DQS Electronic Co., Limited
| Payment Terms | T/T |
| Layer | 8L |
| Material | Aluminum |
| Copper Thickness | 1-3OZ |
| Min. Component Size | 01005 |
| Min. Line Width/Spacing | 4/4 mil |
| Assembly Method | SMT/DIP |
| Item | ODM/OEM |
| Application | Base Atation RF Processing |
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Product Specification
| Payment Terms | T/T | Layer | 8L |
| Material | Aluminum | Copper Thickness | 1-3OZ |
| Min. Component Size | 01005 | Min. Line Width/Spacing | 4/4 mil |
| Assembly Method | SMT/DIP | Item | ODM/OEM |
| Application | Base Atation RF Processing | ||
| High Light | Aluminum surface mount circuit board ，RF surface mount circuit board ，RF electronic pcb board | ||
Aluminum PCB Thermal Conductivity RF Processing PCBA Telecom PCB Assembly
♦ What's Telecom PCB Assembly?
Telecom PCB Assembly refers to the manufacturing and assembly of printed circuit boards (PCBs) specifically designed for telecommunications equipment, such as:
These PCBs require high-frequency performance, signal integrity, and reliability to handle fast data transmission, low latency, and harsh operational environments.
1. High-Frequency Materials
2. Multilayer & HDI (High-Density Interconnect) Designs
3. RF & Microwave Components
4. Thermal Management
5. Strict Compliance Standards
Components: high-frequency substrate (PTFE), high-temperature resistant chip (-40℃~125℃), 50Ω impedance matching.
Manufacturing accuracy: patch ±0.025mm (normal ±0.05mm), laser drilling + HDI high-density wiring.
Special processes: impedance control (differential line ±10%), electromagnetic shielding (metal cover), thermal management (aluminum substrate heat dissipation).
♦ Technical Parameters
| PCB Assembly Capability | |||||
|
Item |
Normal |
Special | |||
|
SMT Assembly |
PCB(used for SMT) specification | Length and Width( L* W) | Minimum | L≥3mm, W≥3mm | L＜2mm |
| Maximum | L≤800mm, W≤460mm | L ＞ 1200mm, W＞500mm | |||
| Thickness( T) | Thinnest | 0.2mm | T＜0.1mm | ||
| Thickest | 4 mm | T＞4.5mm | |||
|
SMT components specification | Outline Dimension | Min size | 0201(0.6mm*0.3mm) | 01005(0.3mm*0.2mm) | |
| Max size | 200 * 125 | 200 * 125 | |||
| component thickness | T≤15mm | 6.5mm＜T≤15mm | |||
| QFP,SOP,SOJ (multi pins) | Min pin space | 0.4mm | 0.3mm≤Pitch＜0.4mm | ||
| CSP/ BGA | Min ball space | 0.5mm | 0.3mm≤Pitch＜0.5mm | ||
|
DIP Assembly |
PCB specification |
Length and Width( L* W) | Minimum | L≥50mm, W≥30mm | L＜50mm |
| Maximum | L≤1200mm, W≤450mm | L≥1200mm, W≥500mm | |||
| Thickness( T) | Thinnest | 0.8mm | T＜0.8mm | ||
| Thickest | 3.5mm | T＞2mm | |||
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2. Quality Guaranteed:
3. Premium Service:
Company Details
Business Type:
Manufacturer
Employee Number:
>800
Ecer Certification：
Verified Supplier
DQS Electronic is located in Shenzhen, focusing on PCB Layout Design, PCB Fabrication, Electronic Components Sourcing, SMT, PCB Assembly and Testing. We are a one-stop EMS electronic manufacturing company committed to providing global customers with rapid prototyping and mass production. Our produ... DQS Electronic is located in Shenzhen, focusing on PCB Layout Design, PCB Fabrication, Electronic Components Sourcing, SMT, PCB Assembly and Testing. We are a one-stop EMS electronic manufacturing company committed to providing global customers with rapid prototyping and mass production. Our produ...
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