Shenzhen ECER Network Technology Co., Ltd.
| Operating Temperature | -25℃~+85℃ |
| Card Connection Mode | 自弹式 |
| Rated Voltage (Max) | - |
| Height Above Board | 1.9mm |
| Supplementary Features | - |
| Card Detection | - |
| Connector Type | - |
| Card Type | - |
| Description | -25℃~+85℃ Push-Push 1.9mm SMD PC Card Sockets RoHS |
| Mfr. Part # | SMP21-S1S1-2000-A |
| Package | SMD |
| Model Number | SMP21-S1S1-2000-A |
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Product Specification
| Operating Temperature | -25℃~+85℃ | Card Connection Mode | 自弹式 |
| Rated Voltage (Max) | - | Height Above Board | 1.9mm |
| Supplementary Features | - | Card Detection | - |
| Connector Type | - | Card Type | - |
| Description | -25℃~+85℃ Push-Push 1.9mm SMD PC Card Sockets RoHS | Mfr. Part # | SMP21-S1S1-2000-A |
| Package | SMD | Model Number | SMP21-S1S1-2000-A |
This specification covers performance, tests, and quality requirements for SIM Memory Card Connectors. These connectors are designed to provide space savings and improved functionality for system signal transfer.
| Test Description | Test Results | Test Conditions | Applicable Standards |
|---|---|---|---|
| Low-Signal Level Contact Resistance | R<100 m | Mated connector as shown in MIL-STD-202F, Method 302 | MIL-STD-202F, Method 302 |
| Insulation Resistance | R>1000 M | Apply DC 50010% Volts between adjacent contacts of mated connectors for one minute. | MIL-STD-202F, Method 302 |
| Dielectric Withstanding Voltage | No discharge, flashover or breakdown. | 500 V initial and 250 V final for 1 minute. | MIL-STD-202F, Method 301 |
| Retention Force | 100 Gram (0.98N) minimum (per pin) | Mate connector with a suitable gauge for each pin at rate of 25 mm/min. | MIL-STD-1344A, Method 2012.1 |
| Vibration (Discontinuity) | 1.0 microsec. MAX | Mate dummy card and subject to Vibration conditions for 2 hours in each of 3 axes. Amplitude: 1.52 mm P-P, Frequency: 10-55-10 Hz (traversed in 1 minute). | MIL STD 202 Method 201 |
| Durability | 5000 cycles. | Sample mounted in test machine at rate of 25mm/min. | MIL-STD-1344A, Method 2016 |
| Solderability | Solderable area shall have minimum of 95% solder coverage. | Subject test area of contacts into flux for 30.5 seconds and then into solder bath at 2705 for 30.5 seconds. | |
| Salt Spray | Oxidation of not more than 5% | Subject mated/unmated connectors to 51% salt-solution concentration, 352 for 24 hours. | MTL-STD-1344A, Method 1001.1 |
| Temperature Life (Heat Aging) | A. Products in 852 96 hours, can still be used normally. B. Products in 2605 (max 260) reflow, deformation not more than 0.12 mm. | A. 852 for 96 hours. B. Reflow temperature (max 260). | MTL-STD-202F, Method 108A |
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Agent,Importer
Year Established:
2009
Total Annual:
10000000-50000000
Employee Number:
300~500
Ecer Certification：
Verified Supplier
Your Trusted Source for Integrated CircuitShenzhen ECER Network Technology Co., Ltd. is a professional company focus on integrated circuit ic business. ECER connects buyers worldwide with verified manufacturers across 40+ industries. Every component sourced with precision, quality, and reliability a... Your Trusted Source for Integrated CircuitShenzhen ECER Network Technology Co., Ltd. is a professional company focus on integrated circuit ic business. ECER connects buyers worldwide with verified manufacturers across 40+ industries. Every component sourced with precision, quality, and reliability a...
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