SiP ( System ‑ in ‑ Package ) includes 2D planar SiP , stacked ‑ die SiP , 2.5D

Product Specification

SiP ( System ‑ in ‑ Package ) includes 2D planar SiP , stacked ‑ die SiP , 2.5D SiP and 3D SiP

SiP (System‑in‑Package) is a core packaging technology that integrates multiple functional chips and components within a single package. According to structural dimensions, it can be categorized into 2D planar SiP, die‑stacked SiP, 2.5D SiP and 3D SiP.

1. Technical Characteristics:

- 2D planar SiP is the most fundamental planar‑level packaging structure. All chips and passive components are laid out flat on the surface of a single packaging substrate without vertical stacking structures, forming an overall two‑dimensional planar package. This technology features a highly mature structure, stable yield, short packaging process cycle, straightforward component layout and low rework difficulty. Nevertheless, limited by planar space, it supports only a finite number of integrated chips with relatively long routing lengths, comparatively high signal transmission latency, and moderate integration density and miniaturization capability.

- Die‑stacked SiP introduces a vertical stacking dimension on the basis of 2D planar SiP. Its core is to stack and combine multiple bare dies through vertical stacking, bonding or flip‑chip processes, alongside planar component layout to create a hybrid "planar plus simple vertical" structure. This technology greatly improves packaging space utilization, effectively reduces the overall package footprint and achieves preliminary miniaturization. Vertical chip interconnections shorten partial signal paths and further boost transmission efficiency.

- 2.5D SiP is a transitional multi‑dimensional packaging structure. Its key feature is the addition of dedicated interconnection media such as silicon interposers and glass interposers between the substrate and functional chips. Chips are mounted on top of the interposer in planar arrangement or with limited stacking. Multi‑chip interconnection is realized via high‑precision routing on the interposer, without full vertical through‑stacking of chips.

- 3D SiP adopts a full three‑dimensional vertical stacking architecture. It delivers three‑dimensional integration of chips, interposers and substrates through chip‑level vertical through‑interconnection and multi‑layer heterogeneous stacking, enabling simultaneous multi‑layer vertical stacking and high‑density interconnection.

2. Application Fields:

It is applied in scenarios including general consumer electronics, basic industrial equipment, consumer electronics and portable devices, automotive intelligent driving assistance, high‑precision industrial inspection equipment, high‑end cutting‑edge technologies and ultra‑precision electronics. Each technology precisely matches the hierarchical requirements of different industries.

3. Personalized Customization Services:

Custom modules can be produced on demand according to client requirements to deliver tailor‑made products that meet clients’ specific needs.