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Original ICs Component Co Ltd

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System On Chip (SoC)

Manufacturer of a wide range of products which include LC89058WA-E,TDA7464$,10AS022E3F29E2LG,etc

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Description IC DEMODULATOR 64SQFP
Category Integrated Circuits (ICs)Audio Special Purpose
Function Demodulator
Product Status Obsolete
Mounting Type Surface Mount
Package Tray
Specifications 32kHz ~ 192kHz
Series -
Mfr onsemi
Supplier Device Package 64-SPQFP (10x10), 64-SQFP
Applications Audio Systems
Operating Temperature -30°C ~ 70°C (TA)
Number of Channels 1
Package / Case 64-LQFP
Interface I²S
Voltage - Supply 3V ~ 3.6V
Base Product Number LC890

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Category Integrated Circuits (ICs) Audio Special Purpose
Function Audio Tone Processor
Product Status Obsolete
Mounting Type Surface Mount
Package Tray
Specifications Audio Matrix
Series -
Mfr STMicroelectronics
Supplier Device Package 44-TQFP (10x10)
Applications Signal Mixing
Operating Temperature -10°C ~ 85°C (TA)
Number of Channels 2
Package / Case 44-LQFP
Interface I²C
Voltage - Supply 7V ~ 10.2V
Base Product Number TDA7464
Description IC AUDIO TONE PROCESSOR 44TQFP

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Quality 10AS022E3F29E2LG for sale

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Category Integrated Circuits (ICs) Embedded System On Chip (SoC)
Product Status Active
Peripherals DMA, POR, WDT
Primary Attributes FPGA - 220K Logic Elements
Series Arria 10 SX
Package Tray
Mfr Intel
Supplier Device Package 780-FBGA, FC (29x29)
Connectivity EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Operating Temperature 0°C ~ 100°C (TJ)
Architecture MCU, FPGA
Package / Case 780-BBGA, FCBGA
Number of I/O 288
RAM Size 256KB
Speed 1.5GHz
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size -
Description IC SOC CORTEX-A9 1.5GHZ 780FBGA

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Category Integrated Circuits (ICs) Embedded System On Chip (SoC)
Base Product Number M2S050
Product Status Active
Peripherals DDR, PCIe, SERDES
Primary Attributes FPGA - 50K Logic Modules
Series SmartFusion®2
Package Tray
Mfr Microchip Technology
Supplier Device Package 400-VFBGA (17x17)
Connectivity CANbus, Ethernet, I²C, SPI, UART/USART, USB
Operating Temperature -40°C ~ 100°C (TJ)
Architecture MCU, FPGA
Package / Case 400-LFBGA
Number of I/O 207
RAM Size 64KB
Speed 166MHz
Core Processor ARM® Cortex®-M3
Flash Size 256KB
Description IC SOC CORTEX-M3 166MHZ 400VFBGA

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Category Integrated Circuits (ICs) Embedded System On Chip (SoC)
Base Product Number M2S050
Product Status Active
Peripherals DDR, PCIe, SERDES
Primary Attributes FPGA - 50K Logic Modules
Series SmartFusion®2
Package Tray
Mfr Microchip Technology
Supplier Device Package 400-VFBGA (17x17)
Connectivity CANbus, Ethernet, I²C, SPI, UART/USART, USB
Operating Temperature 0°C ~ 85°C (TJ)
Architecture MCU, FPGA
Package / Case 400-LFBGA
Number of I/O 207
RAM Size 64KB
Speed 166MHz
Core Processor ARM® Cortex®-M3
Flash Size 256KB
Description IC SOC CORTEX-M3 166MHZ 400VFBGA

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Category Integrated Circuits (ICs) Embedded System On Chip (SoC)
Product Status Active
Peripherals DMA, POR, WDT
Primary Attributes FPGA - 660K Logic Elements
Series Arria 10 SX
Package Tray
Mfr Intel
Supplier Device Package 1152-FBGA, FC (35x35)
Connectivity EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Operating Temperature 0°C ~ 100°C (TJ)
Architecture MCU, FPGA
Package / Case 1152-BBGA, FCBGA
Number of I/O 492
RAM Size 256KB
Speed 1.5GHz
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size -
Description IC SOC CORTEX-A9 1.5GHZ 1152FBGA

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Category Integrated Circuits (ICs) Embedded System On Chip (SoC)
Product Status Active
Peripherals DDR, DMA, PCIe
Primary Attributes Versal™ AI Core FPGA, 1.5M Logic Cells
Series Versal™ AI Core
Package Tray
Mfr AMD
Supplier Device Package 2197-FCBGA (45x45)
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Operating Temperature -40°C ~ 100°C (TJ)
Architecture MPU, FPGA
Package / Case 2197-BFBGA, FCBGA
Number of I/O 770
RAM Size 256KB
Speed 600MHz, 1.4GHz
Core Processor Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Flash Size -
Description IC VERSAL AICORE FPGA 2197BGA

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Category Integrated Circuits (ICs) Embedded System On Chip (SoC)
Product Status Active
Peripherals DMA, PCI, PWM
Primary Attributes FPGA - 254K Logic Modules
Series PolarFire®
Package Tray
Mfr Microchip Technology
Supplier Device Package 536-LFBGA
Connectivity CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG
Operating Temperature 0°C ~ 100°C
Architecture MPU, FPGA
Package / Case 536-LFBGA, CSPBGA
Number of I/O MCU - 136, FPGA - 372
RAM Size 2.2MB
Speed -
Core Processor RISC-V
Flash Size 128kB
Description IC SOC RISC-V 536LFBGA

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Category Integrated Circuits (ICs) Embedded System On Chip (SoC)
Product Status Active
Peripherals DMA, POR, WDT
Primary Attributes FPGA - 350K Logic Elements
Series Arria V SX
Package Tray
Mfr Intel
Supplier Device Package 1517-FBGA, FC (40x40)
Connectivity EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Operating Temperature -40°C ~ 100°C (TJ)
Architecture MCU, FPGA
Package / Case 1517-BBGA, FCBGA
Number of I/O MCU - 208, FPGA - 540
RAM Size 64KB
Speed 800MHz
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Flash Size -
Description IC SOC CORTEX-A9 800MHZ 1517FBGA

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Category Integrated Circuits (ICs) Embedded System On Chip (SoC)
Product Status Discontinued at Digi-Key
Primary Attributes FPGA - 2800K Logic Elements
Series Stratix® 10 SX
Package Tray
Mfr Intel
Supplier Device Package 2397-FBGA, FC (50x50)
Connectivity EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Operating Temperature 0°C ~ 100°C (TJ)
Architecture MCU, FPGA
Package / Case 2397-BBGA, FCBGA
Peripherals DMA, WDT
RAM Size 256KB
Speed 1.5GHz
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Flash Size -
Description IC FPGA STRATIX 10 2397FBGA

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  • Fuhai Street, Baoan District, Shenzhen , Guangdong Province
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