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Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.
{"title":"0.5mm Thickness Panel Level Packaging Panel Level BGA\/CSP For Power Adapter","imgUrl":"https:\/\/img.chinax.com\/nimg\/da\/7c\/0f916c6a9e44653f63c5cf67e357-200x200-1\/0_5mm_thickness_panel_level_packaging_panel_level_bga_2fcsp_for_power_adapter.jpg","attrs":{"Brand Name":"FZX Fanout Process and Product","Place of Origin":"PR China"}}
{"title":"Panel Level Packaging Panel Level SiP Used In Various Industries","imgUrl":"https:\/\/img.chinax.com\/nimg\/3b\/59\/58be5dc3cad9fd4a5031d2e9c901-200x200-1\/panel_level_packaging_panel_level_sip_used_in_various_industries.jpg","attrs":{"Brand Name":"FZX Fanout Process and Product","Model Number":"SiP","Place of Origin":"PR China","Payment Terms":"T\/T"}}
{"title":"310*320mm Panel Size Thin MOS Chip Silicon Low Power Consumption","imgUrl":"https:\/\/img.chinax.com\/nimg\/47\/8c\/ea0e43ea441173f4755ce400c05c-200x200-1\/310_2a320mm_panel_size_thin_mos_chip_silicon_low_power_consumption.jpg","attrs":{"Brand Name":"FZX Fanout Process and Product","Model Number":"Multi-chip MOSFET","Place of Origin":"PR China","Minimum Order Quantity":"3000pcs"}}
{"title":"LED Chip Silicon LED Constant Current Driver Chip 0.4mm*0.555mm*0.20mm","imgUrl":"https:\/\/img.chinax.com\/nimg\/f3\/68\/b19dd5fec9dd4532bea59b963cb1-200x200-1\/led_chip_silicon_led_constant_current_driver_chip_0_4mm_2a0_555mm_2a0_20mm.jpg","attrs":{"Brand Name":"FZX Fanout Process and Product","Model Number":"LED chip\uff08Silicon\uff09","Place of Origin":"PR China","Minimum Order Quantity":"3000pcs"}}
{"title":"310*320mm Fan-Out Panel Level Packaging (FOPLP) Resistance Chip\uff08Silicon\uff09","imgUrl":"https:\/\/img.chinax.com\/nimg\/3a\/66\/97e0e20f4a8f15af406cd9b4ff35-200x200-1\/310_2a320mm_fan_out_panel_level_packaging_28foplp_29_resistance_chip_ef_bc_88silicon_ef_bc_89.jpg","attrs":{"Brand Name":"FZX Fanout Process and Product","Model Number":"Resistance chip","Place of Origin":"PR China","Minimum Order Quantity":"3000pcs"}}
{"title":"310*320mm Fan-Out Panel Level Packaging (FOPLP)IC Chip\uff08Silicon\uff09","imgUrl":"https:\/\/img.chinax.com\/nimg\/16\/a1\/a6025c29c5fc34a785268270bd58-200x200-1\/310_2a320mm_fan_out_panel_level_packaging_28foplp_29ic_chip_ef_bc_88silicon_ef_bc_89.jpg","attrs":{"Brand Name":"FZX Fanout Process and Product","Model Number":"FZX-IC Chip","Place of Origin":"PR China","Minimum Order Quantity":"3000pcs"}}
{"title":"Panel Level Packaging Face Down-EWLB High Heat Dissipation High Reliability","imgUrl":"https:\/\/img.chinax.com\/nimg\/45\/42\/53f29b09437794adef53938d51ca-200x200-1\/panel_level_packaging_face_down_ewlb_high_heat_dissipation_high_reliability.jpg","attrs":[]}
{"title":"Fan-Out Panel Level Packaging (FOPLP)-Product Structure(Face Up)-Wire Bond Ball","imgUrl":"https:\/\/img.chinax.com\/nimg\/d3\/30\/3d9dcb44e111a2cb4d4885dc5dcf-200x200-1\/fan_out_panel_level_packaging_28foplp_29_product_structure_28face_up_29_wire_bond_ball.jpg","attrs":{"Brand Name":"FZX Fanout Process and Product","Model Number":"Face up-wire bond ball","Place of Origin":"PR China","Minimum Order Quantity":"3000pcs"}}
{"title":"Fan-Out Panel Level Packaging (FOPLP) Product Structure Embedded Package","imgUrl":"https:\/\/img.chinax.com\/nimg\/46\/c6\/367e16c9026613e60783e72da0f8-200x200-1\/fan_out_panel_level_packaging_28foplp_29_product_structure_embedded_package.jpg","attrs":{"Brand Name":"FZX","Model Number":"embedded package","Place of Origin":"PR China","Minimum Order Quantity":"3000pcs"}}
{"title":"310*320mm Fan-Out Panel Level Packaging (FOPLP) GaN Product","imgUrl":"https:\/\/img.chinax.com\/nimg\/8b\/34\/6cb359bc23b65172e72c5b98481b-200x200-1\/310_2a320mm_fan_out_panel_level_packaging_28foplp_29_gan_product.jpg","attrs":{"Brand Name":"FZX Fanout Process and Product","Model Number":"FZX-GaN","Place of Origin":"PR China","Minimum Order Quantity":"3000pcs"}}
