Beijing Silk Road Enterprise Management Services Co., Ltd.
| Type | Metal Film Resistor |
| Resistance | 100Ω |
| Power(Watts) | 1W |
| Temperature Coefficient | ±300ppm/℃ |
| Tolerance | ±5% |
| Description | Metal Film Resistor 100Ω 1W ±300ppm/℃ ±5% Through Hole,D3xL9mm Through Hole Resistors RoHS |
| Mfr. Part # | MOS1CT52A101J |
| Package | Through Hole,D3xL9mm |
| Model Number | MOS1CT52A101J |
View Detail Information
Explore similar products
Futaba Elec RSS02J4700A520NH fixed resistor with UL94 V0 flameproof coating and
Wirewound Power Resistor BOURNS W5M15R0J with Low Thermal Resistant Ceramic Core
High voltage precision resistor RESI HVLR1905J1M80K9 with low voltage coefficien
Lead Free Metal Film Fixed Resistors UNI ROYAL MFR0W4F1001A50 Series Precise
Product Specification
| Type | Metal Film Resistor | Resistance | 100Ω |
| Power(Watts) | 1W | Temperature Coefficient | ±300ppm/℃ |
| Tolerance | ±5% | Description | Metal Film Resistor 100Ω 1W ±300ppm/℃ ±5% Through Hole,D3xL9mm Through Hole Resistors RoHS |
| Mfr. Part # | MOS1CT52A101J | Package | Through Hole,D3xL9mm |
| Model Number | MOS1CT52A101J |
The MOS and MOSX series are compact, high-reliability fixed resistors designed for demanding applications. Featuring a flame-retardant coating equivalent to UL94 V-0, these resistors offer excellent durability and can be automatically inserted and formed. They are compliant with EU RoHS standards and suitable for surface-mount applications, ensuring high reliability and performance in various industrial settings, including automotive, medical, and aerospace equipment. The series includes metal oxide film (MOS) and metal film (MOSX) types, available in various power ratings and with options for different lead forms and packaging.
General Ratings:
| Specification | Value |
|---|---|
| Rated Ambient Temperature | +70 |
| Operating Temperature Range | -55 to +200 |
| Rated Voltage Calculation | Lesser of (Rated Power Nominal Resistance Value) or Max. Operating Voltage |
Dimensions and Weight:
| Model | Dimensions (mm) L x C | Max. D | d (Nominal) | Weight (g/1000pcs) |
|---|---|---|---|---|
| MOS(X)1/2 | 6.20.5 x 7.1 | 2.50.5 | 0.6 | 250 |
| MOS(X)1 | 9.01.0 x 11.1 | 3.00.5 | 0.6 | 350 |
| MOS(X)2 | 12.01.0 x 15.0 | 4.00.5 | 0.8 | 800 |
| MOS(X)3 | 15.51.0 x 18.0 | 6.01.0 | 0.8 | 1,400 |
| MOS(X)5 | 24.51.0 x 28.0 | 9.01.0 | 0.8 | 5,240 |
Model Naming Convention:
| Component | Description |
|---|---|
| MOS/MOSX | Resistor Type (Metal Oxide Film / Metal Film) |
| Rated Power | 1/2 (0.5W), 1 (1W), 2 (2W), 3 (3W), 5 (5W) |
| Terminal Material | C: SnCu |
| Secondary Processing | Refer to table |
| Packaging | A: AMMO, R: Reel, Blank: Box, TEBTEG: Embossed Tape |
| Nominal Resistance | F: 4-digit, G, J: 3-digit |
| Resistance Tolerance | F: 1%, G: 2%, J: 5% |
Available Secondary Processing & Packaging:
| Model | Axial Taping | Formed Taping | Radial Taping (VT) | Radial Taping (GT) | L Forming | U Forming | M Forming | N Forming |
|---|---|---|---|---|---|---|---|---|
| MOS(X)1/2C | - | - | - | - | - | |||
