3D SiP can customize differentiated 3D stacking architectures according to

Product Specification

3D SiP can customize differentiated 3D stacking architectures according to customer requirements

1. Technical Features:

- Ultra-high 3D heterogeneous integration density. Adopting a vertical stacking architecture, 3D SiP leverages advanced processes such as TSV (Through-Silicon Via), hybrid bonding and PoP stacking to break the spatial limitations of traditional 2D planar packaging. It enables vertical stacking of logic chips, memory chips, MEMS sensors, radio frequency devices and various passive components, realizing heterogeneous integration of chips with different manufacturing processes and diverse functions. Compared with conventional packaging, it drastically reduces packaging size and PCB footprint, delivers complete system-level functions within an extremely compact space, and perfectly meets the trend toward miniaturization and microminiaturization of electronic equipment.

- High-speed and low-loss interconnection with prominent performance advantages. Replacing long inter-chip wiring and PCB traces in traditional solutions with short vertical interconnections, this technology greatly shortens signal transmission paths and effectively reduces signal latency, crosstalk and transmission loss. Combined with high-density micro-wiring and interposer interconnection structures, it supports ultra-high-bandwidth data exchange between chips and significantly improves system computing and data processing efficiency. It achieves notably better stability than traditional packaging solutions in high-frequency and high-speed computing scenarios, well catering to high-performance demands including AI computing power and high-speed communications.

- High reliability and strong environmental adaptability. 3D SiP supports integrated hermetic packaging featuring a compact internal structure and robust protection, which can effectively resist interferences from complex operating conditions such as alternating high and low temperatures, humidity, vibration and salt spray. Furthermore, optimized stacking structures and thermal management designs mitigate heat dissipation challenges caused by multi-chip integration, lower the operating temperature rise of chips and reduce component failure rates. With long service life and stable operation, it satisfies strict reliability requirements for high-end scenarios such as advanced industrial equipment, aerospace and low-altitude vehicles.

2. Application Fields:

Benefiting from outstanding performance, 3D SiP is widely applied in consumer electronics, communications and computing power, aerospace and low-altitude economy, high-end medical treatment and industrial detection, automotive electronics and other sectors.

3. Personalized Customization Services:

Custom modules can be produced on demand to deliver tailor-made products matching customers' specific requirements.