Shenzhen ECER Network Technology Co., Ltd.
| Operating Temperature | -20℃~+70℃ |
| Card Connection Mode | 翻盖式 |
| Height Above Board | 1.5mm |
| Card Detection | 有 |
| Connector Type | 卡座 |
| Card Type | MicroSD卡(TF卡) |
| Description | Micro SD card (TF card) Connector and Ejector Hinged Lid Surface Mount |
| Mfr. Part # | HX TF-CARD XG8P H1.5 |
| Package | SMD |
| Model Number | HX TF-CARD XG8P H1.5 |
View Detail Information
Explore similar products
Surface Mount CompactFlash Header with High Temperature Thermoplastic Insulation
High precision connector model JBL JBL-102312862 designed ensuring stable
SOFNG SIM 019B P6 Mini SIM Card Socket SMT Mounting Push Push Normally Closed
Low Profile CompactFlash Type I CF Card Header SMT with Long Guides and Inverse
Product Specification
| Operating Temperature | -20℃~+70℃ | Card Connection Mode | 翻盖式 |
| Height Above Board | 1.5mm | Card Detection | 有 |
| Connector Type | 卡座 | Card Type | MicroSD卡(TF卡) |
| Description | Micro SD card (TF card) Connector and Ejector Hinged Lid Surface Mount | Mfr. Part # | HX TF-CARD XG8P H1.5 |
| Package | SMD | Model Number | HX TF-CARD XG8P H1.5 |
This product specification outlines the characteristics and test methods for the TF-CARD XG8P H1.5 connector, designed and manufactured by Shenzhen Hanxia Electronic Co., Ltd. This connector is suitable for applications requiring reliable electrical and mechanical performance, adhering to stringent environmental and quality standards.
| Item | Requirements | Test Methods |
| Product Confirmation | Product shall be conforming to the requirements of applicable product drawing. Visually, dimensions and functionally inspected per applicable product drawing. | Visually, dimensions and functionally inspected per applicable product drawing. |
| Contact resistance (Low Level) | 40 m Max. initial | Subject mated contacts assembled in housing to closed circuit of 10 mA max. at open circuit voltage of 20 mV max. |
| Insulation resistance | 1000 M Min. | Measure by applying test potential between the adjacent contacts, and between the contacts and ground in the mated connector. MIL-STD-202, Method 302, Condition B (100 V DC10%). |
| Dielectric Strength | 500 V AC for 1 minute. Current leakage must be 1.0 mA max. | Measure by applying test potential between the adjacent contacts, and between the contacts and ground in the mated connector. MIL-STD-202, Method 301. |
| Durability (Repeated Mating/Unmating) | Contact Resistance: 150 m Max. after testing | Mate and unmate connector for 10000 cycles. |
| Temperature rise | 30C Max. | Carry rated current load. 0.3A per contact. (UL498) |
| Vibration Sinusoidal Low Frequency | No electrical discontinuity greater than 1 sec | (Details not fully provided in source text) |
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Agent,Importer
Year Established:
2009
Total Annual:
10000000-50000000
Employee Number:
300~500
Ecer Certification：
Verified Supplier
Your Trusted Source for Integrated Circuit Shenzhen ECER Network Technology Co., Ltd. is a professional company focus on integrated circuit ic business. ECER connects buyers worldwide with verified manufacturers across 40+ industries. Every component sourced with precision, quality, and reliability... Your Trusted Source for Integrated Circuit Shenzhen ECER Network Technology Co., Ltd. is a professional company focus on integrated circuit ic business. ECER connects buyers worldwide with verified manufacturers across 40+ industries. Every component sourced with precision, quality, and reliability...
Get in touch with us
Leave a Message, we will call you back quickly!