Products
Manufacturer of a wide range of products which include Energy Power Customized OEM PCBA with 0.2mm-6.00mm Board Thickness in China and,1-30Layer FR4 TG170 PC PCB Assembly for New Energy Equipment China and Cambodia,Professional PC...
MOQ: 1pcs
Price: USD1-100
Payment Terms | T/T,Paypal |
Supply Ability | 100pcs/hour |
Delivery Time | 1-2 weeks after all parts collected |
Packaging Details | 60*40*30cm cartons and ESD bags |
Material | FR-4,FR1, CEM-1, CEM-3,Aluminum, Ceramic, Metal-backed Laminate, etc.Also make Crockery, Taconic, Rogers PCBs etc. |
Finish Board Thickness | 0.2 mm-6.00mm(8mil-126mil) |
Surface Finish | Gold finger(>=0.13um), Immersion Gold(0.025-0075um), Plating Gold(0.025-3.0um), HASL(5-20um), OSP(0.2-0.5um) |
Board thickness tolerance | 4 layers:+/-0.13mm(5mil) |
Test Voltage | 10-300V |
Hole Diameter(H) | Non PTHL:+/-0.05mm(2mil) |
Brand Name | Suntek |
Model Number | SBBF033 |
Certification | ISO9001, ISO13485, TS16949 and UL E476377 |
Place of Origin | China/Cambodia |
MOQ: 5pcs
Price: USD1/PCS
Payment Terms | T/T,Paypal |
Supply Ability | 100pcs/hour |
Delivery Time | 1-2 weeks after all parts collected |
Packaging Details | 60*40*30cm cartons and ESD bags |
Layer | 1-22 layers |
Materials | CEM1, CEM3, FR-4, High Tg FR-4, Aluminum board |
CE | ISO9001, ISO13485, TS16949 and UL E476377 |
PCB thickness | 1.6 ±0.1mm |
Max. board Thickness | 6.0mm |
Surface finished | Lead free,Immersion ENIG,Chem Tin,Flash Gold,OSP,Gold finger,Peelable,Immersion Silver |
Brand Name | Suntek |
Model Number | SBBF03 |
Certification | ISO9001, ISO13485, TS16949 and UL E476377 |
Place of Origin | China/Cambodia |
MOQ: 1
Price: Customized products
Payment Terms | TT,Paypal |
Delivery Time | 5-7days after all components kitted |
Packaging Details | By ESD bags and carton |
Material | FR4(TG130-T180),Rogers,Aluminum |
Thickness | 0.8mm-4mm |
Layer | 1L-32L |
Copper | 0.3OZ-10OZ |
Solder Type | Lead or Lead-free |
Hole plating | >25um |
Min Hole | 0.1mm |
Brand Name | Suntek/BLSuntek |
Model Number | F016-030 |
Certification | ISO9001 ISO13485 IATF16949 UL |
Place of Origin | China or Cambodia |
MOQ: 1pcs
Price: Based on Gerber
Payment Terms | T/T,Paypal |
Supply Ability | 100pcs/hour |
Delivery Time | 1-2 weeks after all parts collected |
Packaging Details | 60*40*30cm cartons and ESD bags |
Base Material | Fr4,Rogers,Getek,Halogen free,Low Dk/Low Df |
Build-up Material | RCC,FR4 |
Max Layer | 38L |
Min Hole mm(mil) | 0.2(8) |
Min Land mm(mil) | 0.4(16) |
Min IVH Hole/Land Size um(mil) | 150/300(6/12) |
Laser Hole Filling | Yes |
Max Copper Thickness | 8OZ |
Surface Finish | ENIG/OSP/HASL/Au Plating/Immersion Tin |
Brand Name | Suntek |
Model Number | F56652 |
Certification | ISO9001, ISO13485, TS16949 and UL E476377 |
Place of Origin | China/Cambodia |
MOQ: 1
Price: Customized products
Payment Terms | TT,Paypal |
Delivery Time | 5-7days after all components kitted |
Packaging Details | By ESD bags and carton |
Material | FR4(TG130-T180),Rogers,Aluminum |
Thickness | 0.5mm-4.5mm |
Layer | 1L-32L |
Copper | 0.3OZ-10OZ |
Solder Type | Lead or Lead-free |
Hole plating | >25um |
Min Hole | 0.1mm |
Brand Name | Suntek/BLSuntek |
Model Number | F016-030 |
Certification | ISO9001 ISO13485 IATF16949 UL |
