Chongqing Zhongshun Microelectronics Co., Ltd
| Size | Supports rapid sample customization |
| Intermediate layer | No intermediate layer |
| Number of stacked layers | 1 |
| Chip layout | Placed on the same substrate plane |
| Type | 2D planar SiP |
| TSV | No TSV |
| Model Number | 2D planar SiP |
| Brand Name | Chippack |
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Product Specification
| Size | Supports rapid sample customization | Intermediate layer | No intermediate layer |
| Number of stacked layers | 1 | Chip layout | Placed on the same substrate plane |
| Type | 2D planar SiP | TSV | No TSV |
| Model Number | 2D planar SiP | Brand Name | Chippack |
| High Light | 2D plane SiP packaging ，concise SiP technical architecture ，highly implementable SiP design | ||
The overall technical architecture of the 2D ‑ plane SiP is concise and highly implementable
1. Technical Features:
- Mature and stable process with controllable mass‑production costs. Compared with 2.5D and 3D stacked SiP, 2D planar SiP does not require complex processes such as through‑silicon vias and vertical stacking. It can be manufactured using mature traditional semiconductor packaging processes, featuring high process fault tolerance and stable yield. Meanwhile, it streamlines production workflows, shortens product iteration cycles, greatly cuts R&D and mass‑production costs, and delivers outstanding cost‑performance advantages. Suitable for large‑scale mass production, it serves as a preferred packaging solution for consumer electronics and general industrial control applications.
- Excellent electrical performance and stable signal transmission. All components are arranged laterally on the substrate plane, creating short and regular signal transmission paths. This effectively reduces parasitic effects including parasitic capacitance and parasitic resistance, mitigates signal attenuation and crosstalk, and provides good electromagnetic interference suppression. It can meet the transmission requirements for high‑frequency and high‑speed signals without additional complex shielding designs. It fits scenarios with strict signal‑integrity requirements such as radio frequency and wireless communication, while ensuring stable equipment operation.
- High integration flexibility for heterogeneous integration. It supports the monolithic integration of heterogeneous chips and components with diverse processes and functions. Main control chips, memory chips, radio‑frequency chips, sensors and various passive resistive, capacitive and inductive components can be integrated inside a single package, breaking the functional limitations of a single chip. It shows remarkable advantages in design scenarios requiring few chips yet multi‑function integration. Components can be freely combined according to functional requirements to achieve both miniaturization and functional completeness. It can reduce footprint by approximately 70 % compared with conventional discrete PCB solutions.
2. Application Fields:
Leveraging its mature processes, reliable performance and high cost‑performance, 2D planar SiP addresses the demands for lightweight, miniaturized and short‑cycle products across multiple industries. It covers key sectors including consumer electronics, automotive electronics, industrial control, medical devices and the Internet of Things.
3. Personalized Customization Services:
Custom modules can be produced in a tailor‑made manner to satisfy client requirements, delivering customized products that match clients’ specific needs.
Company Details
Business Type:
Manufacturer
Year Established:
2018 Year
Employee Number:
200~300
Ecer Certification：
Verified Supplier
Chongqing Zhongshun Microelectronics Co., Ltd., founded in 2018 and located in Dazu District, Chongqing, is a key science and innovation-based manufacturing enterprise cultivated by the local government. Focusing on semiconductor packaging and testing, MEMS micro-electromechanical devices, as well a... Chongqing Zhongshun Microelectronics Co., Ltd., founded in 2018 and located in Dazu District, Chongqing, is a key science and innovation-based manufacturing enterprise cultivated by the local government. Focusing on semiconductor packaging and testing, MEMS micro-electromechanical devices, as well a...
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