| MOS(X)1C | - | - | - | - | - | |||
| MOS(X)2C | - | - | - | - | ||||
| MOS(X)3C | - | - | - | - | - | |||
| MOS(X)5C | - | - | - | - | - | - | - |
Electrical Characteristics:
| Model | Rated Power | Resistance Range () | Resistance Temp. Coefficient (10/K) | Max. Operating Voltage (V) | Max. Overload Voltage (V) | Withstand Voltage (V) | Taping & Packaging (pcs/AMMO) |
|---|---|---|---|---|---|---|---|
| MOS1/2C | 0.5W | 1047k | 300 | E=PR (V) / 600 | 400 | - | 2,000 |
| MOS1C | 1W | 1068k | 300 | 500 | - | - | 2,000 |
| MOS2C | 2W | 10100k | 300 | 350 | 700 | - | 1,000 |
| MOS3C | 3W | - | 300 | - | 700 | - | 500 |
| MOS5C | 5W | - | 300 | 500 | 1000 | 800 | - |
| MOSX1/2C | 0.5W | 0.229.1 | 300 | E=PR (V) / 400 | E2.5 (V) | - | 2,000 |
| MOSX1C | 1W | - | 300 | 500 | - | - | 2,000 |
| MOSX2C | 2W | - | 300 | - | 1,000 | - | 1,000 |
| MOSX3C | 3W | - | 300 | - | 700 | - | 500 |
| MOSX5C | 5W | - | 300 | 500 | 800 | - | - |
Performance Characteristics:
| Test Item | Standard Value | Test Method | Guarantee Value | Representative Value |
|---|---|---|---|---|
| Resistance | Within specified tolerance | - | - | R(%) + 0.05 |
| Resistance Temp. Coefficient | Within specified value | +25/+125 | - | - |
| Overload (Short-time) | (2%+0.1) | 2.5x Rated Voltage for 5s | 1 | - |
| Resistance to Soldering Heat | 1 | 2605, 10s1s | 0.5 | - |
| Terminal Strength | - | 360 twist, 5 times | - | No exposed wires or loose terminals |
| Temperature Cycling | 1 | -55 (30min.) / +155 (30min.) 5 cycles | 0.5 | - |
| Damp Heat Load | (5%+0.1) | 402, 90%-95%RH, 1000h (1.5h ON, 0.5h OFF cycle) | 2.5 | 1.5 |
| Endurance at 70 | (5%+0.1) | 702, 1000h (1.5h ON, 0.5h OFF cycle) | 2.5 | 1.5 |
| Solvent Resistance | - | 2 min Isopropanol ultrasonic cleaning (Output: 0.3W/cm, Freq: 28kHz, Temp: 355) | - | No external abnormalities, marking easily identifiable |
| Flammability | - | Fire resistance: Burn for 15s, remove for 15s, repeat 5 times. Overload flammability: Apply 2x, 4x, 8x, 16x, 32x rated power (AC) for 1 min each until open circuit. Do not exceed 4x max. operating voltage. | - | No burning or self-ignition |
Secondary Processing Dimensions (mm):
L Forming:
| Model | MOS/MOSX | P1 | H11 | H21 | d (Nominal) | Max. L | Substrate Hole Diameter |
|---|---|---|---|---|---|---|---|
| 1CL10A | MOS | 10.0 | 5.3 | 4.0 | 0.6 | 0.8 | - |
| 1CL12.5A | MOS | 12.5 | 7.0 | - | 0.8 | 1.0 | - |
| 1CL15A | MOS | 15.0 | 6.5 | - | 0.8 | - | - |
| 2CL15A | MOS | 17.5 | 7.0 | - | 0.8 | - | - |
| 2CL15F | MOS | - | 4.5 | - | 0.8 | - | - |
| 2CL20A | MOS | 20.0 | 9.0 | - | 0.8 | - | - |
| 2CL20D | MOS | - | 4.8 | - | 0.8 | - | - |
| 3CL20A | MOS | - | 8.0 | - | 0.8 | - | - |
| 3CL20C | MOS | - | 10.0 | - | 0.8 | - | - |
| 3CL20T | MOS | - | 4.0 | - | 0.8 | - | - |
| 3CL25A | MOS | 25.0 | 7.0 | - | 0.8 | - | - |
| 3CL30A | MOS | 30.0 | 7.0 | - | 0.8 | - | - |
| 5CL30A | MOS | - | 8.5 | - | 0.8 | - | - |
| 5CL35A | MOS | 35.0 | 5.5 | - | 0.8 | - | - |
M Forming:
| Model | MOS/MOSX | P1 | H1 | d (Nominal) | Substrate Hole Diameter |
|---|---|---|---|---|---|
