Stacked die SiP supports the integration of various types of dies such as memory

Product Specification

Stacked die SiP supports the integration of various types of dies such as memory and power dies

1. Technical Features:

- 3D Heterogeneous Integration for Maximized Integration Density. Stacked‑die SiP abandons the conventional two‑dimensional planar chip packaging mode. Through vertical stacking processes, bare dies of different processes and functions including logic dies, memory dies, RF dies and sensor dies are integrally assembled within a single package, breaking the functional limitations of single‑chip solutions. Without relying on a single‑wafer process to integrate various devices, it enables seamless integration of heterogeneous chips for digital, analog, power, sensing and other functions. It greatly reduces the overall module size. Compared with traditional PCB‑level integration solutions, the total volume can be reduced by more than 30%, perfectly matching the space requirements of miniaturized equipment.

- High‑speed and Low‑loss Interconnection for Dual Optimization of Performance and Power Consumption. This technology adopts advanced interconnection processes such as TSV (Through‑Silicon Via), hybrid bonding and ultra‑fine wire bonding. It shortens the signal transmission path between bare dies from the centimeter scale of conventional PCB wiring to the micrometer scale inside the package, greatly reducing signal transmission delay, crosstalk as well as parasitic capacitance and resistance losses. It effectively improves the transmission stability of high‑frequency signals and mitigates electromagnetic interference, while lowering power consumption for inter‑chip data transmission. In high‑speed computing and high‑frequency communication scenarios, it delivers superior performance versus traditional packaging solutions and meets operating requirements for high bandwidth and low latency.

- Low‑cost and Short‑cycle Development to Meet Fragmented Demands. Unlike SoC chips that require complex full‑process wafer design and tape‑out, stacked‑die SiP directly stacks and integrates mature commercial bare dies, significantly cutting down non‑recurring engineering costs for chip development. Meanwhile, the modular stacking architecture offers high flexibility. Chip selection, stacking layers and interconnection schemes can all be adjusted on demand, which greatly shortens R&D and iteration cycles. It can rapidly respond to diverse and fragmented market product requirements, balancing high‑end performance and mass‑production cost‑effectiveness.

2. Application Fields:

Applied in consumer electronics, communications and radio frequency, industrial and automotive electronics, medical and precision electronics and other fields.

3. Personalized Customization Services:

Custom modules can be produced according to client requirements to deliver tailor‑made products that satisfy client needs.