{"title":"310*320mm Fan-Out Panel Level Packaging (FOPLP) Radio Frequency (RF)","imgUrl":"https:\/\/img.chinax.com\/nimg\/44\/ed\/31228249dc2191d79cb099eb2369-200x200-1\/310_2a320mm_fan_out_panel_level_packaging_28foplp_29_radio_frequency_28rf_29.jpg","attrs":{"Brand Name":"FZX Fanout Process and Product","Model Number":"Radio Frequency (RF)","Place of Origin":"PR China","Minimum Order Quantity":"3000pcs"}}
{"title":"310*320mm Fan-Out Panel Level Packaging (FOPLP) MEMS Microphone Package","imgUrl":"https:\/\/img.chinax.com\/nimg\/eb\/a7\/ac1c2750b60bbfc193e749129b6b-200x200-1\/310_2a320mm_fan_out_panel_level_packaging_28foplp_29_mems_microphone_package.jpg","attrs":{"Brand Name":"FZX Fanout Process and Product","Model Number":"MEMS","Place of Origin":"PR China","Minimum Order Quantity":"3000pcs"}}
{"title":"310*320mm Fan-Out Panel Level Packaging (FOPLP) CPO\/Mini\/Micro LED","imgUrl":"https:\/\/img.chinax.com\/nimg\/aa\/21\/409ec6ede13ad9c988cc851272da-200x200-1\/310_2a320mm_fan_out_panel_level_packaging_28foplp_29_cpo_2fmini_2fmicro_led.jpg","attrs":{"Brand Name":"FZX Fanout Process and Product","Model Number":"FZX-CPO\/mini\/micro LED","Place of Origin":"PR China","Minimum Order Quantity":"3000pcs"}}
{"title":"310*320mm Fan-Out Panel Level Packaging (FOPLP) Power Package","imgUrl":"https:\/\/img.chinax.com\/nimg\/be\/a4\/18add1ac698850d78dd79d734623-200x200-1\/310_2a320mm_fan_out_panel_level_packaging_28foplp_29_power_package.jpg","attrs":{"Brand Name":"FZX Fanout Process and Product","Model Number":"FZX- power package","Place of Origin":"PR China","Minimum Order Quantity":"3000pcs"}}
{"title":"high aspect ratio TGV Foundary Capabilities for semiconductor packaging","imgUrl":"https:\/\/img.chinax.com\/nimg\/ed\/3a\/3b6bbee50406b8f2c0ee772c7a78-200x200-1\/high_aspect_ratio_tgv_foundary_capabilities_for_semiconductor_packaging.jpg","attrs":{"Brand Name":"FZX -TGV","Model Number":"TGV Foundary","Place of Origin":"PR China","Minimum Order Quantity":"10 panel"}}
{"title":"High Efficiency Though Hole\/Blind Hole On Glass 35um For GPU\/CPU\/AI Chips","imgUrl":"https:\/\/img.chinax.com\/nimg\/e3\/bf\/195dedc9cd4784ab325878bb0469-200x200-1\/high_efficiency_though_hole_2fblind_hole_on_glass_35um_for_gpu_2fcpu_2fai_chips.jpg","attrs":{"Brand Name":"FZX Fanout Process and Product","Model Number":"FZX-TH2","Certification":"CE, Rohs, FCC","Place of Origin":"PR China"}}
{"title":"High Efficient Glass Substrate Panel Size 510*515mm PVD 300mm-600mm","imgUrl":"https:\/\/img.chinax.com\/nimg\/45\/c2\/08c3c6742b3e54ef19e67dd245b7-200x200-1\/high_efficient_glass_substrate_panel_size_510_2a515mm_pvd_300mm_600mm.jpg","attrs":{"Brand Name":"FZX Fanout Process and Product","Model Number":"FZX-PVD2","Certification":"CE, Rohs, FCC","Place of Origin":"PR China"}}
{"title":"Glass Substrate Technology-Plating Double Side Stable And Easily Maintain","imgUrl":"https:\/\/img.chinax.com\/nimg\/b0\/81\/ba239b1720fa9326b5aba13e89d7-200x200-1\/glass_substrate_technology_plating_double_side_stable_and_easily_maintain.jpg","attrs":{"Brand Name":"FZX -plating","Model Number":"FZX","Certification":"CE, Rohs, FCC","Place of Origin":"PR China"}}
{"title":"Package Suitable For Various Packaging Simulation Experiments","imgUrl":"https:\/\/img.chinax.com\/nimg\/a8\/d6\/dd5d58d8ac9598cba7bb207eceb4-200x200-1\/package_suitable_for_various_packaging_simulation_experiments.jpg","attrs":{"Brand Name":"FZX","Place of Origin":"PR China","Minimum Order Quantity":"3000pcs","Payment Terms":"T\/T"}}
Be a quality Panel Level Packaging Form supplier from China，we
provide Panel Level Packaging Chip, Panel Level Packaging Product Structure , Fan Out Panel Level Packaging, TGV Through Glass Via, etc.
Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.
Room A208,Science rearch Building,Building A of Foshan high-tech think tank center, nanhai software science park,Shishan Town,Nanhai District,Foshan city,Guangdong Province
