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Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.
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{"title":"High Efficiency Though Hole\/Blind Hole On Glass 35um For GPU\/CPU\/AI Chips","imgUrl":"https:\/\/img.chinax.com\/nimg\/e3\/bf\/195dedc9cd4784ab325878bb0469-600x600-1\/high_efficiency_though_hole_2fblind_hole_on_glass_35um_for_gpu_2fcpu_2fai_chips.jpg","attrs":{"Brand Name":"FZX Fanout Process and Product","Model Number":"FZX-TH2","Certification":"CE, Rohs, FCC","Place of Origin":"PR China"}}
{"title":"Package Suitable For Various Packaging Simulation Experiments","imgUrl":"https:\/\/img.chinax.com\/nimg\/a8\/d6\/dd5d58d8ac9598cba7bb207eceb4-600x600-1\/package_suitable_for_various_packaging_simulation_experiments.jpg","attrs":{"Brand Name":"FZX","Place of Origin":"PR China","Minimum Order Quantity":"3000pcs","Payment Terms":"T\/T"}}
Manufacturer of a wide range of products which include high aspect ratio TGV Foundary Capabilities for semiconductor packaging,High Efficiency Though Hole/Blind Hole On Glass 35um For GPU/CPU/AI Chips,Package Suitable For Various ...
Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.
Room A208,Science rearch Building,Building A of Foshan high-tech think tank center, nanhai software science park,Shishan Town,Nanhai District,Foshan city,Guangdong Province
