Shenzhen ECER Network Technology Co., Ltd.
| Operating Temperature | -40℃~+70℃ |
| Card Connection Mode | 翻盖式 |
| Height Above Board | 1.35mm |
| Connector Type | 卡座 |
| Card Type | NanoSIM卡 |
| Description | Card Connector NANO SIM Hinged Lid Surface Mount |
| Mfr. Part # | HX NANO SIM XG6P H1.35 |
| Package | SMD |
| Model Number | HX NANO SIM XG6P H1.35 |
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Product Specification
| Operating Temperature | -40℃~+70℃ | Card Connection Mode | 翻盖式 |
| Height Above Board | 1.35mm | Connector Type | 卡座 |
| Card Type | NanoSIM卡 | Description | Card Connector NANO SIM Hinged Lid Surface Mount |
| Mfr. Part # | HX NANO SIM XG6P H1.35 | Package | SMD |
| Model Number | HX NANO SIM XG6P H1.35 |
This product specification details the characteristics and test methods for connector products designed and manufactured by Shenzhen Hanxia Electronic Co., Ltd. The HX NANO SIM XG6P H1.35 is a SIM card holder designed for various applications, adhering to strict environmental and performance standards.
| Item | Requirements | Test Methods |
|---|---|---|
| Product Confirmation | Conforming to applicable product drawing requirements. | Visually, dimensions and functionally inspected per applicable product drawing. |
| Contact Resistance (Low Level) | 100 m Max. initial | Subject mated contacts assembled in housing to closed circuit of 10 mA max. at open circuit voltage of 20 mV max. |
| Insulation Resistance | 1000 M Min. | Measure by applying test potential between adjacent contacts, and between contacts and ground in the mated connector. MIL-STD-202, Method 302, Condition B (100 V DC10%). |
| Dielectric Strength | Withstand test potential of 500 V AC for 1 minute. Current leakage must be 1.0 mA max. | Measure by applying test potential between adjacent contacts, and between contacts and ground in the mated connector. MIL-STD-202, Method 301. |
| Durability (Repeated Mating/Unmating) | Contact Resistance: 150 m Max. after testing. | Mate and unmate connector for 5000 cycles. |
| Temperature Rise | 30C Max. | Carry rated current load (0.3A per contact) as per UL498. |
| Vibration Sinusoidal Low Frequency | No electrical discontinuity. | (Details not fully provided in source text) |
| Storage Temperature | -20 to +70 | Relative humidity 80%. Not to store in corrosive environments. Re-qualification after 6 months storage. |
| Solderability | Meet MIL-STD-202F standard. Surface free of contaminants. | (Details not fully provided in source text) |
| Resistance to Solder Heat (Wave Soldering) | Preheat: Not to exceed 4/sec, final preheat within 125 of solder temp. Soldering: Max 250 for 5 seconds. Cool Down: Ambient air approx. 20-25. | (Details not fully provided in source text) |
| Resistance to Solder Heat (Infrared Reflow) | Preheat: Not to exceed 4/sec. Soldering: Max 90 sec above 183, max 260 for 10 sec. Cool Down: Not to exceed 6/sec. | Device temperature measured from top-center of package outer surface. |
| Cleaning | Resist to cleaning process. | Aqueous Cleaning: Max 1 min exposure to 54-66 demineralized water at max 30 psi; followed by air drying at 93-121 for 60-90 seconds. (Three cycles). |
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Agent,Importer
Year Established:
2009
Total Annual:
10000000-50000000
Employee Number:
300~500
Ecer Certification：
Verified Supplier
Your Trusted Source for Integrated Circuit Shenzhen ECER Network Technology Co., Ltd. is a professional company focus on integrated circuit ic business. ECER connects buyers worldwide with verified manufacturers across 40+ industries. Every component sourced with precision, quality, and reliability... Your Trusted Source for Integrated Circuit Shenzhen ECER Network Technology Co., Ltd. is a professional company focus on integrated circuit ic business. ECER connects buyers worldwide with verified manufacturers across 40+ industries. Every component sourced with precision, quality, and reliability...
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