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Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.
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{"title":"Package Suitable For Various Packaging Simulation Experiments","imgUrl":"https:\/\/img.chinax.com\/nimg\/a8\/d6\/dd5d58d8ac9598cba7bb207eceb4-600x600-1\/package_suitable_for_various_packaging_simulation_experiments.jpg","attrs":{"Brand Name":"FZX","Place of Origin":"PR China","Minimum Order Quantity":"3000pcs","Payment Terms":"T\/T"}}
{"title":"0.5mm Thickness Panel Level Packaging Panel Level BGA\/CSP For Power Adapter","imgUrl":"https:\/\/img.chinax.com\/nimg\/da\/7c\/0f916c6a9e44653f63c5cf67e357-600x600-1\/0_5mm_thickness_panel_level_packaging_panel_level_bga_2fcsp_for_power_adapter.jpg","attrs":{"Brand Name":"FZX Fanout Process and Product","Place of Origin":"PR China"}}
{"title":"Panel Level Packaging Panel Level SiP Used In Various Industries","imgUrl":"https:\/\/img.chinax.com\/nimg\/3b\/59\/58be5dc3cad9fd4a5031d2e9c901-600x600-1\/panel_level_packaging_panel_level_sip_used_in_various_industries.jpg","attrs":{"Brand Name":"FZX Fanout Process and Product","Model Number":"SiP","Place of Origin":"PR China","Payment Terms":"T\/T"}}
Manufacturer of a wide range of products which include Package Suitable For Various Packaging Simulation Experiments,310*320mm Panel Size Panel Level QFN Low Electrical Resistance,0.5mm Thickness Panel Level Packaging Panel Level ...
Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.
Room A208,Science rearch Building,Building A of Foshan high-tech think tank center, nanhai software science park,Shishan Town,Nanhai District,Foshan city,Guangdong Province
