referenced from the top-center of the package outer surface. |
| Cleaning | Connectors resist to cleaning process. Aqueous Cleaning: Max 1 min exposure to 54-66 demineralized water at max 30 psi; followed by air drying for 60-90 seconds at 93-121. | N/A |
Note: Product dimensions, PCB/Panel layout, and specific packaging specifications are detailed in customer drawings.
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Agent,Importer
Year Established:
2009
Total Annual:
10000000-50000000
Employee Number:
300~500
Ecer Certification：
Verified Supplier
Your Trusted Source for Integrated Circuit Shenzhen ECER Network Technology Co., Ltd. is a professional company focus on integrated circuit ic business. ECER connects buyers worldwide with verified manufacturers across 40+ industries. Every component sourced with precision, quality, and reliability... Your Trusted Source for Integrated Circuit Shenzhen ECER Network Technology Co., Ltd. is a professional company focus on integrated circuit ic business. ECER connects buyers worldwide with verified manufacturers across 40+ industries. Every component sourced with precision, quality, and reliability...
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