Bicheng Electronics Technology Co., Ltd
| Payment Terms | T/T |
| Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days |
| Packaging Details | Vacuum bags+Cartons |
| Part number | CuClad 217 |
| Laminate thickness | 0.25mm, 0.51mm, 0.79mm, 1.57mm |
| Laminate size | 18"X12"(457X305mm); 18"X24"(457X610mm) |
| Copper weight | 0.5OZ（0.018mm）1OZ（0.035mm） |
| Brand Name | Bicheng |
| Model Number | BIC-332.V1.0 |
| Certification | UL, ISO9001, IATF16949 |
| Place of Origin | CHINA |
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Product Specification
| Payment Terms | T/T | Supply Ability | 5000PCS per month |
| Delivery Time | 8-9 working days | Packaging Details | Vacuum bags+Cartons |
| Part number | CuClad 217 | Laminate thickness | 0.25mm, 0.51mm, 0.79mm, 1.57mm |
| Laminate size | 18"X12"(457X305mm); 18"X24"(457X610mm) | Copper weight | 0.5OZ（0.018mm）1OZ（0.035mm） |
| Brand Name | Bicheng | Model Number | BIC-332.V1.0 |
| Certification | UL, ISO9001, IATF16949 | Place of Origin | CHINA |
| High Light | High Frequency CuClad 217 laminate ，Copper Clad Laminate with high frequency ，CuClad 217 PCB material | ||
CuClad® laminates are composite materials composed of woven fiberglass and polytetrafluoroethylene (PTFE), engineered specifically for deployment as printed circuit board (PCB) substrates. By precisely regulating the fiberglass-to-PTFE ratio, CuClad laminates deliver a diversified product portfolio: ranging from variants with ultra-low dielectric constant and loss tangent to highly reinforced grades optimized for enhanced dimensional stability.
Compared with non-woven fiberglass-reinforced PTFE laminates of equivalent dielectric constants, the woven fiberglass reinforcement in CuClad products confers superior dimensional stability. The consistent, tightly controlled PTFE coating process applied to the fiberglass cloth enables Rogers to supply laminates with a broader spectrum of dielectric constant options, as well as improved dielectric constant uniformity relative to comparable non-woven fiberglass-reinforced alternatives. These performance attributes position CuClad as a preferred material solution for fabricating filters, couplers, and low-noise amplifiers.
A defining characteristic of CuClad laminates is their cross-ply construction: successive layers of PTFE-coated fiberglass plies are oriented at 90° to one another. This unique design ensures true electrical and mechanical isotropy across the XY plane—a feature exclusive to CuClad laminates that no other woven or non-woven fiberglass-reinforced PTFE laminates on the market can match. For certain phased array antenna applications, designers have verified that this level of isotropy is a critical performance prerequisite.
CuClad 217 (with a dielectric constant Er of 2.17–2.20) leverages a low fiberglass-to-PTFE ratio to achieve the minimum dielectric constant and dissipation factor among all fiberglass-reinforced PTFE laminates. Combined, these properties facilitate faster signal propagation speeds and elevated signal-to-noise ratios.
Features & Benefits
-Cross-ply woven fiberglass structure, with alternating plies oriented at 90° to each other
-High PTFE-to-glass ratio
-Superior dielectric constant uniformity versus comparable non-woven fiberglass-reinforced laminates
-Electrical and mechanical isotropy in the XY plane
-Ultra-low signal loss
-Ideal for circuits sensitive to dielectric constant (Er) variations
Typical Applications
-Military electronics systems (including radars, electronic countermeasures (ECM), and electronic support measures (ESM))
-Microwave components (such as low-noise amplifiers (LNAs), filters, and couplers)
| Properties | Test Method | Condition | CuClad 217 |
| Dielectric Constant @10 GHz | IPC TM-650 2.5.5.5 | C23/50 | 2.17, 2.20 |
| Dielectric Constant @1MHz | IPC TM-650 2.5.5.3 | C23/50 | 2.17, 2.20 |
| Dissipation Factor @10 GHz | IPC TM-650 2.5.5.5 | C23/50 | 0.0009 |
| Thermal Coefficient of Er (ppm/°C) | IPC TM-650 2.5.5.5 Adapted | -10°C to +140°C | -160 |
| Peel Strength (lbs.per inch) | IPC TM-650 2.4.8 | After Thermal Stress | 14 |
| Volume Resistivity (MΩ-cm) | IPC TM-650 2.5.17.1 | C96/35/90 | 2.3×10⁸ |
| Surface Resistivity (MΩ) | IPC TM-650 2.5.17.1 | C96/35/90 | 3.4×10⁶ |
| Arc Resistance (seconds) | ASTM D-495 | D48/50 | >180 |
| Tensile Modulus(kpsi) | ASTM D-638 | A, 23°C | 275, 219 |
| Tensile Strength (kpsi) | ASTM D-882 | A, 23°C | 8.8, 6.6 |
| Compressive Modulus(kpsi) | ASTM D-695 | A, 23°C | 237 |
| Flexural Modulus(kpsi) | ASTM D-790 | A, 23°C | 357 |
| Dielectric Breakdown (kv) | ASTM D-149 | D48/50 | >45 |
| Specific Gravity (g/cm³) | ASTM D-792 Method A | A, 23°C | 2.23 |
| Water Absorption (%) | MIL-S-13949H 3.7.7; IPC TM-650 2.6.2.2 | E1/105 + D24/23 | 0.02 |
| Coefficient of Thermal Expansion (ppm/°C) - X Axis - Y Axis - Z Axis | IPC TM-650 2.4.24 Mettler 3000 Thermomechanical Analyzer | 0°C to 100°C | 29 |
| 28 | |||
| 246 | |||
| Thermal Conductivity | ASTM E-1225 | 100°C | 0.26 |
| Outgassing - Total Mass Loss (%) Collected Volatile Condensable Material (%) Water Vapor Regain (%) Visible Condensate (±) | NASA SP-R-0022A Maximum 1.00% Maximum 0.10% | 125°C, ≤10⁻⁶ torr
| 0.01 0.01 0.00 NO |
| Flammability | UL 94 Vertical Burn; IPC TM-650 2.3.10 | C48/23/50, E24/125 | Meets UL94-V0 |
Company Details
Business Type:
Manufacturer,Distributor/Wholesaler,Exporter,Seller
Year Established:
2003
Total Annual:
10 million-18 million
Employee Number:
350~450
Ecer Certification：
Verified Supplier
Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime... Company Profile Founded in 2003, Shenzhen Bicheng Electronics Technology Co., Ltd is an established high frequency PCB supplier and exporter in Shenzhen China, severing cellular base station antenna, satellite, high frequency passive components, microstrip line and band line circuit, millime...
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