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Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.
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{"title":"Package Suitable For Various Packaging Simulation Experiments","imgUrl":"https:\/\/img.chinax.com\/nimg\/a8\/d6\/dd5d58d8ac9598cba7bb207eceb4-600x600-1\/package_suitable_for_various_packaging_simulation_experiments.jpg","attrs":{"Brand Name":"FZX","Place of Origin":"PR China","Minimum Order Quantity":"3000pcs","Payment Terms":"T\/T"}}
{"title":"Panel Level Packaging Face Down-EWLB High Heat Dissipation High Reliability","imgUrl":"https:\/\/img.chinax.com\/nimg\/45\/42\/53f29b09437794adef53938d51ca-600x600-1\/panel_level_packaging_face_down_ewlb_high_heat_dissipation_high_reliability.jpg","attrs":[]}
{"title":"Fan-Out Panel Level Packaging (FOPLP)-Product Structure(Face Up)-Wire Bond Ball","imgUrl":"https:\/\/img.chinax.com\/nimg\/d3\/30\/3d9dcb44e111a2cb4d4885dc5dcf-600x600-1\/fan_out_panel_level_packaging_28foplp_29_product_structure_28face_up_29_wire_bond_ball.jpg","attrs":{"Brand Name":"FZX Fanout Process and Product","Model Number":"Face up-wire bond ball","Place of Origin":"PR China","Minimum Order Quantity":"3000pcs"}}
{"title":"Fan-Out Panel Level Packaging (FOPLP) Product Structure Embedded Package","imgUrl":"https:\/\/img.chinax.com\/nimg\/46\/c6\/367e16c9026613e60783e72da0f8-600x600-1\/fan_out_panel_level_packaging_28foplp_29_product_structure_embedded_package.jpg","attrs":{"Brand Name":"FZX","Model Number":"embedded package","Place of Origin":"PR China","Minimum Order Quantity":"3000pcs"}}
Manufacturer of a wide range of products which include Package Suitable For Various Packaging Simulation Experiments,Panel Level Packaging Face Down-EWLB High Heat Dissipation High Reliability,Fan-Out Panel Level Packaging (FOPLP)...
Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.
Room A208,Science rearch Building,Building A of Foshan high-tech think tank center, nanhai software science park,Shishan Town,Nanhai District,Foshan city,Guangdong Province
