| Operating Temperature | -40℃~+70℃ |
| Card Connection Mode | 自弹式 |
| Height Above Board | 1.35mm |
| Connector Type | 卡座 |
| Card Type | MicroSIM卡 |
| Description | Card Connector MICRO SIM Push-Push Surface Mount |
| Mfr. Part # | HX MICRO SIM 6P H1.35 |
| Package | SMD |
| Model Number | HX MICRO SIM 6P H1.35 |
View Detail Information
Explore similar products
Surface Mount CompactFlash Header with High Temperature Thermoplastic Insulation
High precision connector model JBL JBL-102312862 designed ensuring stable
SOFNG SIM 019B P6 Mini SIM Card Socket SMT Mounting Push Push Normally Closed
Low Profile CompactFlash Type I CF Card Header SMT with Long Guides and Inverse
Product Specification
| Operating Temperature | -40℃~+70℃ | Card Connection Mode | 自弹式 |
| Height Above Board | 1.35mm | Connector Type | 卡座 |
| Card Type | MicroSIM卡 | Description | Card Connector MICRO SIM Push-Push Surface Mount |
| Mfr. Part # | HX MICRO SIM 6P H1.35 | Package | SMD |
| Model Number | HX MICRO SIM 6P H1.35 |
This specification details the characteristics and testing methods for the HX MICRO SIM 6P H1.35 connector, designed and manufactured by Shenzhen Hanxia Electronic Co., Ltd. It is a SIM card holder designed for specific PCB/panel layouts and adheres to RoHS material requirements.
| Item | Requirements | Test Methods |
| Product Confirmation | Product shall be conforming to the requirements of applicable product drawing. Visually, dimensions and functionally inspected per applicable product drawing. | Visually, dimensions and functionally inspected per applicable product drawing. |
| Contact resistance (Low Level) | 100 m Max. initial | Subject mated contacts assembled in housing to closed circuit of 10 mA max. at open circuit voltage of 20 mV max. |
| Insulation resistance | 1000 M Min. | Measure by applying test potential between the adjacent contacts, and between the contacts and ground in the mated connector. MIL-STD-202, Method 302, Condition B (100 V DC10%). |
| Dielectric Strength | 500 V AC for 1 minute. Current leakage must be 1.0 mA max. | Measure by applying test potential between the adjacent contacts, and between the contacts and ground in the mated connector. MIL-STD-202, Method 301. |
| Durability (Repeated Mating/Unmating) | Contact Resistance: 100 m Max. after testing | Mate and unmate connector for 3000 cycles. |
| Temperature rise | 30C Max. | Carry rated current load. 0.3A per contact. (UL498) |
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Agent,Importer
Year Established:
2009
Total Annual:
10000000-50000000
Employee Number:
300~500
Ecer Certification:
Verified Supplier
Your Trusted Source for Integrated CircuitShenzhen ECER Network Technology Co., Ltd. is a professional company focus on integrated circuit ic business. ECER connects buyers worldwide with verified manufacturers across 40+ industries. Every component sourced with precision, quality, and reliability a... Your Trusted Source for Integrated CircuitShenzhen ECER Network Technology Co., Ltd. is a professional company focus on integrated circuit ic business. ECER connects buyers worldwide with verified manufacturers across 40+ industries. Every component sourced with precision, quality, and reliability a...
Get in touch with us
Leave a Message, we will call you back quickly!