Place of Origin | China or Cambodia |
MOQ: 1
Price: Customized products
Payment Terms | TT,Paypal |
Delivery Time | 5-7days after all components kitted |
Packaging Details | By ESD bags and carton |
Material | FR4(TG130-T180),Rogers,Aluminum |
Thickness | 0.5mm-4.5mm |
Layer | 1L-32L |
Copper | 0.3OZ-10OZ |
Solder Type | Lead or Lead-free |
Hole plating | >25um |
Min Hole | 0.1mm |
Brand Name | Suntek/BLSuntek |
Model Number | F016-030 |
Certification | ISO9001 ISO13485 IATF16949 UL |
Place of Origin | China or Cambodia |
MOQ: 5pcs
Price: Based on Gerber
Payment Terms | T/T,Paypal |
Supply Ability | 100pcs/hour |
Delivery Time | 1-2 weeks after all parts collected |
Packaging Details | 60*40*30cm cartons and ESD bags |
Base Material | Fr4,Rogers,Getek,Halogen free,Low Dk/Low Df |
Build-up Material | RCC,FR4 |
Max Layer | 38L |
Min Hole mm(mil) | 0.2(8) |
Min Land mm(mil) | 0.4(16) |
Min IVH Hole/Land Size um(mil) | 150/300(6/12) |
Laser Hole Filling | Yes |
Max Copper Thickness | 8OZ |
Surface Finish | ENIG/OSP/HASL/Au Plating/Immersion Tin |
Brand Name | Suntek |
Model Number | F56652 |
Certification | ISO9001, ISO13485, TS16949 and UL E476377 |
Place of Origin | China/Cambodia |
MOQ: 5pcs
Price: Based on Gerber
Payment Terms | T/T,Paypal |
Supply Ability | 100pcs/hour |
Delivery Time | 1-2 weeks after all parts collected |
Packaging Details | 60*40*30cm cartons and ESD bags |
Base Material | Fr4,Rogers,Getek,Halogen free,Low Dk/Low Df |
Build-up Material | RCC,FR4 |
Max Layer | 38L |
Min Hole mm(mil) | 0.2(8) |
Min Land mm(mil) | 0.4(16) |
Min IVH Hole/Land Size um(mil) | 150/300(6/12) |
Laser Hole Filling | Yes |
Max Copper Thickness | 8OZ |
Surface Finish | ENIG/OSP/HASL/Au Plating/Immersion Tin |
Brand Name | Suntek |
Model Number | F56652 |
Certification | ISO9001, ISO13485, TS16949 and UL E476377 |
Place of Origin | China/Cambodia |
MOQ: 5pcs
Price: Based on BOM list
Payment Terms | T/T,Paypal |
Supply Ability | 100pcs/hour |
Delivery Time | 1 week after all components collected |
Packaging Details | Vacuum,Anti-static,ESD,Cartons |
Quality Standard | IPC Class 2 Or 3 |
Line Width | >4mil,normal |
Impedance Control: | 50/90/100±10% Ohm |
Layer Count | 8 |
Categary | Security PCBA |
Service | One-stop Quick Turnkey Service |
Minimum Hole Diameter | 0.10 Mm |
Application | Communication,Automotive,Security,Medical,LED,Consumer electronics. |
Brand Name | Suntek |
Model Number | F165P |
Certification | ISO9001, ISO13485, TS16949 and UL E476377 |
Place of Origin | China/Cambodia |
MOQ: 5pcs
Price: Based on Gerber
Payment Terms | T/T,Paypal |
Supply Ability | 100pcs/hour |
Delivery Time | 1-2 weeks after all parts collected |
Packaging Details | 60*40*30cm cartons and ESD bags |
Base Material | Fr4,Rogers,Getek,Halogen free,Low Dk/Low Df |
Build-up Material | RCC,FR4 |
Max Layer | 38L |
Min Hole mm(mil) | 0.2(8) |
Min Land mm(mil) | 0.4(16) |
Min IVH Hole/Land Size um(mil) | 150/300(6/12) |
Laser Hole Filling | Yes |
Max Copper Thickness | 8OZ |
Surface Finish | ENIG/OSP/HASL/Au Plating/Immersion Tin |
Brand Name | Suntek |
Model Number | F56652 |
Certification | ISO9001, ISO13485, TS16949 and UL E476377 |
Place of Origin | China/Cambodia |
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