| 1/2CM10C | MOS | 10.0 | 3.5 | 0.6 | 0.8 |
| 1/2CM10F | MOS | 10.0 | 5.0 | 0.6 | 0.8 |
| 1CM12.5C | MOS | 12.5 | 3.5 | 0.8 | 1.0 |
| 1CM12.5D | MOS | 12.5 | 4.0 | 0.8 | 1.0 |
| 1CM15F | MOS | 15.0 | 5.0 | 0.8 | 1.0 |
| 1CM15J | MOS | 15.0 | 6.3 | 0.8 | 1.0 |
| 1CM15S | MOS | 15.0 | 11.0 | 0.8 | 1.0 |
| 2CM15C | MOS | 15.0 | 3.5 | 0.8 | 1.0 |
| 2CM15E | MOS | 15.0 | 4.5 | 0.8 | 1.0 |
| 2CM16D | MOS | 16.0 | 4.0 | 0.8 | 1.0 |
| 2CM20D | MOS | 20.0 | 4.0 | 0.8 | 1.0 |
| 2CM20U | MOS | 20.0 | 13.5 | 0.8 | 1.0 |
| 3CM20E | MOS | 20.0 | 4.6 | 0.8 | 1.0 |
| 3CM26E | MOS | 26.0 | 4.7 | 0.8 | 1.0 |
| 5CM30U | MOS | 30.0 | 13.0 | 0.8 | 1.0 |
UCL Forming:
| Model | MOS/MOSX | H11 | H21 | H31 | d (Nominal) | Substrate Insertion Pitch | Substrate Hole Diameter |
|---|---|---|---|---|---|---|---|
| 1CUCL | MOS | 13.0 | 17.0max. | 3.5 | 0.8 | 5.0 | 1.0 |
| 2CUCL | MOS | 14.5 | 18.5max. | 3.5 | 0.8 | - | 1.0 |
| 3CUCL | MOS | 20.0max. | 22.0 | 4.0 | 0.8 | - | 1.0 |
Radial Taping (VT):
| Model | MOS/MOSX | Rated | VTP/VTF | A | D | d (Nominal) | F | F1 | H | H0 | P | P0 | P1 | W | W1 | D0 | Substrate Hole Diameter |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 1/2C | MOS/MOSX | VTP | 6.20.5 | 2.50.5 | 0.6 | 5.00.5 | 7.3max. | 13max. | 16+1.0/-0 | 12.71.0 | 12.70.3 | 3.850.7 | 18.00.5 | 9.00.5 | 4.00.2 | 0.8 | |
| 1C | MOS/MOSX | VTP | 9.010 | 3.00.5 | 0.6 | - | - | 16max. | - | - | - | - | - | - | 1.0 | ||
| 2C | MOS/MOSX | VTP | 12.01.0 | 4.00.5 | 0.8 | - | - | 22.5max. | - | - | - | - | - | - | 1.0 | ||
| 2C | MOS/MOSX | VTF | 12.01.0 | 4.00.5 | 0.8 | - | - | 22.5max. | - | - | - | - | - | - | 1.0 |
Wire insulation coating color: Green. Substrate insertion pitch: 5.0mm.
N Forming (Embossed Tape):
| Model | MOS/MOSX | Rated | N14.5TEB | N17TEB | N20TEG | P1 | T0.5 | A0.5 | d (Nominal) |
|---|---|---|---|---|---|---|---|---|---|
| 1C | MOS/MOSX | - | 14.5 | - | - | 5.0 | 4.8 | 0.8 | |
| 2C | MOS/MOSX | - | - | 17.0 | - | 6.0 | 5.8 | 0.8 | |
| 3C | MOS/MOSX | - | - | - | 20.0 | 7.51.0 | 6.5 | 0.8 |
Requires special nozzle. Consult for use. Refer to Appendix for packaging specifications. Various wire forming options available upon customer request.
N Forming (Embossed Tape) Dimensions (mm):
| Model | MOS/MOSX | Rated | N14.5TEB | N17TEB | N20TEG | A | B | C | D |
|---|---|---|---|---|---|---|---|---|---|
| 1C | MOS/MOSX | - | 12.5 | - | - | 16.5 | 7.0 | 2.0 | |
| 2C | MOS/MOSX | - | - | 14.6 | - | 19.4 | 8.0 | 2.4 | |
| 3C | MOS/MOSX | - | - | - | 17.6 | 22.4 | 9.5 | 2.4 |
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Agent,Importer
Year Established:
2009
Employee Number:
>>300
Ecer Certification：
Verified Supplier
Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an... Company Profile Beijing Silk Road Enterprise Management Services Co.,Ltd. is a professional company focus on integrated circuit ic business. Beijing Silk Road will also responsible with exporting and logistic business. there is professional factory Beijing Silk Road which focus on desigining an...
Get in touch with us
Leave a Message, we will call you back quickly!